A coil electronic component includes a body having first and second surfaces opposing each other, and third and fourth surfaces connecting the first and second surfaces to each other and opposing each other, an insulating substrate disposed in the body and including an end portion having one side surface exposed externally of the body, first and second coil portions disposed on one surface and the other surface of the insulating substrate opposing each other, respectively, a first lead-out portion connected to the first coil portion, disposed on one surface of the insulating substrate, and exposed from the body, a second lead-out portion connected to the first coil portion, disposed on the other surface of the insulating substrate, and exposed from the body, and a direction indicator disposed on at least one of one surface and the other surface of the end portion opposing each other.

The invention provides an inductor (1) comprising at least one first conductive layer (4a) comprising at least one first turn (5) of conductive material and at least one second conductive layer (4b) comprising at least one second turn (5) of conductive material, at least one conductive bridge (7) connecting the first and second turns (5), a layer of insulating material (6a) being interposed at least partially between the first and second turns (5), the first and second turns (5) being at least partially superimposed in the stacking direction (Z) of said layers (4a, 4b, 6a), characterized in that, in the area of superimposition of said turns, the width (I1) of the section of the first turn (5, 4a) is greater than the width (I2) of the section of the second turn (5, 4b).

A technique for tuning a ladder-shaped inductor that achieves a finer tuning resolution by severing one or more shorts, skipping the severing of one or more shorts, and severing one or more subsequent shorts within the ladder-shaped inductor. This technique can be applied to a voltage-controlled oscillator using a differential or single-ended ladder-shaped inductor as part of the resonant circuit. Within an oscillator, such a technique provides for a more precise modulation of the effective inductance of the ladder-shaped inductor, which enables an improved tuning resolution of the operating frequency of the oscillator.

Disclosed is an electromagnetic coil system for use during transcranial or transdermal stimulation procedures, in which an electrically conductive coil wraps around a magnetic core at an oblique wrapping angle to provide a more directed focal spot size at a given depth inside of, for example, a patient's body. In certain configurations, the electrically conductive coil may be adjustable with respect to the magnetic core, such that the wrapping angle of the electrically conductive coil may be modified to, in turn, adjust the focal spot size of the induced electric field generated by the system as may desired to concentrate the field at a particularly desired location.

A method for applying AOI to copper coils thinned by laser etching includes placing a half-finished product under a scanning unit; scanning the half-finished product to generate an image; sending the image to an image analysis unit which is activated to analyze the image, identify cutting boundaries of the half-finished product, compare the cutting boundaries with an original processing path file, and identify defects of the half-finished product; activating the image analysis unit to find points around the half-finished product; activating the image analysis unit to simulate an optimum path; activating the image analysis unit to convert the optimum path into an optimum processing path file; activating the image analysis unit to send the optimum processing path file to a program unit; conveying the half-finished product to dispose under a laser processing unit; and activating the program unit to instruct the laser processing unit to process the half-finished product.

An inductive device includes an insulating layer, a lower magnetic layer, and an upper magnetic layer that are formed such that the insulating layer does not separate the lower magnetic layer and the upper magnetic layer at the outer edges or wings of the inductive device. The lower magnetic layer and the upper magnetic layer form a continuous magnetic layer around the insulating layer and the conductors of the inductive device. Magnetic leakage paths are provided by forming openings through the upper magnetic layer. The openings may be formed through the upper magnetic layer by semiconductor processes that have relatively higher precision and accuracy compared to semiconductor processes for forming the insulating layer such as spin coating. This reduces magnetic leakage path variation within the inductive device and from inductive device to inductive device.

A semiconductor device package may include a package substrate, mold material formed over the package substrate, and a mold-embedded inductor that is embedded in the mold material. The mold-embedded inductor may be coupled to a die, such as a power management integrated circuit die, which may also be embedded in the mold material. The mold-embedded inductor may be formed by forming conductive traces and an inductor core in the mold material. For example, an active mold packaging (AMP) process and corresponding laser direct structuring (LDS) processes may be performed to form openings in the mold material and to activate surfaces of the mold material to facilitate subsequent plating of conductive material. Activated surfaces of the mold material may have micro-rough texture and may include bulk conductive material formed via the application of laser energy to additives in the mold material during the LDS process(es).

A system and method for providing and programming a programmable inductor is provided. The structure of the programmable inductor includes multiple turns, with programmable interconnects incorporated at various points around the turns to provide a desired isolation of the turns during programming. In an embodiment the programming may be controlled using the size of the vias, the number of vias, or the shapes of the interconnects.

Disclosed herein is a method for manufacturing a planar coil, the method including forming a base conductive layer on a base material, the base conductive layer including: a coil wiring portion having one end, other end, and first to third connecting positions, the second connecting position being closer to the other end compared with the first connecting position, the third connecting position being closer to the one end compared with the second connecting position; a power-feed wiring portion that connects the first connecting position with an external power source; and a connection wiring portion that short-circuits the second connecting position and the third connecting position; forming a wiring conductive layer on the base conductive layer by electrolytic plating by feeding power from the external power source; and removing the power-feed wiring portion and the connection wiring portion.

Magnetic pastes which include a magnetic powder (A) and a binder resin (B), in which, in the particle diameter distribution of the component (A), the 10% particle diameter (D.sub.10) is 0.2 ?m or larger and 2.0 ?m or smaller, the 50% particle diameter (D.sub.50) is 2.0 ?m or larger and 4.3 ?m or smaller, and the 90% particle diameter (D.sub.90) is 4.3 ?m or larger and 8.5 ?m or smaller, suppress the magnetic powder from being unevenly distributed, and are useful for forming inductor elements and circuit boards.