H01F41/127

Integrated ball screw linear actuator

A linear actuation screw having a first end portion, a second end portion on an opposite side as the first end portion, and a sloping intermediate portion between the first end portion and second end portion. The first end portion has a threaded outer wall having a generally constant first diameter over at least a portion of its length and is configured to advance a nut or a sliding member along at least a portion of the first end portion. The second end portion has a threaded outer wall having a generally constant second diameter that is different from the first diameter and is configured to receive a motor fastening nut around it in order to secure the linear actuation screw to a motor. The sloping intermediate portion includes an outer wall that is generally smooth and continuous over at least a majority of the area of the outer wall.

CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
20220279648 · 2022-09-01 ·

The present application provides a circuit board and a manufacturing method therefor. The circuit board includes: a core board, at least one chip, a first circuit layer, and a first insulating layer. A groove body is formed on the core board. The chip is provided in the groove body. The chip is provided with a first lead-out terminal. The first circuit layer is provided on at least one side of the core board. The first insulating layer is provided between the core board and the first circuit layer. The first lead-out terminal passes through the first insulating layer and is connected to the first circuit layer, so that the chip is electrically connected to the first circuit layer. Thus, the wiring between the chip and the circuit is more flexible.

Electronic component and method of manufacturing electronic component

An electronic component comprising a coil component having an element body containing ceramic, a coil disposed in the element body, and an external electrode disposed in the element body and electrically connected to the coil; and a mold resin sealing the coil component. The electronic component further comprises an electrode film in contact with an outer surface of the mold resin; and a connection conductor disposed in the mold resin and electrically connecting the external electrode and the electrode film.

Low porosity glass coatings formed on coiled wires, high temperature devices containing the same, and methods for the fabrication thereof

Methods for fabricating wires insulated by low porosity glass coatings are provided, as are high temperature electromagnetic (EM) devices containing such wires. In embodiments, a method for fabricating a high temperature EM device includes applying a glass coating precursor material onto a wire. The glass coating precursor material contains a first plurality of glass particles having an initial softening point. After application onto the wire, the glass coating precursor material is heat treated under process conditions producing a crystallized intermediary glass coating having a modified softening point exceeding the initial softening point. The crystallized intermediary glass coating is then infiltrated with a filler glass precursor material containing a second plurality of glass particles. After infiltration, the filler glass precursor material is heat treated to consolidate the second plurality of glass particles into the crystallized intermediary glass coating and thereby yield a low porosity glass coating adhered to the wire.

Method for manufacturing coil, coil and electronic device
11417463 · 2022-08-16 · ·

Disclosed are a method for manufacturing a coil, a coil, and an electronic device. The method includes: bonding a first side of a metal sheet onto a laser-transmitting substrate by an adhesive layer; cutting a coil pattern on a second side of the metal sheet by the laser to form a coil running through the two sides of the metal sheet on the metal sheet; bonding the second side of the metal sheet onto an adhesive tape; transmitting the laser through the laser-transmitting substrate to act on the adhesive layer to detach the laser-transmitting substrate and the adhesive layer from the first side of the metal sheet; exposing the coil pattern on the first side of the metal sheet; and forming an encapsulation layer on the coil to encapsulate the first side of the coil.

REACTOR

A reactor is provided with a coil including a pair of winding portions arranged in parallel, a magnetic core to be arranged inside and outside the winding portions, a holding member for specifying mutual positions of the coil and the magnetic core, a case for accommodating an assembly including the coil, the magnetic core and the holding member, and a sealing resin portion to be filled into the case. The case includes a bottom plate portion, the assembly being placed on the bottom plate portion, a side wall portion for surrounding the assembly, and an opening facing the bottom plate portion. The assembly is so accommodated into the case that an axial direction of each winding portion is along a depth direction of the case. The magnetic core includes an outer core portion to be arranged outside the winding portions and on the opening side.

REACTOR
20220215996 · 2022-07-07 ·

A reactor is provided with a coil including a pair of winding portions, a magnetic core to be arranged inside and outside the winding portions, a holding member for specifying mutual positions of the coil and the magnetic core, a case for accommodating an assembly including the coil, the magnetic core and the holding member, and a sealing resin portion to be filled into the case. The case includes a bottom plate portion on which the assembly is placed, a side wall portion for surrounding the assembly, and an opening facing the bottom plate portion. The side wall portion includes a pair of long side parts facing each other and a pair of short side parts facing each other. The assembly is so accommodated into the case that an axial direction of each winding portion is along a depth direction of the case.

Core and coil molding structure and manufacturing method thereof
11295892 · 2022-04-05 · ·

Provided are a core and coil molding structure and a manufacturing method thereof which are capable of eliminating a void between coil layers to prevent foreign materials from entering therein, and which improve the vibration resistance and shock resistance of a reactor. A core and coil molding structure includes a coil that is a rectangular coil, a core yoke member in a block shape, and a resin member molding at least a part of those. The presence of a positioning member in a pin shape which positions the coil within a mold forms a groove in the inner circumference of the coil in the resin member.

Prefabricated coil for a direct drive
11289966 · 2022-03-29 · ·

A prefabricated coil for placement on a tooth for a direct drive is orthocyclically wound from a wire of circular cross section. The coil includes two straight portions having an inner surface facing an interior of the coil and an outer surface opposite and parallel to the inner surface. A distance between the inner surface and the outer surface defines a thickness of the coil. Two coil overhangs connect the straight portions. A distance between the coil overhangs defines a height of the straight portions. The inner and outer surfaces of the straight portions have the height of the straight portions and a width of the straight portions. A sheet-like insulator covers the straight portions. The wire and the sheet-like insulator are bonded together such that the coil is self-supporting under the application of pressure and temperature. The sheet-like insulator has a joint region at the outer surface.

PLANAR COIL ELEMENT AND METHOD FOR PRODUCING PLANAR COIL ELEMENT

A planar coil element of the present invention includes an insulating base film having a first surface and a second surface opposite to the first surface, a first conductive pattern deposited on the first surface side of the insulating base film, and a first insulating layer covering the first conductive pattern on the first surface side, in which the first conductive pattern includes a core body and a widening layer deposited by plating on the outer surface of the core body, the core body includes a thin conductive layer on the insulating base film, and the ratio of the average thickness of the first conductive pattern to the average circuit pitch of the first conductive pattern is 1/2 or more and 5 or less.