H01H85/0411

Fuse in chip design

To produce a cost-effective fuse in chip design, which is applied to a carrier substrate made of a Al.sub.2O.sub.3 ceramic having a high thermal conductivity, and which is provided with a fusible metallic conductor and a cover layer, in which the melting point of the metallic conductor may be defined reliably, it is suggested that an intermediate layer having low thermal conductivity be positioned between the carrier substrate and the metallic conductor, the intermediate layer being formed by a low-melting-point inorganic glass paste applied in the screen-printing method or an organic intermediate layer applied in island printing. Furthermore, a method for manufacturing the fuse is specified.

Chip fuse
10283298 · 2019-05-07 · ·

A method for manufacturing a chip fuse, comprises: a liquid film forming step for forming a liquid film of dispersion liquid having metal nanoparticles dispersed therein on a principal surface of a substrate; a fuse film forming step for forming a fuse film on the principal surface by irradiating the liquid film with laser light; and a first terminal forming step for forming first terminals that each connects to the fuse film on each of both end sides in a longitudinal direction of the fuse film on the principal surface.

Arrayed element design for chip fuse

A chip fuse includes a first terminal disposed on a first end of a fuse element array and a second terminal disposed on a second end of the fuse element array opposite the first end. The fuse element array includes multiple layers disposed in a stacked arrangement, each layer including a first terminal portion disposed within the first terminal, a second terminal portion disposed within the second terminal, a first fuse element portion orthogonal to and extending between the first terminal portion and the second terminal portion, and a second fuse element portion orthogonal to and extending between the first terminal portion and the second terminal portion. The first fuse element portion is adjacent the second fuse element portion.

Electrical Fuse Element
20190066960 · 2019-02-28 ·

An electric fuse element for arrangement on a printed circuit board is specified. The fuse element is formed as an SMD component and has a cuboidal insulating housing, two contact elements for electrical connection to the printed circuit board and at least one support element. The contact elements are arranged on a bottom side of the insulating housing, wherein the contact elements emerge at the bottom side of the insulating housing by way of a subregion, which has a contact area on the end side. The emerging subregion having the contact areas is of angled form.

Fuse element, a fuse, a method for producing a fuse, SMD fuse and SMD circuit
10192705 · 2019-01-29 · ·

The invention relates to a fuse element (12_1; 12_2), comprising two connecting contacts (24_1, 24_1; 24_2, 24_2) and an interposed conductive track (26_1; 26_2), wherein the conductive track (26_1; 26_2) has a reduced line-cross-section, in relation, to the connecting contacts (24_1, 24_1; 24_2, 24_2) at least in some sections, further comprising at least one overlay (16_1; 16_2, 16_2), wherein the fuse element (12_1; 12_2) and the overlay (16_1; 16_2, 16_2) each comprise materials which undergo diffusion when a predetermined ambient temperature is exceeded and when an electric current is conducted by the fuse element (12_1; 12_2). The invention further relates to a fuse (TO) having such a fuse element (12_1; 12_2) and a base support (14), wherein the fuse element (12_1; 12_2) is disposed on a surface of the base support (14).

SEMICONDUCTOR CIRCUIT BREAKER AND OVERVOLTAGE SUPPRESSION UNIT OF SEMICONDUCTOR CIRCUIT BREAKER
20240312752 · 2024-09-19 ·

The present disclosure relates to an overvoltage suppression unit provided in a semiconductor circuit breaker using a semiconductor switch for power, the overvoltage suppression unit comprising: an overvoltage suppression element unit disposed on a first surface of a printed circuit board and including at least one overvoltage suppression element; a pattern fuse connected to the overvoltage suppression element unit and patterned on the first surface of the printed circuit board; a first case forming a housing and covering the first surface of the printed circuit board on which the pattern fuse and the overvoltage suppression element unit are disposed; and a lead wire connected to the pattern fuse, wherein the lead wire is formed so as to connect the first surface of the printed circuit board and a second surface of the printed circuit board.

CUT-OFF ELEMENT AND OVERVOLTAGE PROTECTION ARRANGEMENT

A cut-off element for electrical isolation of an electrical component or for opening of a circuit in overload has two terminal contacts, an insulating housing and a fuse element which is located within the insulating housing. In the normal state of the cut-off element, the two terminal contacts (2,3) are connected to one another in an electrically conductive manner via the fuse element. In the cut-off element, reliable isolation of an electrical component, in particular an overvoltage arrangement, is possible by the insulating housing being formed of two parts which are connected to one another and the first part of the housing, in case of overload, being isolated from the second part of the housing so that the connection of the two terminal contacts is broken via the fuse element.

FUSE COMPONENT

A fuse component (1) has a fuse element (2). The fuse element (2) is located inside an isolating body (3) and the fuse element (2) extends between the two end faces of the isolating body (3). Each of the end faces of the isolating body (3) are closed by electrical conductive end caps (4) and the end caps (4) are in electrical contact with the fuse element (2). The isolating body (3) includes at least two shells (5a, 5b); at least in the region of the end caps (4), and the shells (5a, 5b) in the assembled state form a channel (6) to receive the fuse element (2).

Thermal safety device

In order to provide a method for isolating a circuit and a thermal link, wherein the link has a very low resistance and is suitable for high currents, in particular very high short load currents, and also has a high degree of reliability, in particular under difficult conditions, such as thermal and mechanical loading which lasts for a relatively long time, for example, the invention proposes that, during the phase transition of the material of the fusible element (10) from the solid to the liquid state, the volume of the fusible element (10) increases and the pressure increases and, owing to the increase in volume and the increase in pressure, the fusible element (10) is dislodged so as to break the electrical connection.

ELECTRICAL FUSE
20240412936 · 2024-12-12 · ·

An electrical fuse (100) comprising: an electrical conductor element (108) comprising a melting section (110) and further comprising a first extension section (112) and a second extension section (114) both integrally formed with the melting section (110) and extending from both ends of the melting section (110) in the lengthwise direction thereof, an electrically insulating, multi-part housing (102), which encloses said melting section (110) in an interior space (116), wherein the multi-part housing (102) comprises a first part (104) and a second part (106) slidingly engaged with said first part (104) and arranged such that the second part (106) covers an access opening (118) of the first part to the interior space (116), and wherein the first extension section (112) and second extension section (114) comprise a terminal area, respectively, both terminal areas are arranged outside the multi-part housing (102).