Patent classifications
H01F41/076
SURFACE MOUNTED INDUCTOR AND MANUFACTURING METHOD THEREFOR
A formed body incorporating a coil by using: a coil formed by winding a conductive wire, and a formed body incorporating the coil, the formed body being formed with a sealing material containing a resin and a magnetic material. The coil is formed by winding the conductive wire so that lead-out ends are positioned at an outer periphery of a wound portion. The formed body is formed so that surfaces of the coil are partially exposed on four side surfaces of the formed body which are parallel to a winding axis of the coil, and the area of a portion of the formed body outside the outer periphery of the wound portion is almost equal to or smaller than the area of a portion of the formed body inside an inner periphery of the wound portion of the coil.
SYSTEMS, METHODS AND APPARATUS FOR USE WITH SUPERCONDUCTING BASED COMPUTING SYSTEMS
An electrical filter includes a dielectric substrate with inner and outer coils about a first region and inner and outer coils about a second region, a portion of cladding removed from wires that form the coils and coupled to electrically conductive traces on the dielectric substrate via a solder joint in a switching region. An apparatus to thermally couple a superconductive device to a metal carrier with a through-hole includes a first clamp and a vacuum pump. A composite magnetic shield for use at superconductive temperatures includes an inner layer with magnetic permeability of at least 50,000; and an outer layer with magnetic saturation field greater than 1.2 T, separated from the inner layer by an intermediate layer of dielectric. An apparatus to dissipate heat from a superconducting processor includes a metal carrier with a recess, a post that extends upwards from a base of the recess and a layer of adhesive on top of the post. Various cryogenic refrigeration systems are described.
SYSTEMS, METHODS AND APPARATUS FOR USE WITH SUPERCONDUCTING BASED COMPUTING SYSTEMS
An electrical filter includes a dielectric substrate with inner and outer coils about a first region and inner and outer coils about a second region, a portion of cladding removed from wires that form the coils and coupled to electrically conductive traces on the dielectric substrate via a solder joint in a switching region. An apparatus to thermally couple a superconductive device to a metal carrier with a through-hole includes a first clamp and a vacuum pump. A composite magnetic shield for use at superconductive temperatures includes an inner layer with magnetic permeability of at least 50,000; and an outer layer with magnetic saturation field greater than 1.2 T, separated from the inner layer by an intermediate layer of dielectric. An apparatus to dissipate heat from a superconducting processor includes a metal carrier with a recess, a post that extends upwards from a base of the recess and a layer of adhesive on top of the post. Various cryogenic refrigeration systems are described.
Method of manufacturing a coil electronic component
A coil electronic component includes a body and external terminals. The body includes a winding coil part and a pillar-shaped core part inserted inside of the winding coil part and formed of a magnetic metal. The external terminals are connected to the winding coil part and disposed on an external surface of the body. The body contains the magnetic metal and a resin, and the pillar-shaped core part has magnetic permeability higher than that of a portion of the body disposed outside of the winding coil part.
Method of manufacturing a coil electronic component
A coil electronic component includes a body and external terminals. The body includes a winding coil part and a pillar-shaped core part inserted inside of the winding coil part and formed of a magnetic metal. The external terminals are connected to the winding coil part and disposed on an external surface of the body. The body contains the magnetic metal and a resin, and the pillar-shaped core part has magnetic permeability higher than that of a portion of the body disposed outside of the winding coil part.
MANUFACTURING METHOD OF COIL COMPONENT AND COIL COMPONENT
A manufacturing method of a coil component comprising the steps of: preparing a coil assembly body in which a coil is attached on a magnetic core and a mold body which is formed with a cavity portion in the inside thereof and which includes at least one opening portion, putting a viscous admixture including magnetic powders and thermosetting resin and the coil assembly body in the cavity portion, pushing the put-in viscous admixture in the mold body, and thermally-curing the pushed-in viscous admixture and forming a magnetic exterior body which covers the coil assembly body.
MANUFACTURING METHOD OF COIL COMPONENT AND COIL COMPONENT
A manufacturing method of a coil component comprising the steps of: preparing a coil assembly body in which a coil is attached on a magnetic core and a mold body which is formed with a cavity portion in the inside thereof and which includes at least one opening portion, putting a viscous admixture including magnetic powders and thermosetting resin and the coil assembly body in the cavity portion, pushing the put-in viscous admixture in the mold body, and thermally-curing the pushed-in viscous admixture and forming a magnetic exterior body which covers the coil assembly body.
Surface mounted inductor and manufacturing method therefor
A formed body incorporating a coil by using: a coil formed by winding a conductive wire, and a formed body incorporating the coil, the formed body being formed with a sealing material containing a resin and a magnetic material. The coil is formed by winding the conductive wire so that lead-out ends are positioned at an outer periphery of a wound portion. The formed body is formed so that surfaces of the coil are partially exposed on four side surfaces of the formed body which are parallel to a winding axis of the coil, and the area of a portion of the formed body outside the outer periphery of the wound portion is almost equal to or smaller than the area of a portion of the formed body inside an inner periphery of the wound portion of the coil.
Surface mounted inductor and manufacturing method therefor
A formed body incorporating a coil by using: a coil formed by winding a conductive wire, and a formed body incorporating the coil, the formed body being formed with a sealing material containing a resin and a magnetic material. The coil is formed by winding the conductive wire so that lead-out ends are positioned at an outer periphery of a wound portion. The formed body is formed so that surfaces of the coil are partially exposed on four side surfaces of the formed body which are parallel to a winding axis of the coil, and the area of a portion of the formed body outside the outer periphery of the wound portion is almost equal to or smaller than the area of a portion of the formed body inside an inner periphery of the wound portion of the coil.
Metal matrix composite wire, power inductor, and preparation methods for same
A preparation method for a metal matrix composite wire includes the following steps: 1) preparing a metal inner core; 2) preparing a glass-resin mixture; 3) dissolving self-adhesive resin in a solvent to prepare a self-adhesive resin solution; 4) uniformly coating the glass-resin mixture on a surface of the metal inner core, then coating the self-adhesive resin solution on a surface of the glass-resin mixture, and performing drying at a temperature of 80 C. to 150 C.; and 5) repeating the step 4) until a thickness of the glass-resin mixture plus the self-adhesive resin reaches 2 to 10 m. When an inductor is prepared by using the composite wire, the inductor may have relatively good weather resistance, a relatively good dielectric voltage-withstand capability, as well as relatively good high-temperature resistance and electrical performance.