Provided is a coil device having a first coil and a second coil insulated by an insulating film, and deformation of the insulating film is suppressed. A coil device includes: a first insulating film provided in contact with a first direction side of a substrate; a spiral-shaped first coil part provided in contact with a first direction side of the first insulating film; a second insulating film provided to cover a first direction side of the first coil part and the first direction side of the first insulating film where the first coil part is not provided; a spiral-shaped second coil part provided in contact with a first direction side of the second insulating film; and a groove provided on a surface on the first direction side of the second insulating film in a region inside an outer peripheral edge of the second coil part in plan view.

A coil component includes: a magnetic element body made of resin containing conductive magnetic powder; a coil part 20 obtained by alternately stacking a plurality of conductor layers and a plurality of interlayer insulating layers, the plurality of conductor layers respectively including coil conductor patterns embedded in the magnetic element body and electrode patterns exposed from the magnetic element body; external terminals provided respectively on the electrode patterns and electrode patterns; and a protective insulating layer covering the magnetic element body in such a manner as to expose the external terminals therethrough. The magnetic element body is thus covered with the protective insulating layer, so that it is possible to prevent adhesion of plating to an unnecessary portion and exposure of the coil conductor patterns even when the surfaces of the external terminals are subjected to electrolytic plating.

A coil component includes a coil part having a structure in which interlayer insulating films 51 to 55 and coil patterns CP1 to CP4 are alternately stacked in the coil axis direction and magnetic element bodies M1 to M4 embedding therein the coil part. A radial width of a part of the interlayer insulating film that is positioned between the magnetic element body M1 positioned in the inner diameter area of the coil part and the innermost turn of the coil pattern CP4 is larger than radial widths L11, L21, and L31 of parts of the interlayer insulating films 52 to 54 that are positioned between the magnetic element body M1 and the innermost turns of the coil patterns CP1 to CP3.

A coil component includes a body including a coil having a top coil and a bottom coil connected to each other through a via and an external electrode disposed on an external surface of the body to be connected to the coil. A first insulating layer is disposed on a surface of the top coil, and a second insulating layer is disposed on a surface of the bottom coil. The first and second insulating layers are disposed to extend between the top coil and the bottom coil.

A coil component includes: a body including a magnetic material and a coil of which both ends are externally exposed; intermetallic compounds disposed on the exposed both ends of the coil; and external electrodes disposed on the body to cover the intermetallic compounds. The external electrodes include: conductive resin layers disposed on outer surfaces of the body to contact the exposed both ends of the coil and including base resins, a plurality of metal particles disposed in the base resins, and conductive connecting parts surrounding the plurality of metal particles and contacting the intermetallic compounds. The coil component further includes electrode layers disposed on the conductive resin layers and contacting the conductive connecting parts.

A coil electronic component includes a body having a first surface and a second surface opposing each other and a third and a fourth surface opposing each other, an insulating substrate disposed inside the body, first and second coil portions respectively disposed on opposing surfaces of the insulating substrate, a first lead-out portion connected the first coil portion and exposed from the first and third surfaces, a second lead-out portion connected to the second coil portion and exposed from the second and third surfaces, and first and second external electrodes respectively covering the first and second lead-out portions. The insulating substrate includes a support portion supporting the first and second coil portions, a first tip exposed from the first and third surfaces and supporting the first lead-out portion, and a second tip exposed from the second and third surfaces and supporting the second lead-out portion.

A coil electronic component is provided, the coil electronic component including a body having a laminate structure formed of a plurality of conductor patterns disposed therein, and including an insulating layer disposed between the plurality of conductor patterns, and an external electrode disposed externally of the body. Portions of the plurality of conductor patterns include a coil pattern and a lead-out pattern connecting the coil pattern and the external electrode, the lead-out pattern includes a first metal layer and a second metal layer disposed on the first metal layer, and a pore density of the first metal layer is higher than a pore density of the second metal layer.

A method of making a semiconductor device, includes: forming a first molding layer on a substrate; forming a first plurality of vias in the first molding layer; forming a first conductive line over the first molding layer, wherein the first conductive line is laterally disposed over the first molding layer and a first end of the conductive line aligns with and is electrically coupled to a first via of the first plurality of vias; forming a second molding layer above the first molding layer; and forming a second plurality of vias in the second molding layer, wherein a second via of the second plurality of vias aligns with and is electrically coupled to a second end of the conductive line, and wherein the second plurality of vias, the conductive line, and the first plurality of vias are electrically coupled to one another.

An electrical component, comprising: a magnetic body and a coil disposed in the magnetic body, wherein the magnetic body comprises a first magnetic powder and a second magnetic powder, wherein the D50 of the first magnetic powder is greater than the D50 of the second magnetic powder, wherein the D90 of the first magnetic powder is not greater than 50 um, and the D90 of the second magnetic powder is not greater than 50 um.

A coupled inductor has two coils made by film or a lithography processes, wherein a first coil is disposed on a top surface of a magnetic sheet and a second coil is disposed on the bottom surface of the magnetic sheet, for controlling the variations of the alignments of the two coils in a smaller range.