H01H85/143

HIGH-VOLTAGE FUSING APPARATUS
20220051865 · 2022-02-17 · ·

A high-voltage fusing apparatus includes a current fuse, a temperature fuse, and a current-carrying fuse. The current fuse is connected in series with the temperature fuse, and a series branch of the current fuse and the temperature fuse is connected in parallel with the current-carrying fuse. A resistance value of the current-carrying fuse is less than a resistance value of the current fuse, and a fusing temperature of the current-carrying fuse is lower than a fusing temperature of the temperature fuse. The high-voltage fusing apparatus can cut off a high-voltage circuit quickly, and effectively protect the high-voltage heating circuit from overheating.

HIGH-VOLTAGE FUSING APPARATUS
20220051865 · 2022-02-17 · ·

A high-voltage fusing apparatus includes a current fuse, a temperature fuse, and a current-carrying fuse. The current fuse is connected in series with the temperature fuse, and a series branch of the current fuse and the temperature fuse is connected in parallel with the current-carrying fuse. A resistance value of the current-carrying fuse is less than a resistance value of the current fuse, and a fusing temperature of the current-carrying fuse is lower than a fusing temperature of the temperature fuse. The high-voltage fusing apparatus can cut off a high-voltage circuit quickly, and effectively protect the high-voltage heating circuit from overheating.

CHIP FUSE MANUFACTURING METHOD AND CHIP FUSE
20170250046 · 2017-08-31 · ·

A method for manufacturing a chip fuse, comprises: a liquid film forming step for forming a liquid film of dispersion liquid having metal nanoparticles dispersed therein on a principal surface of a substrate; a fuse film forming step for forming a fuse film on the principal surface by irradiating the liquid film with laser light; and a first terminal forming step for forming first terminals that each connects to the fuse film on each of both end sides in a longitudinal direction of the fuse film on the principal surface.

CHIP FUSE MANUFACTURING METHOD AND CHIP FUSE
20170250046 · 2017-08-31 · ·

A method for manufacturing a chip fuse, comprises: a liquid film forming step for forming a liquid film of dispersion liquid having metal nanoparticles dispersed therein on a principal surface of a substrate; a fuse film forming step for forming a fuse film on the principal surface by irradiating the liquid film with laser light; and a first terminal forming step for forming first terminals that each connects to the fuse film on each of both end sides in a longitudinal direction of the fuse film on the principal surface.

FUSE FOR A DEVICE TO BE PROTECTED
20170236674 · 2017-08-17 ·

The object of the invention is a fuse for a device to be protected that is connected in series with the fuse, wherein the series connection is connected to a supply network with a first potential and with a second potential that is different from the first, wherein the fuse has a first contact and a second contact, with the second contact being used to electrically contact the device (8) to be protected, wherein the fuse has a fuse element that connects the first contact to the second contact, wherein the fuse also has an additional contact, with the additional contact being arranged so as to be insulated from the first contact and insulated from the second contact and, in an untripped state, is contactless with respect to the fuse element, with the first contact being directly connected to the first potential during operation and with the device to be protected being directly connected to the second potential (N) during operation, with the additional contact also being directly connected to the second potential during operation, and wherein a fourth contact is also provided that makes external triggering available, with triggering resulting in an electric arc that indirectly or directly causes the fuse element to fuse.

FUSE FOR A DEVICE TO BE PROTECTED
20170236674 · 2017-08-17 ·

The object of the invention is a fuse for a device to be protected that is connected in series with the fuse, wherein the series connection is connected to a supply network with a first potential and with a second potential that is different from the first, wherein the fuse has a first contact and a second contact, with the second contact being used to electrically contact the device (8) to be protected, wherein the fuse has a fuse element that connects the first contact to the second contact, wherein the fuse also has an additional contact, with the additional contact being arranged so as to be insulated from the first contact and insulated from the second contact and, in an untripped state, is contactless with respect to the fuse element, with the first contact being directly connected to the first potential during operation and with the device to be protected being directly connected to the second potential (N) during operation, with the additional contact also being directly connected to the second potential during operation, and wherein a fourth contact is also provided that makes external triggering available, with triggering resulting in an electric arc that indirectly or directly causes the fuse element to fuse.

FUSE ELEMENT, FUSE DEVICE, AND HEAT-GENERATOR-INTEGRATED FUSE DEVICE
20170236673 · 2017-08-17 · ·

A fuse device and a fuse element having excellent rapid blowout properties and excellent insulation properties after blowout even in a size-reduced fuse device are provided. A fuse element constitutes a current path of a fuse device and blows out due to self-generated heat when a rating-exceeding current flows, a length W in a width direction perpendicular to a conduction direction being greater than a total length L in the conduction direction in the fuse element. In particular, the fuse element includes a low melting point metal layer and a high melting point metal layer, the low melting point metal layer eroding the high melting point metal layer when current flows to cause blowout.

FUSE ELEMENT, FUSE DEVICE, AND HEAT-GENERATOR-INTEGRATED FUSE DEVICE
20170236673 · 2017-08-17 · ·

A fuse device and a fuse element having excellent rapid blowout properties and excellent insulation properties after blowout even in a size-reduced fuse device are provided. A fuse element constitutes a current path of a fuse device and blows out due to self-generated heat when a rating-exceeding current flows, a length W in a width direction perpendicular to a conduction direction being greater than a total length L in the conduction direction in the fuse element. In particular, the fuse element includes a low melting point metal layer and a high melting point metal layer, the low melting point metal layer eroding the high melting point metal layer when current flows to cause blowout.

HIGH CURRENT ONE-PIECE FUSE ELEMENT AND SPLIT BODY

A compact, high breaking capacity fuse that includes a top and bottom insulative layer and a single piece fusible element disposed between the top and bottom insulative layer. The top and bottom insulative layers include cavities that are aligned at assembly to form a chamber in which a fusible element portion of the single piece fusible element is disposed. The single piece fusible element additionally includes terminal portions that extend along outer surfaces of the top and bottom insulative layers.

HIGH CURRENT ONE-PIECE FUSE ELEMENT AND SPLIT BODY

A compact, high breaking capacity fuse that includes a top and bottom insulative layer and a single piece fusible element disposed between the top and bottom insulative layer. The top and bottom insulative layers include cavities that are aligned at assembly to form a chamber in which a fusible element portion of the single piece fusible element is disposed. The single piece fusible element additionally includes terminal portions that extend along outer surfaces of the top and bottom insulative layers.