A fuse module including a mounting block formed of an electrically insulating material, the mounting block including a rear wall extending from a base, a fuse plate including an electrically conductive bus bar disposed on a bottom of the base, a fusible element electrically connected to the bus bar and disposed adjacent a rear of the rear wall, and a fuse terminal electrically connected to the fusible element and extending over a top of the rear wall, along a front of the rear wall, and onto a top of the base, the fuse module further including an electrically conductive terminal post extending from the top of the base through the fuse terminal for facilitating connection to an electrical component.

The present disclosure discloses a miniature super surface mount fuse, comprising: a fuse element provided with a low overload fusing point and at least two high breaking capacity fusing points connected in series with the low overload fusing point and respectively arranged on two sides of the low overload fusing point, at least two cavity plates provided with cavities, the low overload fusing point and the high breaking capacity fusing points being located at corresponding positions of the cavities; the present disclosure further provides a manufacturing method for a surface mount fuse; the miniature super surface mount fuse of the present disclosure can provide the protection for the civil consumer electronic circuit under various overload conditions without the occurrence of safety hazards such as smoking or cracking of the housing or explosion.

Provided is a fuse device capable of maintaining the insulation performance while using a fuse element having a considerable size to improve rating. The fuse device includes a fuse element 2 and a case 3 for housing the fuse element 2, and the case 3 has a resin portion 4 having a surface to be melted by heat accompanying blowout of the fuse element 2 on at least a part of an inner wall surface 8a facing the inside 8 housing the fuse element 2.

A high breaking capacity chip fuse including a bottom insulative layer, a first intermediate insulative layer, a second intermediate insulative layer, and a top insulative layer disposed in a stacked arrangement in the aforementioned order, a fusible element disposed between the first and second intermediate insulative layers and extending between electrically conductive first and second terminals at opposing longitudinal ends of the bottom insulative layer, the first intermediate insulative layer, the second intermediate insulative layer, and the top insulative layer, wherein the first and second intermediate insulative layers are formed of porous ceramic.

A device including a conductive path for passing electric current. The device including a terminal and a spring fuse. The spring fuse is connected in the conductive path and is electrically connected to the terminal. The spring fuse includes a fixed base, an extension spring connected to the fixed base at a first end, a power path connection connected to the extension spring at a second end, a plurality of fuse pads, and one or more solder joints configured to connect the power path connection to the plurality of fuse pads. The one or more solder joints are configured to melt when a temperature of the one or more solder joints exceeds a threshold value. The power path connection is configured to retract toward the fixed base when the temperature of the one or more solder joints exceeds a threshold value.

A surface-mount type micro fuse has a fusible element provided in a housing. The fusible element has a fusible body and two intermediary portions connected to both ends of the fusing portion. Two gaps are formed respectively between the fusible body and the intermediary portions. When the fusible element is blown out due to the transient abnormal current, the gaps between the intermediary portions cause a large distance instantaneously to prevent the arc. Then effectively ensure the safety of the use of the overall circuit.

A micro-fuse assembly includes a substrate, a number of thin-film micro-fuses on the substrate, and a topping wafer configured to sealingly engage to at least one of the substrate or the thin-film micro-fuses to define a cavity therebetween. The cavity is configured to encapsulate the thin-film micro-fuses within an inert environment sealed within the cavity. A method of encapsulating a micro-fuse assembly within an inert environment using a topping wafer is also disclosed.

A fuse module including a mounting block formed of an electrically insulating material, the mounting block including a rear wall extending from a base, a fuse plate including an electrically conductive bus bar disposed on a bottom of the base, a fusible element electrically connected to the bus bar and disposed adjacent a rear of the rear wall, and a fuse terminal electrically connected to the fusible element and extending over a top of the rear wall, along a front of the rear wall, and onto a top of the base, the fuse module further including an electrically conductive terminal post extending from the top of the base through the fuse terminal for facilitating connection to an electrical component.

A surface-mountable thin-film fuse component is disclosed that may include a substrate having a top surface, a first end, and a second end that is spaced apart from the first end in a longitudinal direction. The thin-film component may include a fuse layer formed over the top surface of the substrate. The fuse layer may include a thin-film fuse track. An external terminal may be disposed along the first end of the substrate and electrically connected with the thin-film fuse track. The external terminal may include a compliant layer comprising a conductive polymeric composition.

The invention relates to a fuse (1), in particular SMD fuse, with an insulating housing (2) having a cavity (3), a (4) arranged in the cavity (3) of the insulating housing (2), and contact means (5) electrically connected to the melting conductor (4) for making contact with the outside of the fuse (1), wherein the insulating housing (2) comprises a base body (6) having the cavity (3) and a lid (7) closing the cavity (3) of the base body (6), wherein the contact means (5) are each arranged with an inner section (8) electrically connected to the melting conductor (4) in the interior of the insulating housing (2) and with an outer section (9) on the outer side (10) of the insulating housing (2), preferably of the base body (6).