Patent classifications
H01F41/043
Coil component
The present disclosure provides a coil component including an element assembly containing a filler and a resin material, a coil portion composed of a coil conductor embedded in the element assembly, and a pair of outer electrodes electrically coupled to the coil conductor. A relatively thin first conductor layer and a relatively thick second conductor layer are stacked in the coil conductor.
IRON OXIDE NANOPARTICLE-BASED MAGNETIC INK FOR ADDITIVE MANUFACTURING
Embodiments of the present disclosure describe a magnetic substrate including a cured magnetic ink and a cured polymer resin, wherein the cured magnetic ink includes a plurality of functionalized magnetic iron oxide nanoparticles and wherein the magnetic substrate is a freestanding magnetic substrate.
COMPOSITE MAGNETIC MATERIAL AND INDUCTOR USING THE SAME
A magnetic material and an inductor capable of attaining both higher magnetic permeability and improved DC superposition characteristics. A composite magnetic material contains metal magnetic particles, in which the metal magnetic particles include first particles having a median diameter D.sub.50 of 1.3 .Math.m or more and 5.0 .Math.m or less (i.e., from 1.3 .Math.m to 5.0 .Math.m), and second particles having a median diameter D.sub.50 larger than the first particles. The first and second particles each include a core portion made of a metal magnetic material, and an insulating film provided on a surface of the core portion. The insulating film of the second particles has an average thickness of 40 nm or more and 100 nm or less (i.e., from 40 nm to 100 nm). The insulating film of the first particles has an average thickness smaller than that of the insulating film of the second particles.
Electronic component
An electronic component that has fewer cracks during production is provided. The electronic component includes an outer electrode on a multilayer body, which includes an inner glass layer, a magnetic material layer on top and bottom surfaces of the inner glass layer, and an outer glass layer on top and bottom surfaces of the magnetic material layer. The insulating layers of the inner glass layer and the outer glass layers contain a dielectric glass material that contains a glass material containing at least K, B, and Si, quartz, and alumina. The glass material content of each insulating layer of the inner glass layer ranges from approximately 60%-65% by weight, the quartz content of each insulating layer of the inner glass layer ranges from approximately 34%-37% by weight, and the alumina content of each insulating layer of the inner glass layer ranges from approximately 0.5%-4% by weight.
INTEGRATED HIGH VOLTAGE ELECTRONIC DEVICE WITH HIGH RELATIVE PERMITTIVITY LAYERS
A magnetic assembly includes a multilevel lamination or metallization structure with a core dielectric layer, dielectric stack layers, a high permittivity dielectric layer, and first and second patterned conductive features, the dielectric stack layers having a first relative permittivity, the high permittivity dielectric layer extends between and contacting the first patterned conductive feature and one of the dielectric stack layers or the core dielectric layer, the high permittivity dielectric layer has a second relative permittivity, and the second relative permittivity is at least 1.5 times the first relative permittivity to mitigate dielectric breakdown in isolation products.
COIL COMPONENT
A coil component including an element assembly that includes a magnetic portion and a coil-like conductor portion embedded in the magnetic portion and outer electrodes disposed on an outer surface of the element assembly, wherein the outer surface has a mounting surface parallel to the central axis of a coil, the magnetic portion includes a first portion, a second portion, and a third portion, the first portion and the third portion contain glass and ferrite and have ferrite contents of 40 percent by volume or more, the second portion contains glass and ferrite and has a ferrite content smaller than the ferrite contents in the first portion and the third portion, and each of the first portion and the third portion has a covered region that is covered with the outer electrode and an exposed region that is not covered with the outer electrode on the mounting surface.
Multilayer inductor component and method for manufacturing multilayer inductor component
A multilayer inductor component includes an element body that is an insulator and a coil in which a plurality of coil conductor layers that extend along planes in the element body are electrically connected to each other. Also, each of the coil conductor layers includes metal part and glass part, and the glass part include internal glass portion that is entirely included in the metal part.
MULTILAYER COIL COMPONENT
A multilayer coil component includes an element body made of a ferrite sintered body and a coil. The coil is configured with a plurality of internal conductors juxtaposed in the element body and electrically connected to one another. An average crystal grain size in a surface region of the element body is smaller than an average crystal grain size in a region between the internal conductors in the element body. A surface of the element body is covered with a layer made of an insulating material. The insulating material is not present among the crystal grains in the surface region of the element body.
INDUCTOR
A filter inductor for a power generation convertor; the filter inductor comprising a toroidal connector and a conductive winding having a first connector and a second connector positioned at each end of the winding, and wherein the conductive winding being formed from at least first and second winding segments which are connected to each other so as to form a continuous winding around the toroidal connector that extends form the first connector to the second connector.
SUBSTRATE ASSEMBLY WITH ENCAPSULATED MAGNETIC FEATURE
Apparatuses, systems and methods associated with a substrate assembly with an encapsulated magnetic feature for an inductor are disclosed herein. In embodiments, a substrate assembly may include a base substrate, a magnetic feature encapsulated within the base substrate, and a coil, wherein a portion of the coil extends through the magnetic feature. Other embodiments may be described and/or claimed.