A controllable circuit protector for power supplies with different voltages includes a first fuse and a second fuse connected in series to each other, a first heating unit, and at least one second heating unit in parallel to the first heating unit. A connected end of the first heating unit is electrically connected to a series-connected node between the first fuse and the second fuse, and a free end thereof forms a control terminal. When a load is irregular, the control terminal is connected to a ground terminal through a switch. For power supplies with different voltages, the effective resistance of the first heating unit and a part of the at least one second heating unit not melting is altered without causing drastic change arising from voltage variation to the total heating power, and the first fuse or the second fuse can duly melt down to protect the load.

A method for manufacturing a chip fuse, comprises: a liquid film forming step for forming a liquid film of dispersion liquid having metal nanoparticles dispersed therein on a principal surface of a substrate; a fuse film forming step for forming a fuse film on the principal surface by irradiating the liquid film with laser light; and a first terminal forming step for forming first terminals that each connects to the fuse film on each of both end sides in a longitudinal direction of the fuse film on the principal surface.

A method for manufacturing a chip fuse, comprises: a liquid film forming step for forming a liquid film of dispersion liquid having metal nanoparticles dispersed therein on a principal surface of a substrate; a fuse film forming step for forming a fuse film on the principal surface by irradiating the liquid film with laser light; and a first terminal forming step for forming first terminals that each connects to the fuse film on each of both end sides in a longitudinal direction of the fuse film on the principal surface.

A protection device comprises a first planar substrate, a second planar substrate, a heating element and a fusible element. The second planar substrate is attached to the underside of the first planar substrate to form a composite structure. The heating element comprises an insulating layer and a heating layer disposed thereon. The heating element is disposed on the first planar substrate, and the insulating layer is disposed between the first planar substrate and the heating layer. The fusible element is disposed above the heating element. The heating element heats up to blow the fusible element in the event of over-voltage or over-temperature.

The present invention aims to achieve a Pb-free protection element by using a layered body including a high melting point metal layer and a low melting point metal layer. A protection element includes an insulating substrate, a heating body, an insulating member, two electrodes, a heating body extraction electrode, and a fusible conductor. Furthermore, the fusible conductor includes a layered body including at least a high melting point metal layer and a low melting point metal layer, and the low melting point metal layer is melted by a heat generated by the heating body, whereby, while eroding the high melting point metal layer, the low melting point metal layer is drawn close to the side of the two electrodes and the heating body extraction electrode, and fused, the two electrodes and the heating body extraction electrode each having high wettability for the low melting point metal layer.

Disclosed are a fuse pad, a printed circuit board having the fuse pad, and a method of manufacturing the printed circuit board. The fuse pad includes a first pad provided at one side of a fuse, a second pad provided at an opposite side of the fuse, and a measurement pad electrically connected to the second pad to measure whether the fuse is detached.

Disclosed are a fuse pad, a printed circuit board having the fuse pad, and a method of manufacturing the printed circuit board. The fuse pad includes a first pad provided at one side of a fuse, a second pad provided at an opposite side of the fuse, and a measurement pad electrically connected to the second pad to measure whether the fuse is detached.

Provided is a voltage detection line including conductive wire and insulating film covering conductive wire, and detecting voltage of a battery in order to suppress reconduction of a disconnected voltage detection line. Conductive wire includes low-resistance part having a predetermined electrical resistance value, and high-resistance part having a higher electrical resistance value than an electrical resistance value of low-resistance part and fusing when an overcurrent flows through conductive wire. Insulating film includes high-strength part that covers low-resistance part and has a predetermined strength, and low-strength part that covers high-resistance part and has a strength lower than a strength of high-strength part.

An electronic installation device for controlling a load in an electrical circuit, which comprises a single or multi-layer printed circuit board arrangement with electrical components and conductor tracks and which comprises a load circuit and a control circuit. According to the invention, in order to provide an electronic installation device with protective devices against short-circuit and against overload and which are specific to devices, the load circuit and the control circuit are at least functionally coupled to one another, and the electronic installation device comprises a first overcurrent protection device for protection against short-circuit currents and a second overcurrent protection device for protection against overload currents.

A fuse element includes a low-melting-point metal plate, a first high-melting-point metal layer, and a second high-melting-point metal layer. The low-melting-point metal plate has a first main surface, a second main surface, a first side surface, and a second side surface. The first main surface and the second main surface face each other. The first side surface and the second side surface face each other and each connect the first main surface and second main surface. The first high-melting-point metal layer is disposed on the first main surface and second main surface. The second high-melting-point metal layer is disposed on the first side surface and second side surface. The fuse element has a cut-out portion in which at least a portion of the second high-melting-point metal layer is cut out.