A multilayer coil array includes an element body including a magnetic layer; first and second built-in coils; and first to fourth outer electrodes connected to the first and second coils. A non-magnetic layer is provided between the first and second coils. The first and second coils are each formed by a plurality of coil conductors being connected to each other. At least one out of a coil conductor of the first coil that is closest to the second coil among the plurality of coil conductors of the first coil and a coil conductor of the second coil that is closest to the first coil among the plurality of coil conductors of the second coil contacts the non-magnetic layer. The length of a coil conductor layer that contacts the non-magnetic layer of the coil conductor contacting the non-magnetic layer is different from the length of the other coil conductor layers.

A coil component is provided in which the insulation between coil conductor layers can be enhanced. The coil component includes an element body; and a coil provided in the element body and spirally wound along a first direction. The coil has a plurality of coil conductor layers stacked along the first direction. The element body has a first area between the coil conductor layers adjacent to each other along the first direction in the element body, and has a second area other than the first area. The first area has a pore area rate less than a pore area rate in at least a part of the second area.

An electronic component that has fewer cracks during production is provided. The electronic component includes an outer electrode on a multilayer body, which includes an inner glass layer, a magnetic material layer on top and bottom surfaces of the inner glass layer, and an outer glass layer on top and bottom surfaces of the magnetic material layer. The insulating layers of the inner glass layer and the outer glass layers contain a dielectric glass material that contains a glass material containing at least K, B, and Si, quartz, and alumina. The glass material content of each insulating layer of the inner glass layer ranges from approximately 60%-65% by weight, the quartz content of each insulating layer of the inner glass layer ranges from approximately 34%-37% by weight, and the alumina content of each insulating layer of the inner glass layer ranges from approximately 0.5%-4% by weight.

A laminated inductor component includes a multilayer body which includes a first side surface, a second side surface and a bottom surface, and in which a plurality of insulator layers is laminated in a lamination direction; a coil conductor in helical form including a plurality of coil conductor layers wound on the insulator layers, and having a coil length parallel to the lamination direction; a first outer conductor electrically connected to a first end of the coil conductor and exposed from the first side surface and the bottom surface in the multilayer body; and a second outer conductor electrically connected to a second end of the coil conductor and exposed from the second side surface and the bottom surface in the multilayer body. A width along the lamination direction of each of the first outer conductor and the second outer conductor is shorter than the coil length.

An inductor component includes an element body including insulating layers laminated on one another, and a coil conductor layer winding on a main surface of one of the insulating layers. The coil conductor layer contains sulfur.

A multilayer coil component 1 includes an element body 2, a coil 8, and a terminal electrode 4 and a terminal electrode 5. Each of the terminal electrode 4 and the terminal electrode 5 is disposed over at least the end surfaces 2a and 2b and a main surface 2d. Each of the terminal electrode 4 and the terminal electrode 5 and at least a part of the coil 8 overlap when viewed from the facing direction of the pair of side surfaces 2e and 2f. Each of the terminal electrode 4 and the terminal electrode 5 and the coil 8 do not overlap when viewed from the facing direction of the pair of end surfaces 2a and 2b.

A coil electronic component is provided, the coil electronic component including a body having a laminate structure formed of a plurality of conductor patterns disposed therein, and including an insulating layer disposed between the plurality of conductor patterns, and an external electrode disposed externally of the body. Portions of the plurality of conductor patterns include a coil pattern and a lead-out pattern connecting the coil pattern and the external electrode, the lead-out pattern includes a first metal layer and a second metal layer disposed on the first metal layer, and a pore density of the first metal layer is higher than a pore density of the second metal layer.

A method for manufacturing an antenna for a wireless power transfer system includes providing a first sheet of a conductive metal, the first sheet defining a first area for a coil of the antenna. The method includes applying an etch resistant coating on a coil area within the first area and laser cutting the first sheet within the coil area, based on a laser cutting path defining a first geometry for a first plurality of turns for a first layer of the coil, the first geometry configured for one or more of transmission of wireless power signals, receipt of wireless power signals, and combinations thereof. The method further includes substantially exposing the first sheet to an etching solution, the etching solution substantially removing first portions of the conductive metal from the substrate to define, at least, first turn gaps between at least two of the first plurality of turns.

A coil component includes an insulator part, a coil that is embedded in the insulator part and includes a plurality of coil conductor layers electrically connected together, and outer electrodes that are disposed on surfaces of the insulator part and are electrically connected to the coil. The insulator part includes a magnetic phase containing at least Fe, Ni, Zn, and Cu and a non-magnetic phase containing at least Si and Zn. A portion of the insulator part located between, of the coil conductor layers, adjacent coil conductor layers has a pore area percentage of 0.3% or more and 3.0% or less (i.e., from 0.3% to 3.0%). The portion of the insulator part located between the adjacent coil conductor layers includes crystal grains having an average crystal grain size of 0.2 μm or more and 0.8 μm or less (i.e., from 0.2 μm to 0.8 μm).

An electronic component includes an electronic component main body having a mounting surface with first and second baked electrodes located thereon at locations spaced apart from one another. A recess extends into the electronic component main body in the area between the first and second baked electrodes. The recess extends over at least a part of at least one of the first and second baked electrodes.