Patent classifications
H01F41/122
Inductor and method of manufacturing the same
An inductor includes: a body including a support member including a through-hole and a via hole, an insulator disposed on the support member and including a first opening exposing portions of the support member, and a coil pattern disposed in the first opening, and including a plurality of layers including a seed layer in contact with the support member; and an external electrode disposed on an external surface of the body and electrically connected to the coil pattern. The support member may have a multilayer structure of at least first and second insulating layers, and the via hole may penetrate through both of the first and second insulating layers.
Electrically Insulated Electric Conductor Strip, In Particular For Electric Motors And Transformers
An electrically insulated electric conductor strip (1), in particular for electric motors and transformers, having a strip-like electric conductor (2) which has an upper cover surface (2a) and a lower cover surface (2b), two side edge surfaces (2c) and, at each end, an end edge surface, and having electrical insulation (3), which is arranged on at least one cover surface of the strip (2a, 2b). In order to create a conductor strip (1) of this kind which can be produced with reduced effort but has a high electrical insulation effect, the insulation comprises a paint layer (3a) and an adhesive strip (3b), which is adhered to the lower cover surface (2b) and/or the upper cover surface (2a) of the strip-like electrical conductor (2), more specifically at least in a region (4) in each case which borders a side edge surface (2c), the paint layer (3a) being beneath the adhesive tape (3b) and at least directly on the lower cover surface (2b) and/or on the upper surface (2a).
COIL COMPONENT
A coil component includes a body, a support substrate disposed within the body, a coil unit disposed on the support substrate, a noise removal unit disposed to be spaced apart from the coil unit within the body and having an end exposed to one side surface of the body, first and second external electrodes disposed to be spaced apart from each other at the body and OPP-2020-2741-US connected to both ends of the coil unit, and a third external electrode disposed to be spaced apart from each of the first and second external electrodes within the body and connected to the noise removal unit, wherein the noise removal unit includes a wall portion disposed outside of an outermost side turn of the coil unit at the support substrate and surrounding the outermost side turn of the coil unit and a cover portion disposed on the coil unit.
COIL COMPONENT
A coil component includes a body, a support substrate disposed within the body, a coil disposed on at least one surface of the support substrate, and first and second external electrodes disposed to be spaced apart from each other on the body and connected to the coil. The coil unit includes a first conductive layer disposed on the support substrate, a second conductive layer disposed on the first conductive layer and spaced apart from the support substrate, and a third conductive layer disposed on the second conductive layer to cover at least a portion of a side surface of the second conductive layer and spaced apart from the support substrate to expose a side surface of the first conductive layer.
Multilayer substrate and method of manufacturing the same
A multilayer substrate includes a stacked body of insulating base material layers and conductor patterns on the insulating base material layers. A thickness adjustment base material layer includes a frame portion, an opening portion inside the frame portion, and an island shaped portion inside the frame portion, and connection portions to connect the island shaped portion to the frame portion. The conductor patterns, in a stacking direction of the insulating base material layers, are wound around the island shaped portion. A line width of the connection portions is smaller than the width of the island shaped portion connected to the frame portion through the connection portions. An area overlapped with the conductor patterns is larger in the opening portion than in the frame portion and the island shaped portion.
Core sealing assemblies, core-coil assemblies, and sealing methods
A sealed core-coil assembly in a submersible transformer includes a coil assembly having an inner coil with inner, outer, upper, and lower surfaces, and an outer coil with inner, outer, upper, and lower surfaces, a core assembly including a core window and core column of a magnetically-permeable material, the core column and core window having inner side surfaces, and an expandable sealing member including an inner cavity that is fillable or evacuatable so that a compliant insulation material is positioned in the inner cavity to block passage of water and prevent the formation of a loop of water, which otherwise would act like an electrical short in a submerged transformer.
COIL COMPONENT
A coil component includes a body, a support portion disposed in the body, a coil portion disposed on a first surface of the support portion, a lead portion disposed on a second surface of the support portion facing the first surface of the support portion and connected to the coil portion, and a via penetrating through the support portion to connect an inner end portion of the coil portion and an inner end portion of the lead portion to each other, wherein the coil portion includes a first conductive layer embedded in the support portion and having a first surface exposed to or facing the first surface of the support portion, a second conductive layer disposed on the first surface of the first conductive layer, and a third conductive layer disposed on the second conductive layer and protruding from the first surface of the support portion.
COIL COMPONENT
A coil component includes a body, a support substrate disposed in the body, a coil portion including a first lead-out pattern disposed on a first surface of the support substrate, a first dummy pattern portion disposed to be spaced apart from the first lead-out pattern on the first surface of the support substrate, and a first external electrode disposed on the body to be connected to the first lead-out pattern, wherein the first lead-out pattern and the first dummy pattern portion are exposed to a first surface of the body to be spaced apart from each other, and the first surface of the support substrate, supporting the first lead-out pattern and the first dummy pattern portion, is continuously exposed to the first surface of the body.
Stackable near-field communications antennas
Techniques regarding one or more NFC antennas that can comprise vertically stacked coils of electrically conductive material are provided. For example, one or more embodiments described herein can comprise an apparatus, which can comprise can a first substrate layer that can comprise a first coil of electrically conductive material that can be wound in a first direction. The apparatus can also comprise a second substrate layer that can comprise a second coil of electrically conductive material that can be wound in a second direction opposite the first direction. The first substrate layer can be stacked onto the second substrate layer. Also, the first coil of electrically conductive material can be operably coupled to the second coil of electrically conductive material through an interconnection via to form an NFC antenna.
Dual-mode wireless charging device
A method of making a semiconductor device, includes: forming a first molding layer on a substrate; forming a first plurality of vias in the first molding layer; forming a first conductive line over the first molding layer, wherein the first conductive line is laterally disposed over the first molding layer and a first end of the conductive line aligns with and is electrically coupled to a first via of the first plurality of vias; forming a second molding layer above the first molding layer; and forming a second plurality of vias in the second molding layer, wherein a second via of the second plurality of vias aligns with and is electrically coupled to a second end of the conductive line, and wherein the second plurality of vias, the conductive line, and the first plurality of vias are electrically coupled to one another.