Charged particle assessment tools and inspection methods are disclosed. In one arrangement, a condenser lens array divides a beam of charged particles into a plurality of sub-beams. Each sub-beam is focused to a respective intermediate focus. Objective lenses downstream from the intermediate foci project sub-beams from the condenser lens array onto a sample. A path of each sub-beam is substantially a straight line from each condenser lens to a corresponding objective lens.

A multi-electron beam inspection apparatus includes first sample hold circuits, each configured to include a capacitor and a switch arranged for each of electrodes of each of a plurality of multipoles, and to hold, using the capacitor and the switch, a potential to be applied to the each of the electrodes, power sources configured to apply potentials to the plurality of first sample hold circuits, a control circuit configured to control the plurality of first sample hold circuits such that the plurality of potentials having been applied to the plurality of first sample hold circuits are held, in synchronization with swinging back of the collective beam deflection by the objective deflector, by a plurality of second sample hold circuits selected from the plurality of first sample hold circuits, and a detector configured to detect multiple secondary electron beams emitted because the substrate is irradiated with the multiple primary electron beams.

A multi-electron beam inspection apparatus includes first sample hold circuits, each configured to include a capacitor and a switch arranged for each of electrodes of each of a plurality of multipoles, and to hold, using the capacitor and the switch, a potential to be applied to the each of the electrodes, power sources configured to apply potentials to the plurality of first sample hold circuits, a control circuit configured to control the plurality of first sample hold circuits such that the plurality of potentials having been applied to the plurality of first sample hold circuits are held, in synchronization with swinging back of the collective beam deflection by the objective deflector, by a plurality of second sample hold circuits selected from the plurality of first sample hold circuits, and a detector configured to detect multiple secondary electron beams emitted because the substrate is irradiated with the multiple primary electron beams.

An electrostatic device includes a top and a bottom silicon layer, around an insulating buried layer. A beam opening allows a beam of charged particles to travel through. The device is encapsulated in an insulating layer. One or more electrodes and ground planes are deposited on the insulating layer. These also cover the inside of the beam opening. Electrodes and ground planes are physically and electrically separated by micro-trenches and micro-undercuts that provide shadow areas when the conductive areas are deposited. Electrodes may be shaped as elongated islands and may include portions overhanging the top silicon layer, supported by electrode-anchors.

Manufacturing starts from a single wafer including the top, buried, and bottom layers, or it starts from two separate silicon wafers. Manufacturing includes steps to form the top and bottom beam openings and microstructures, to encapsulate the device in an insulating layer, and to deposit electrodes and ground areas.

An electrostatic device includes a top and a bottom silicon layer, around an insulating buried layer. A beam opening allows a beam of charged particles to travel through. The device is encapsulated in an insulating layer. One or more electrodes and ground planes are deposited on the insulating layer. These also cover the inside of the beam opening. Electrodes and ground planes are physically and electrically separated by micro-trenches and micro-undercuts that provide shadow areas when the conductive areas are deposited. Electrodes may be shaped as elongated islands and may include portions overhanging the top silicon layer, supported by electrode-anchors.

Manufacturing starts from a single wafer including the top, buried, and bottom layers, or it starts from two separate silicon wafers. Manufacturing includes steps to form the top and bottom beam openings and microstructures, to encapsulate the device in an insulating layer, and to deposit electrodes and ground areas.

For an electron beam system, a Wien filter is in the path of the electron beam between a transfer lens and a stage. The system includes a ground electrode between the Wien filter and the stage, a charge control plate between the ground electrode and the stage, and an acceleration electrode between the ground electrode and the charge control plate. The system can be magnetic or electrostatic.

For an electron beam system, a Wien filter is in the path of the electron beam between a transfer lens and a stage. The system includes a ground electrode between the Wien filter and the stage, a charge control plate between the ground electrode and the stage, and an acceleration electrode between the ground electrode and the charge control plate. The system can be magnetic or electrostatic.

In one embodiment, a charged particle beam writing apparatus includes a positioning deflector adjusting an irradiation position of a charged particle beam radiated to a substrate which is a writing target, a fixed deflector which is disposed downstream of the positioning deflector in a traveling direction of the charged particle beam, and in which an amount of deflection is fixed, a focus correction lens performing focus correction on the charged particle beam according to a surface height of the substrate, and an object lens focusing the charged particle beam.

In one embodiment, a charged particle beam writing apparatus includes a positioning deflector adjusting an irradiation position of a charged particle beam radiated to a substrate which is a writing target, a fixed deflector which is disposed downstream of the positioning deflector in a traveling direction of the charged particle beam, and in which an amount of deflection is fixed, a focus correction lens performing focus correction on the charged particle beam according to a surface height of the substrate, and an object lens focusing the charged particle beam.

An apparatus comprising a beam emitter to emit a beam comprising electrons, ions or laser-light photons toward a target substrate. A motion sensor to detect mechanical vibrations of the target substrate. The motion sensor is mechanically coupled to the target substrate, a processor coupled to an output of the motion sensor. The processor is to generate a vibration correction signal proportional to the mechanical vibrations detected by the motion sensor, and beam steering optics coupled to the processor. The beam steering optics are to deflect the beam according to the vibration correction signal to compensate for the mechanical vibrations of the target substrate.