A manufacturing method of a thin-film power inductor includes: Alloy powder is mixed with plasticizer, adhesive, curing agent, dispersing agent and organic solvent to form slurry; the slurry is applied on a PET film, and drying to form a magnetic band; and the magnetic band is cut to form a plurality of magnetic sheets. A hole is opened on a magnetic sheet to form a hole-shaped magnetic sheet. Electrodes are processed on an insulating substrate to form a coil layer. Magnetic sheets, hole-shaped magnetic sheets, and the coil layer are stacked to form a block. The block is pressed, and the block is cut to form an individual product. The individual product is baked to form a main body. Silver paste is applied on the main body to form outer electrodes. A nickel layer and a tin layer are electroplated on outer electrodes to form a thin-film power inductor.

A layered electronic component includes a multilayer body having a metallic magnetic material layer including metallic magnetic material particles and a coil being built in the multilayer body. The coil is formed of multiple conductor patterns spirally connected each other and stacked along an axis direction of the coil, and the multilayer body includes a nonmagnetic ferrite part arranged at least an inner area of the coil when viewed from a winding axis direction of the coil.

Embodiments may include inductors with embedded magnetic cores and methods of making such inductors. In an embodiment, an integrated circuit package may include an integrated circuit die with a multi-phase voltage regulator electrically coupled to the integrated circuit die. In such embodiments, the multi-phase voltage regulator may include a substrate core and a plurality of inductors. The inductors may include a conductive through-hole disposed through the substrate core and a plugging layer comprising a dielectric material surrounding the conductive through-hole. In an embodiment, a magnetic sheath is formed around the plugging layer. In an embodiment, the magnetic sheath is separated from the plated through hole by the plugging layer. Additionally, a first layer comprising a dielectric material may be disposed over a first surface of the magnetic sheath, and a second layer comprising a dielectric material may be disposed over a second surface of the magnetic sheath.

Methods and apparatus for inductor and transformer semiconductor devices using hybrid bonding technology are disclosed. An example semiconductor device includes a first standoff substrate; a second standoff substrate adjacent the first standoff substrate; and a conductive layer adjacent at least one of the first standoff substrate or the second standoff substrate.

A method of manufacturing a power semiconductor system includes providing a power module having one or more power transistor dies and attaching an inductor module to the power module such that the inductor module is electrically connected to a node of the power module. The inductor module includes a substrate with a magnetic material and windings at one or more sides of the substrate. Further methods of manufacturing power semiconductor systems and methods of manufacturing inductor modules are also described.

In a described example, an integrated circuit includes: a semiconductor substrate having a first surface and an opposite second surface; at least one dielectric layer overlying the first surface of the semiconductor substrate; at least one inductor coil in the at least one dielectric layer with a plurality of coil windings separated by coil spaces, the at least one inductor coil lying in a plane oriented in a first direction parallel to the first surface of the semiconductor substrate, the at least one inductor coil electrically isolated from the semiconductor substrate by a portion of the at least one dielectric layer; and trenches extending into the semiconductor substrate in a second direction at an angle with respect to the first direction, the trenches underlying the inductor coil and filled with dielectric replacement material.

A microelectronics package comprising a package core and an inductor over the package core. The inductor comprises a dielectric over the package core. The dielectric comprises a curved surface opposite the package core. At least one conductive trace is adjacent to the package core. The at least one conductive trace is at least partially embedded within the dielectric and extends over the package core. A magnetic core cladding is over the dielectric layer and at least partially surrounding the conductive trace.

A coil electronic component includes a body, in which a coil portion is embedded, including a plurality of magnetic particles, and an external electrode connected to the coil portion. Among the plurality of magnetic particles, at least a portion of magnetic particles include a first layer, disposed on a surface of a magnetic particle among the magnetic particles, and a second layer disposed on a surface of the first layer. The first layer is an inorganic coating layer containing a phosphorus (P) component, and the second layer is an atomic layer deposition layer.

Disclosed herein are high-permeability magnetic thin films for coaxial metal inductor loop structures formed in through glass vias of a glass core package substrate, and related methods, devices, and systems. Exemplary coaxial metal inductor loop structures include a high-permeability magnetic layer within and on a surface of a through glass via extending through the glass core package substrate and a conductive layer on the high-permeability magnetic layer.

A system includes a magnetic material supply for regulating a magnetic material flow rate of a magnetic material and a binder material supply for regulating a binder material flow rate of a binder material. A nozzle is configured for depositing a deposition mixture of the magnetic material and the binder material on a surface and a preheater is configured to preheat the deposition mixture before depositing on the surface. A controller is in operative communication with the magnetic material supply, the binder material supply, and the preheater. The controller is configured to receive an inductor core design file that represents a geometry and a magnetic permeability distribution of an inductor core, move the nozzle to one or more deposition locations, and adjust the magnetic material flow rate to the binder material flow rate to achieve a deposition mixture having a desired magnetic permeability at the deposition locations.