A multilayer electrical component is disclosed, wherein the multilayer electrical component comprises: a plurality of magnetic layers stacked over one another, wherein each magnetic layer is made of a first magnetic material, and wherein for each magnetic layer, a trench is formed in the magnetic layer, the bottom surface of the trench being located higher than the bottom surface of the magnetic layer; a second material that is different from the first material is disposed in the trench in the magnetic layer; and a conductive layer is disposed over the trench for forming a conductive element of the electrical component.

Methods/structures of forming embedded inductor structures are described. Embodiments include forming a first interconnect structure on a dielectric material of a substrate, selectively forming a magnetic material on a surface of the first interconnect structure, forming an opening in the magnetic material, and forming a second interconnect structure in the opening. Build up layers are then formed on the magnetic material.

A method making a three-dimensional inductor, the method including: forming a plurality of vias in a substrate or a molding compound, wherein the vias are arranged with spacings among them; forming a metal layer having interconnects, wherein the interconnects of the metal layer connect the plurality of vias on one end of the vias; forming a plurality of wires to connect the plurality of vias on the other end of the vias to form the 3D inductor; and tuning one or more of the plurality of wires to adjust a physical configuration and inductance value of the 3D inductor.

A planar coil in the present disclosure includes a substrate that is composed of a ceramic(s) and includes a first surface, and a first metal layer that is positioned on the first surface and includes a void.

A multilayer inductor component includes an element body, an internal conductor, and an external electrode. The internal conductor is disposed in the element body. The external electrode is disposed on a surface of the element body and electrically connected to the internal conductor. The external electrode includes a sintered metal layer and a plating layer. The sintered metal layer is disposed on the surface of the element body. The plating layer covers the sintered metal layer. The sintered metal layer includes a thick portion and thin portions. The thick portion covers the surface of the element body. A plurality of glass particles is dispersed in the thick portion. The thin portions cover glass particles exposed on a surface of the thick portion among the plurality of glass particles and being in contact with the plating layer.

A method for manufacturing an antenna for a wireless power transfer system includes providing a first sheet of a conductive metal, the first sheet defining a first area for a coil of the antenna. The method includes applying an etch resistant coating on a coil area within the first area and laser cutting the first sheet within the coil area, based on a laser cutting path defining a first geometry for a first plurality of turns for a first layer of the coil, the first geometry configured for one or more of transmission of wireless power signals, receipt of wireless power signals, and combinations thereof. The method further includes substantially exposing the first sheet to an etching solution, the etching solution substantially removing first portions of the conductive metal from the substrate to define, at least, first turn gaps between at least two of the first plurality of turns.

A ferrite sintered body of the invention includes; a main component including 48.65 to 49.45 mol % of iron oxide in terms of Fe.sub.2O.sub.3, 2 to 16 mol % of copper oxide in terms of CuO, 28.00 to 33.00 mol % of zinc oxide in terms of ZnO, and a balance including nickel oxide, and a subcomponent including boron oxide in an amount of 5 to 100 ppm in terms of B.sub.2O.sub.3 with respect to 100 parts by weight of the main component, in which the ferrite sintered body includes crystal grains having an average crystal grain size of 2 to 30 μm.

A laminated coil component includes a multilayer body in which a coil, which is obtained by electrically connecting a plurality of coil conductors with a via conductor interposed therebetween, is provided in an inside of an insulator portion which is obtained by laminating a plurality of insulation layers. Each of a first coil conductor and a second coil conductor that are adjacent to each other in a lamination direction and are electrically connected in series with a first via conductor interposed therebetween includes a first main surface that faces the opposite direction to the lamination direction and on which a void exists. The second coil conductor includes a second main surface that faces the lamination direction and on which another void exists, and the other void locally exists on a position opposed to the first via conductor.

A multilayer inductor component includes an element body that is an insulator and a coil in which a plurality of coil conductor layers that extend along planes in the element body are electrically connected to each other. Also, each of the coil conductor layers includes metal part and glass part, and the glass part include internal glass portion that is entirely included in the metal part.

The disclosed technology generally relates to lithographically defined conductive lines for integrated circuit devices formed by plating, and more particularly to conductive lines shaped to reduce the magnitude of electric field in the electric field distributions around conductive lines of integrated and monolithic transformers and isolators.