A relay with high action reliability includes a base part and a movable part that is swingable relative to the base part. The movable part includes a movable contact piece, an armature, and a first plastic body, and the movable contact piece and the armature are assembled into an integral piece through the first plastic body. The movable contact piece includes a movable contact body and a soldering lug structure. The soldering lug structure includes a connecting portion and a soldering portion, and the soldering portion is connected to the movable contact body through the connecting portion. The soldering portion includes a first soldering structure and a second soldering structure that are soldered to the base part; and the first soldering structure and the second soldering structure are at a same side of the connecting portion in a length direction of the armature.