Patent classifications
H01F41/045
PRINTED CIRCUIT BOARD
A printed circuit board includes: a substrate having a through-portion; a magnetic layer at least partially disposed in the through-portion and having a first through-hole; a first through-via layer disposed in the first through-hole; a first pattern layer disposed on an upper surface of the magnetic layer and covering at least a portion of an upper end of the first through-via layer; and a second pattern layer disposed on a lower surface of the magnetic layer and covering at least a portion of a lower end of the first through-via layer. The first through-via layer is in contact with a wall surface of the first through-hole, at least a portion of the first pattern layer is in contact with the upper surface of the magnetic layer, and at least a portion of the second pattern layer is in contact with the lower surface of the magnetic layer.
PROGRAMMABLE INDUCTOR AND METHODS OF MANUFACTURE
A system and method for providing and programming a programmable inductor is provided. The structure of the programmable inductor includes multiple turns, with programmable interconnects incorporated at various points around the turns to provide a desired isolation of the turns during programming. In an embodiment the programming may be controlled using the size of the vias, the number of vias, or the shapes of the interconnects.
Magnetic inlay with an adjustable inductance value for a component carrier and a manufacturing method
A magnetic inlay for a component carrier includes a magnetic matrix and an electrically conductive structure embedded horizontally in the magnetic matrix. The electrically conductive structure is configured as an inductive element. The magnetic inlay is configured so that, depending on the geometrical properties of the electrically conductive structure, a specific inductance value is provided for the magnetic inlay.