A power transformer includes at least two first windings, at least two second windings interleaved with the at least two first windings, and a magnetic core. The at least two first windings and the at least two second windings are positioned adjacent the magnetic core. Each first winding includes a wire and a plurality of turns. One or more windings of the at least two first windings include a bonding material and at least two adjacent turns of said plurality of turns adhered to each other via the bonding material. Other example power transformers, methods of manufacturing power transformers, and methods of manufacturing windings are also disclosed.

A winding structure includes a coil having a wire wrap and two wire tails, and a magnetic core having a center column, a flange, four wire-hanging parts and two bosses; the center column is connected at a top surface of the flange, the first boss is disposed in the middle of a first side of the flange, and the second boss is symmetrical to the first boss; transition surfaces of wire-hanging parts to a bottom surface of the flange are chamfered surfaces; first to fourth sections of the first wire tail are sequentially attached to the first wire-hanging part and the first chamfered surface, the bottom surface of the flange, the third chamfered surface, the third wire-hanging part, and the top surface of the flange; first to fourth sections of the second wire tail are symmetrical to first to fourth sections of the first wire tail, respectively.

A winding structure includes a coil having a wire wrap and two wire tails, and a magnetic core having a center column, a flange, four wire-hanging parts and two bosses; the center column is connected at a top surface of the flange, the first boss is disposed in the middle of a first side of the flange, and the second boss is symmetrical to the first boss; transition surfaces of wire-hanging parts to a bottom surface of the flange are chamfered surfaces; first to fourth sections of the first wire tail are sequentially attached to the first wire-hanging part and the first chamfered surface, the bottom surface of the flange, the third chamfered surface, the third wire-hanging part, and the top surface of the flange; first to fourth sections of the second wire tail are symmetrical to first to fourth sections of the first wire tail, respectively.

The invention provides a method and a device for producing a winding element from a supplied wire, in particular from a round copper wire, said method and device allowing the economical and flexible production of a winding element which, when subsequently used in the field of electrical engineering as a coil or inductor fitted in a stator, ensures the highest possible groove filling factor. For this purpose, the wire is wound to a three-dimensional shape and the cross section of the wire is changed simultaneously, as a result of which separate method steps and therefore tool arrangements for three-dimensional winding of the wire as well as the change of the cross-section of the wire can advantageously be dispensed with.

The invention provides a method and a device for producing a winding element from a supplied wire, in particular from a round copper wire, said method and device allowing the economical and flexible production of a winding element which, when subsequently used in the field of electrical engineering as a coil or inductor fitted in a stator, ensures the highest possible groove filling factor. For this purpose, the wire is wound to a three-dimensional shape and the cross section of the wire is changed simultaneously, as a result of which separate method steps and therefore tool arrangements for three-dimensional winding of the wire as well as the change of the cross-section of the wire can advantageously be dispensed with.

A method of making a semiconductor device, includes: forming a first molding layer on a substrate; forming a first plurality of vias in the first molding layer; forming a first conductive line over the first molding layer, wherein the first conductive line is laterally disposed over the first molding layer and a first end of the conductive line aligns with and is electrically coupled to a first via of the first plurality of vias; forming a second molding layer above the first molding layer; and forming a second plurality of vias in the second molding layer, wherein a second via of the second plurality of vias aligns with and is electrically coupled to a second end of the conductive line, and wherein the second plurality of vias, the conductive line, and the first plurality of vias are electrically coupled to one another.

A method of making a semiconductor device, includes: forming a first molding layer on a substrate; forming a first plurality of vias in the first molding layer; forming a first conductive line over the first molding layer, wherein the first conductive line is laterally disposed over the first molding layer and a first end of the conductive line aligns with and is electrically coupled to a first via of the first plurality of vias; forming a second molding layer above the first molding layer; and forming a second plurality of vias in the second molding layer, wherein a second via of the second plurality of vias aligns with and is electrically coupled to a second end of the conductive line, and wherein the second plurality of vias, the conductive line, and the first plurality of vias are electrically coupled to one another.

An inductor includes a body including a magnetic body having a coil embedded therein and containing magnetic powder. The coil has a winding portion in which a conductive wire is wound around and has a pair of lead portions taken out from the winding portion. The inductor also includes a pair of outer electrodes formed on the body. In the inductor, each of the lead portions is exposed from at least one side surface of the magnetic body and is coupled to a corresponding outer electrode. In addition, with respect to a position at which each of the lead portions is exposed from the at least one side surface of the magnetic body, a magnetic powder content in a region closer to one of the principal surfaces is higher than a magnetic powder content in a region closer to the other one of the principal surfaces.

An inductor includes a body including a magnetic body having a coil embedded therein and containing magnetic powder. The coil has a winding portion in which a conductive wire is wound around and has a pair of lead portions taken out from the winding portion. The inductor also includes a pair of outer electrodes formed on the body. In the inductor, each of the lead portions is exposed from at least one side surface of the magnetic body and is coupled to a corresponding outer electrode. In addition, with respect to a position at which each of the lead portions is exposed from the at least one side surface of the magnetic body, a magnetic powder content in a region closer to one of the principal surfaces is higher than a magnetic powder content in a region closer to the other one of the principal surfaces.

A method is provided for manufacturing a transformer. The method includes preparing a core, a first coil portion that covers at least part of the core, and a second coil portion that covers a periphery of the first coil portion perpendicular to a central axis of winding of the first coil portion. The first and second coil portions each include a bobbin and a coil wound therearound. The coil of the first or second coil portion is an edgewise coil. The method also includes: screwing the bobbin and coil of the first coil portion with each other, and screwing the bobbin and coil of the second coil portion with each other; and attaching the second coil portion to the outside of the first coil portion perpendicular to the central axis of winding of the first coil portion, and attaching the core to sandwich the first and second coil portions in an axial direction of the first coil portion.