The invention relates to a conducting track fuse (1) for an electrical or electronic device, comprising: a first and a second connection region (2a, 2b); a nonlinearly extending burn-out region (3), which is arranged between the first and second connection regions (2a, 2b); and a covering element (15), which has at least two side walls (9) and a covering face (8), which covering element is arranged over the first and second connection regions (2a, 2b) and over the burn-out region (3), the burn-out region (3) and the covering element (5) being arranged relative to each other in such a way that the area of the covering face (8) covers the burn-out region (3) and a cavity (7) is formed between the burn-out region (3) and the covering face (8) as a result of the height of the side walls (9).

Devices and systems are provided that incorporate fusible links within the electrical traces of a battery module voltage sensing circuit. The fusible links can be integrally formed in an electric trace and provide an overcurrent protection feature for the circuit without requiring fuse elements or components that are separate from the electrical trace. Each of these fusible links include a substantially flat controlled cross-sectional area disposed along a length of the material making up the electrical trace. In an overcurrent situation, the connection between a battery management system and a battery cell may be severed by the overcurrent melting the fusible link. The electrical traces may be spaced apart from one another in the circuit such that an overcurrent situation breaking the connection between one cell and the battery management system would not affect adjacent electrical traces not having an overcurrent situation.

A fuse element, in particular suited for use in electric and/or electronic circuits constructed by multilayer technology, including a printed circuit board substrate material, which is usable particularly in the multilayer technology and is coated with a metal or metal alloy from which the fuse is generated by means of photolithographic and/or printing image-producing techniques and ensuing etching or engraving processes, is proposed. The fuse is distinguished in that the printed circuit board substrate material, on which the fuse can be provided, includes at least a high-temperature-stable, electrically insulating material, with a coefficient of thermal expansion that varies essentially analogously to the coefficient of thermal expansion of the metal or metal alloy from which the fuse is made.

A fuse element, in particular suited for use in electric and/or electronic circuits constructed by multilayer technology, including a printed circuit board substrate material, which is usable particularly in the multilayer technology and is coated with a metal or metal alloy from which the fuse is generated by means of photolithographic and/or printing image-producing techniques and ensuing etching or engraving processes, is proposed. The fuse is distinguished in that the printed circuit board substrate material, on which the fuse can be provided, includes at least a high-temperature-stable, electrically insulating material, with a coefficient of thermal expansion that varies essentially analogously to the coefficient of thermal expansion of the metal or metal alloy from which the fuse is made.

A novel temperature-triggered fuse device is configured to be activated at a designer-specified ambient temperature by utilizing wetting force among a pair of wetting material bays and a solder bridge or a solder ball. The solder bridge or the solder ball is typically positioned on top of the pair of wetting material bays separated by an electrically-insulated gap. Preferably, the wetting material bays are at least partly made of gold, nickel, or other elements suitable for generating an increased wetting force to the solder bridge or the solder ball upon increases in ambient temperature. The novel temperature-triggered fuse device can be integrated into various types of integrated circuits (IC's), or can function as a discrete fuse connected to one or more electronic components for robust protection from power surges and/or thermal runaway-related device malfunctions, meltdowns, or explosions. Various methods of producing the temperature-triggered fuse device are also disclosed herein.

A novel temperature-triggered fuse device is configured to be activated at a designer-specified ambient temperature by utilizing wetting force among a pair of wetting material bays and a solder bridge or a solder ball. The solder bridge or the solder ball is typically positioned on top of the pair of wetting material bays separated by an electrically-insulated gap. Preferably, the wetting material bays are at least partly made of gold, nickel, or other elements suitable for generating an increased wetting force to the solder bridge or the solder ball upon increases in ambient temperature. The novel temperature-triggered fuse device can be integrated into various types of integrated circuits (IC's), or can function as a discrete fuse connected to one or more electronic components for robust protection from power surges and/or thermal runaway-related device malfunctions, meltdowns, or explosions. Various methods of producing the temperature-triggered fuse device are also disclosed herein.

A fuse device and a fuse element having excellent rapid blowout properties and excellent insulation properties after blowout even in a size-reduced fuse device are provided. A fuse element constitutes a current path of a fuse device and blows out due to self-generated heat when a rating-exceeding current flows, a length W in a width direction perpendicular to a conduction direction being greater than a total length L in the conduction direction in the fuse element. In particular, the fuse element includes a low melting point metal layer and a high melting point metal layer, the low melting point metal layer eroding the high melting point metal layer when current flows to cause blowout.

A circuit board with integrated fusing includes an insulating substrate having a circuit trace formed on a surface thereof, the circuit trace including a first circuit trace portion and a second circuit trace portion. A fusible link electrically connects the first circuit trace portion to the second circuit trace portion, the fusible link including a planar surface extending from the first circuit trace portion to the second circuit trace portion. A dielectric reflow encapsulates the fusible link on the planar surface from the first circuit trace portion to the second circuit trace portion.

A circuit board with integrated fusing includes an insulating substrate having a circuit trace formed on a surface thereof, the circuit trace including a first circuit trace portion and a second circuit trace portion. A fusible link electrically connects the first circuit trace portion to the second circuit trace portion, the fusible link including a planar surface extending from the first circuit trace portion to the second circuit trace portion. A dielectric reflow encapsulates the fusible link on the planar surface from the first circuit trace portion to the second circuit trace portion.

A flexible printed circuit board according to an aspect of the present invention includes a base film having insulating properties and a conductive pattern laminated to one surface side of the base film. The conductive pattern forms part of a circuit and includes at least one fuse portion having a cross section smaller than the other part. The flexible printed circuit board includes at least one opening passing through front and rear surfaces on at least one of the right and left sides of the fuse portion in a two-dimensional view.