A microelectronic device has bump bonds and an inductor on a die. The microelectronic device includes first lateral conductors extending along a terminal surface of the die, wherein at least some of the first lateral conductors contact at least some of terminals of the die. The microelectronic device also includes conductive columns on the first lateral conductors, extending perpendicularly from the terminal surface, and second lateral conductors on the conductive columns, opposite from the first lateral conductors, extending laterally in a plane parallel to the terminal surface. A first set of the first lateral conductors, the conductive columns, and the second lateral conductors provide the bump bonds of the microelectronic device. A second set of the first lateral conductors, the conductive columns, and the second lateral conductors are electrically coupled in series to form the inductor. Methods of forming the microelectronic device are also disclosed.

A multilayer resin substrate includes a stacked body, and a coil including a first coil conductor pattern and a second coil conductor pattern. The second coil conductor pattern includes a wide portion with a line width larger than a line width of the first coil conductor pattern. The wide portion includes overlapping portions that overlap with the first coil conductor pattern, and non-overlapping portions that do not overlap with the first coil conductor pattern, when viewed in a Z-axis direction. Adjacent non-overlapping portions in the Z-axis direction, when viewed in the Z-axis direction, protrude in opposite directions to each other in a radial direction, with respect to the first coil conductor pattern.

A manufacturing method of a coil component includes: forming a plating resist on an internal insulating layer; forming a coil pattern and a lead pattern connected to the coil pattern and at least partially having a thickness smaller than that of the coil pattern by plating; removing the plating resist; and stacking a magnetic sheet on the internal insulating layer to form a body.

A glass core device with a wiring pattern on a first surface of a glass core and a wiring pattern on a second surface thereof being electrically connected via a wiring pattern embedded in TGVs formed in the glass core. In a state of being cut out by dicing, each glass core has a second surface and side faces which are continuously covered with an outer protective layer.

Embodiments of the present application provides a MEMS solenoid inductor, including: a silicon substrate, a soft magnetic core, and a solenoid; wherein the soft magnetic core is wrapped inside the silicon substrate, the silicon substrate is provided with a spiral channel, the soft magnetic core passes through a center of the spiral channel, and the solenoid is disposed in the spiral channel. By disposing the soft magnetic core and the solenoid of the inductor inside the silicon substrate completely, the thickness of the silicon substrate is fully utilized, and the obtained inductor has a larger winding cross-sectional area and improved magnetic flux, which increases the inductance value of the inductor; at the same time, the silicon substrate plays a protective role on the soft magnetic core and the solenoid, the strength of the inductor is improved, and the good impact resistance is provided.

In an inductor component, an inductor wire is formed inside a main body. The inductor wire has a circular columnar body extending in the height direction. An end surface of the inductor wire at a first end in the wire extending direction serves as a first external terminal and is exposed at a first terminal surface of the main body. The first external terminal is exposed only at the first terminal surface. An end surface of the inductor wire at a second end in the wire extending direction serves as a second external terminal and is exposed at a second terminal surface of the main body. The second external terminal is exposed only at the second terminal surface.

A coil component includes a magnetic portion that includes metal particles and a resin material, a coil conductor embedded in the magnetic portion and having a core portion, and outer electrodes electrically connected to the coil conductor. The magnetic portion includes a magnetic outer coating and a magnetic base having a protrusion portion. The coil conductor is disposed on the magnetic base such that the protrusion portion is located in the core portion. The magnetic outer coating is disposed so as to cover the coil conductor, and the bottom surface of the magnetic base includes a recessed portion in an area opposite to the protrusion portion.

A system and method for providing and programming a programmable inductor is provided. The structure of the programmable inductor includes multiple turns, with programmable interconnects incorporated at various points around the turns to provide a desired isolation of the turns during programming. In an embodiment the programming may be controlled using the size of the vias, the number of vias, or the shapes of the interconnects.

A coil component includes a multilayer body in which a plurality of resin insulation layers is laminated, a spiral-shaped coil conductor layer disposed on main surface of one of the resin insulation layers, and a close contact layer disposed at interfaces between two of the resin insulation layers and not connected to the coil conductor layer. The close contact layer contains a metal having desired adhesion to the resin insulation layers.

The present disclosure relates to an electromagnetic induction film and a manufacturing method thereof, an electromagnetic induction panel and a manufacturing method thereof, and a touch display device. The method for manufacturing the electromagnetic induction film may include: arranging a plurality of first conductors in parallel along and spaced apart along a first direction on a substrate; arranging an insulating layer on the plurality of first conductors; arranging a plurality of second conductors in parallel and spaced apart along the first direction on the insulating layer; and electrically connecting head end areas of the first conductors to head end areas of the second conductors and electrically connecting tail end areas of the first conductors to tail end areas of the second conductors to form an electromagnetic induction coil spirally surrounding the insulating layer.