A composite electronic component includes a composite body having a multilayer ceramic capacitor and a tantalum capacitor coupled to each other, so as to have an excellent acoustic noise reduction effect, a low equivalent series resistance (ESR)/equivalent series inductance (ESL), improved direct current (DC)-bias characteristics, and a low chip thickness.

A capacitor has an anode with one or more active layers that each includes fused particles positioned on a current collector. The current collector includes tunnels that extend from a first face of the current collector to a second face of the current collector.

A capacitor has an anode with one or more active layers that each includes fused particles positioned on a current collector. The current collector includes tunnels that extend from a first face of the current collector to a second face of the current collector.

A composite electronic component includes: a tantalum capacitor, a multilayer ceramic capacitor, a sealing part, an anode lead frame, and a cathode lead frame, wherein the anode lead frame includes a step portion that does not contact a first external electrode of the multilayer ceramic capacitor, and the cathode lead frame includes a step portion that does not contact a second external electrode of the multilayer ceramic capacitor.

A composite electronic component includes: a tantalum capacitor, a multilayer ceramic capacitor, a sealing part, an anode lead frame, and a cathode lead frame, wherein the anode lead frame includes a step portion that does not contact a first external electrode of the multilayer ceramic capacitor, and the cathode lead frame includes a step portion that does not contact a second external electrode of the multilayer ceramic capacitor.

A solid electrolytic capacitor including a capacitor element and an anode lead assembly is provided. The capacitor element includes a sintered, porous anode body; a dielectric layer overlying the sintered, porous anode body; and a cathode overlying the dielectric layer that includes a solid electrolyte. The anode lead assembly includes a first anode lead having an embedded portion positioned within the anode body and an external portion extending from a surface of the anode body in a longitudinal direction. The external portion includes a substantially planar surface. Meanwhile, the second anode lead is positioned external to the anode body and includes a first portion and a second portion. The first portion has a substantially planar surface that is connected to the substantially planar surface of the external portion of the first anode lead.

A solid electrolytic capacitor including a capacitor element and an anode lead assembly is provided. The capacitor element includes a sintered, porous anode body; a dielectric layer overlying the sintered, porous anode body; and a cathode overlying the dielectric layer that includes a solid electrolyte. The anode lead assembly includes a first anode lead having an embedded portion positioned within the anode body and an external portion extending from a surface of the anode body in a longitudinal direction. The external portion includes a substantially planar surface. Meanwhile, the second anode lead is positioned external to the anode body and includes a first portion and a second portion. The first portion has a substantially planar surface that is connected to the substantially planar surface of the external portion of the first anode lead.

Provided is an improved capacitor formed by a process comprising: providing an anode comprising a dielectric thereon wherein the anode comprises a sintered powder wherein the powder has a powder charge of at least 45,000 μFV/g; and forming a first conductive polymer layer encasing at least a portion of the dielectric by applying a first slurry wherein the first slurry comprises a polyanion and a conductive polymer and wherein the polyanion and conductive polymer are in a weight ratio of greater than 3 wherein the conductive polymer and polyanion forms conductive particles with an average particle size of no more than 20 nm.

A method for producing agglomerated tantalum particles, comprising: a step for grinding secondary tantalum particles, which are obtained by reducing a tantalum salt, and adding water thereto to give a water-containing mass; a step for drying said water-containing mass to give a dry mass; a step for sieving said dry mass to give spherical particles; and a step for heating said spherical particles. A mixed tantalum powder comprising a mixture of agglomerated tantalum particles (X) with agglomerated tantalum particles (Y), wherein said agglomerated tantalum particles (X) show a cumulative percentage of particles with particle size of 3 μm or less of 5 mass % or less after 25 W ultrasonic radiation for 10 min, while said agglomerated tantalum particles (Y) show a cumulative percentage of particles with particle size of 3 μm or less of 10 mass % or more after 25 W ultrasonic radiation for 10 min.

A method for producing agglomerated tantalum particles, comprising: a step for grinding secondary tantalum particles, which are obtained by reducing a tantalum salt, and adding water thereto to give a water-containing mass; a step for drying said water-containing mass to give a dry mass; a step for sieving said dry mass to give spherical particles; and a step for heating said spherical particles. A mixed tantalum powder comprising a mixture of agglomerated tantalum particles (X) with agglomerated tantalum particles (Y), wherein said agglomerated tantalum particles (X) show a cumulative percentage of particles with particle size of 3 μm or less of 5 mass % or less after 25 W ultrasonic radiation for 10 min, while said agglomerated tantalum particles (Y) show a cumulative percentage of particles with particle size of 3 μm or less of 10 mass % or more after 25 W ultrasonic radiation for 10 min.