A method to form an electrical component, comprising: overlaying a conductive and adhesive layer on a body and covering a first portion of a terminal part of a conductive element, wherein a second portion of the terminal part of the conductive element is not covered by the conductive and adhesive layer; and overlaying at least one metal layer on the conductive and adhesive layer and covering the second portion of the terminal part of the conductive element, wherein the at least one metal layer is electrically connected to the second portion of the terminal part of the conductive element for electrically connecting with an external circuit.

An electro-magnetic device is provided, including a first winding set of nested windings, and a second winding set of nested windings positioned adjacent to the first winding set. A method of making an electro-magnetic device including a first winding set of nested windings, and a second winding set of nested windings positioned adjacent to the first winding set is also provided.

An electro-magnetic device is provided, including a first winding set of nested windings, and a second winding set of nested windings positioned adjacent to the first winding set. A method of making an electro-magnetic device including a first winding set of nested windings, and a second winding set of nested windings positioned adjacent to the first winding set is also provided.

A coating layer is formed on a coil made of an insulated conductive wire comprising a metal wire and an insulating layer encapsulating the metal layer, wherein the coating layer encapsulates at least one portion of the insulating layer of the insulated conductive wire so that a terminal part of the metal wire exposed from the insulating layer can be positioned firmly while going through an automatic soldering process for electrically connecting with an external circuit.

A coating layer is formed on a coil made of an insulated conductive wire comprising a metal wire and an insulating layer encapsulating the metal layer, wherein the coating layer encapsulates at least one portion of the insulating layer of the insulated conductive wire so that a terminal part of the metal wire exposed from the insulating layer can be positioned firmly while going through an automatic soldering process for electrically connecting with an external circuit.

In many cases after degaussing the field distribution in a magnetic material there may be regions within the magnetic material that have ordered domains that contribute a remnant field. There is the need to reduce or eliminate non-uniform fields within a volume of interest left after degaussing a magnetic shield. Degaussing coils surrounding a metal shield can be used to favorably order magnetic domains within the material to counteract the remnant fields left behind following imperfect degaussing. The remnant field value can be measured and a small current may be applied through the degaussing coils. After removing the current, the field can be measured again and a higher current may be applied again through the coils. Repeated applications of currents and field measurement will progressively order domains in the direction of the applied field, resulting in a reduction of the net field and lower field gradient across the volume of interest.

In many cases after degaussing the field distribution in a magnetic material there may be regions within the magnetic material that have ordered domains that contribute a remnant field. There is the need to reduce or eliminate non-uniform fields within a volume of interest left after degaussing a magnetic shield. Degaussing coils surrounding a metal shield can be used to favorably order magnetic domains within the material to counteract the remnant fields left behind following imperfect degaussing. The remnant field value can be measured and a small current may be applied through the degaussing coils. After removing the current, the field can be measured again and a higher current may be applied again through the coils. Repeated applications of currents and field measurement will progressively order domains in the direction of the applied field, resulting in a reduction of the net field and lower field gradient across the volume of interest.

An electronic device comprising: a body having a first portion and a second portion located below the first portion, wherein a bottom surface of the first portion and a side surface of the second portion forms an opening under the bottom surface of the first portion, wherein at least one portion of an electrode is disposed on the bottom surface of the first portion of the body, and at least one portion of the second portion of the body is disposed in an opening of a circuit board with the electrode being disposed on and electrically connected with the circuit board.

An electronic device comprising: a body having a first portion and a second portion located below the first portion, wherein a bottom surface of the first portion and a side surface of the second portion forms an opening under the bottom surface of the first portion, wherein at least one portion of an electrode is disposed on the bottom surface of the first portion of the body, and at least one portion of the second portion of the body is disposed in an opening of a circuit board with the electrode being disposed on and electrically connected with the circuit board.

A manufacturing method of a coil component comprising the steps of: preparing a coil assembly body in which a coil is attached on a magnetic core and a mold body which is formed with a cavity portion in the inside thereof and which includes at least one opening portion, putting a viscous admixture including magnetic powders and thermosetting resin and the coil assembly body in the cavity portion, pushing the put-in viscous admixture in the mold body, and thermally-curing the pushed-in viscous admixture and forming a magnetic exterior body which covers the coil assembly body.