Patent classifications
H01G2009/05
Solid electrolytic capacitor
A solid electrolytic capacitor includes: a porous sintered body made of a valve metal; an anode wire that has a portion extending inside the porous sintered body, and that protrudes from the porous sintered body; a dielectric layer formed on the porous sintered body; a solid electrolyte layer formed on the dielectric layer; a cathode layer formed on the solid electrolyte layer; and a protective film having at least a portion formed on the cathode layer. The protective film has a glass transition point of 180 C. or lower.
Solid electrolytic capacitor containing a vapor-deposited barrier film
A capacitor comprising a solid electrolytic capacitor element that contains a sintered porous anode body, a dielectric that overlies the anode body, and a solid electrolyte that overlies the dielectric. The capacitor further contains a barrier film that is formed by vapor deposition and that is positioned between the dielectric and the solid electrolyte or overlies the dielectric.
Low inductance electrolytic capacitor
A capacitor that is capable of exhibiting good electrical properties under a wide variety of different conditions is provided. The capacitor contains a capacitor element that includes a sintered porous anode body, a dielectric that overlies the anode body, and a solid electrolyte that overlies the dielectric and includes a conductive polymer. The capacitor also contains multiple exposed anode lead portions that are electrically connected to respective anode terminations and a planar cathode termination that is electrically connected to the solid electrolyte.
Low Energy Milling to Produce Flake Powders
A method for increasing surface area of a valve metal particle is provided as is an improved valve metal particle provided thereby. The method includes charging a mill apparatus with a valve metal powder and a media wherein the media has an average diameter of at least 0.01 cm to no more than 0.3175 cm. The valve metal powder is then milled at an average kinetic energy of no more than 3,000 ergs per media particle to obtain a milled powder.
SAFE HANDLING OF LINK ERRORS IN A PERIPHERAL COMPONENT INTERCONNECT EXPRESS (PCIE) DEVICE
Safe handling of link errors in a Peripheral Component Interconnect (PCI) express (PCIE) device is disclosed. In one aspect, safe handling of link errors involves detecting errors in a PCIE link and maintaining the PCIE link by preventing the reporting of detected errors and providing safe data to a host in communication with the PCIE link. A PCIE link can be established between a host (incorporating a root complex) and an endpoint device, through which the host can request the performance of operations (e.g., read data, write data) by the endpoint device. Circuitry and/or software can monitor the PCIE link and perform safe handling of link errors when they occur. The circuitry detects link errors and consumes them in such a manner that the host is unaware that an error has occurred and only safe (e.g., non-corrupted) data is provided to the host.
ELECTRODE MATERIAL FOR ALUMINUM ELECTROLYTIC CAPACITORS AND METHOD FOR PRODUCING SAME
The present invention provides an electrode material for aluminum electrolytic capacitors, the electrode material being capable of exhibiting a high capacitance required for capacitors and having suppressed equivalent series resistance (ESR), and provides a method for producing the electrode material.
The present invention provides an electrode material for aluminum electrolytic capacitors, comprising a sintered body of an aluminum alloy powder on at least one surface of a substrate, wherein the substrate is an aluminum foil substrate or an aluminum alloy foil substrate, and the aluminum alloy powder contains Fe in an amount of 2 to 499 mass ppm.
Solid Electrolytic Capacitor Containing A Vapor-Deposited Barrier Film
A capacitor comprising a solid electrolytic capacitor element that contains a sintered porous anode body, a dielectric that overlies the anode body, and a solid electrolyte that overlies the dielectric. The capacitor further contains a barrier film that is formed by vapor deposition and that is positioned between the dielectric and the solid electrolyte or overlies the dielectric.
Method to Reduce Anode Lead Wire Embrittlement in Capacitors
An improved capacitor, and method of manufacturing the improved capacitor, is provided. The method includes deoxygenating and leaching the anode wire to produce a capacitor comprising an anode having a surface area of at least 4.0 m.sup.2/g or a charge density of at least 200,000 CV/g with the anode wire having an equivalent diameter of less than 0.30 mm extending from said anode. A dielectric is on the anode and a cathode is on the dielectric.
Anodes Containing Spherical Powder And Capacitors
Anodes made from powder, such as tantalum powder, that is highly spherical is described. Methods to make the anodes are further described.
SOLID ELECTROLYTIC CAPACITOR ELEMENT, SOLID ELECTROLYTIC CAPACITOR, AND MANUFACTURING METHOD OF SOLID ELECTROLYTIC CAPACITOR ELEMENT
A solid electrolytic capacitor element that includes a porous body, a dielectric layer on a surface of the porous body, and a solid electrolyte layer on a surface of the dielectric layer. The porous body is made from a sintered body of a Ti-alloy-containing grain having a TiZrX multicomponent alloy on a surface thereof, where X is at least one valve metal element selected from Si, Hf, Y, Al, Mo, W, Ta, Nb, and V, and a composition of the TiZrX multicomponent alloy is Ti: 50 atm % to 80 atm %, Zr: 8 atm % to 32 atm %, and X: 1 atm % to 20 atm %.