A circuit board with integrated fusing includes an insulating substrate having a circuit trace formed on a surface thereof, the circuit trace including a first circuit trace portion and a second circuit trace portion. A fusible link electrically connects the first circuit trace portion to the second circuit trace portion, the fusible link including a planar surface extending from the first circuit trace portion to the second circuit trace portion. A dielectric reflow encapsulates the fusible link on the planar surface from the first circuit trace portion to the second circuit trace portion.

Implants or sensors often include and rely on inductive and ferromagnetic electrical components to measure and communicate data outside of the body to an external device, creating a safety concern when a patient with these implants or sensors must undergo an MRI scan. Further, various external devices that include inductive and ferromagnetic electrical components are exposed to potentially damaging MRI scans. An electrical coil assembly can include an electrical coil that includes a substrate and an electrical conductor supported by a first face of the substrate. In an example, the electrical coil assembly further includes a fuse element that is configured to move from a disengaged position in which the electrical fuse conductor is out of contact with the electrical conductor to an engaged position in which the electrical fuse conductor contacts the electrical conductor so as to define a short circuit.

Implants or sensors often include and rely on inductive and ferromagnetic electrical components to measure and communicate data outside of the body to an external device, creating a safety concern when a patient with these implants or sensors must undergo an MRI scan. Further, various external devices that include inductive and ferromagnetic electrical components are exposed to potentially damaging MRI scans. An electrical coil assembly can include an electrical coil that includes a substrate and an electrical conductor supported by a first face of the substrate. In an example, the electrical coil assembly further includes a fuse element that is configured to move from a disengaged position in which the electrical fuse conductor is out of contact with the electrical conductor to an engaged position in which the electrical fuse conductor contacts the electrical conductor so as to define a short circuit.

A vehicle includes an electrified propulsion system powered by a traction battery. The vehicle also includes an electrical distribution system (EDS) to pass current to and from the traction battery. The EDS is provided with at least one flexible electrical distribution component (FEDC) including a plurality of individual conductor paths. At least one of the individual conductor paths defines a typical width and a reduced width narrowed portion sized to operate as a fuse and thereby break an electrical circuit of the at least one individual conductor path in response to heat generated from conducting an electrical current greater than a predetermined threshold.

A flexible printed circuit board (FPCB) including a pattern circuit layer. The pattern circuit layer has a pattern fuse embedded therein, and the pattern fuse includes a first conductive wire made of a metal and having a spiral structure, and a second conductive wire made of a metal and having a spiral structure. The first conductive wire and the second conductive wire have a double helix structure.

A flexible printed circuit board (FPCB) including a pattern circuit layer. The pattern circuit layer has a pattern fuse embedded therein, and the pattern fuse includes a first conductive wire made of a metal and having a spiral structure, and a second conductive wire made of a metal and having a spiral structure. The first conductive wire and the second conductive wire have a double helix structure.

A high breaking capacity chip fuse including a bottom insulative layer, a first intermediate insulative layer, a second intermediate insulative layer, and a top insulative layer disposed in a stacked arrangement in the aforementioned order, a fusible element disposed between the first and second intermediate insulative layers and extending between electrically conductive first and second terminals at opposing longitudinal ends of the bottom insulative layer, the first intermediate insulative layer, the second intermediate insulative layer, and the top insulative layer, wherein the first and second intermediate insulative layers are formed of porous ceramic.

A fuse element includes: a low-melting-point metal layer; a high-melting-point metal layer provided over at least one surface of the low-melting-point metal layer; and an intermediate layer disposed between the low-melting-point metal layer and the high-melting-point metal layer. Each of the high-melting-point metal layer and the intermediate layer is made of a metal that is liquefied by contacting a molten form of the low-melting-point metal layer. The high-melting point metal layer is made of silver or an alloy comprising silver as a main component thereof. A melting point of a material constituting the intermediate layer is higher than a melting point of a material constituting the low-melting-point metal layer and lower than a melting point of a material constituting the high-melting-point metal layer.

A circuit board with integrated fusing includes an insulating substrate having a circuit trace formed on a surface thereof, the circuit trace including a first circuit trace portion and a second circuit trace portion. A fusible link electrically connects the first circuit trace portion to the second circuit trace portion, the fusible link including a planar surface extending from the first circuit trace portion to the second circuit trace portion. A dielectric reflow encapsulates the fusible link on the planar surface from the first circuit trace portion to the second circuit trace portion.

A circuit board with integrated fusing includes an insulating substrate having a circuit trace formed on a surface thereof, the circuit trace including a first circuit trace portion and a second circuit trace portion. A fusible link electrically connects the first circuit trace portion to the second circuit trace portion, the fusible link including a planar surface extending from the first circuit trace portion to the second circuit trace portion. A dielectric reflow encapsulates the fusible link on the planar surface from the first circuit trace portion to the second circuit trace portion.