Patent classifications
H01J37/32064
METHODS AND SYSTEMS FOR INCREASING ENERGY OUTPUT IN Z-PINCH PLASMA CONFINEMENT SYSTEM
Methods and systems are provided for increasing energy output from Z-pinch and other plasma confinement systems. In one example, a system may include memory storing instructions that, if executed by one or more processors, cause the system to adjust one or more parameters to generate a magnetic field which is sufficiently strong to axially compress a fuel gas to induce thermonuclear fusion and increase a fusion energy gain factor greater than a fusion energy gain factor limit attainable by the thermonuclear fusion. In certain examples, adjusting the one or more parameters may include adjusting a duty cycle of a discharge current applied to the fuel gas based, at least in part, on an amount of thermal collisions between fusion byproducts and the fuel gas. In certain examples, by adjusting the duty cycle, the magnetic field may be adjusted to induce or increase the thermal collisions.
Base conducting layer beneath graphite layer of ceramic cathode for use with cathodic arc deposition
Cathode structures are disclosed for use with pulsed cathodic arc deposition systems for forming diamond-like carbon (DLC) films on devices, such as on the sliders of hard disk drives. In illustrative examples, a base layer composed of an electrically- and thermally-conducting material is provided between the ceramic substrate of the cathode and a graphitic paint outer coating, where the base layer is a silver-filled coating that adheres to the ceramic rod and the graphitic paint. The base layer is provided, in some examples, to achieve and maintain a relatively low resistance (and hence a relatively high conductivity) within the cathode structure during pulsed arc deposition to avoid issues that can result from a loss of conductivity within the graphitic paint over time as deposition proceeds. Examples of suitable base material compounds are described herein where, e.g., the base layer can withstand temperatures of 1700° F. (927° C.).
Pulsed DC Power For Deposition Of Film
A vapor deposition system and methods of operation thereof are disclosed. The vapor deposition system includes a vacuum chamber; a dielectric target within the vacuum chamber, the dielectric target having a front surface and a thickness; a substrate support within the vacuum chamber, the substrate support having a front surface spaced from the front surface of the dielectric target to form a process gap; and a signal generator connected to the dielectric target to generate a plasma in the vacuum chamber, the signal generator comprises a power source, the power source configured to prevent charge accumulation in the dielectric target. The method includes applying power to a dielectric target within a vacuum chamber to generate a plasma in a process gap between the dielectric target and a substrate support and pulsing the power applied to the dielectric target to prevent charge accumulation.
Base conducting layer beneath graphite layer of ceramic cathode for use with cathodic arc deposition
Cathode structures are disclosed for use with pulsed cathodic arc deposition systems for forming diamond-like carbon (DLC) films on devices, such as on the sliders of hard disk drives. In illustrative examples, a base layer composed of an electrically- and thermally-conducting material is provided between the ceramic substrate of the cathode and a graphitic paint outer coating, where the base layer is a silver-filled coating that adheres to the ceramic rod and the graphitic paint. The base layer is provided, in some examples, to achieve and maintain a relatively low resistance (and hence a relatively high conductivity) within the cathode structure during pulsed arc deposition to avoid issues that can result from a loss of conductivity within the graphitic paint over time as deposition proceeds. Examples of suitable base material compounds are described herein where, e.g., the base layer can withstand temperatures of 1700° F. (927° C.).
Cathodic Arc Ignition Device
An arc ignition device for cathodic arc deposition of a target material onto a substrate, comprising a trigger finger arranged moveable between a contacting position and a resting position, wherein in the contacting position a side surface of an adjacent target can be physically contacted by the trigger finger, and in the resting position the adjacent target cannot be contacted by the trigger finger, wherein during cathodic arc deposition of a target material, the trigger finger is arranged movable between the contacting position and the resting position in such a way that the contamination of the trigger finger with deposited target material during the cathodic arc deposition of the target material can be minimized.
HELICAL PLUG FOR REDUCTION OR PREVENTION OF ARCING IN A SUBSTRATE SUPPORT
Embodiments of a plug for use in an electrostatic chuck are provided herein. In some embodiments, a plug for use in an electrostatic chuck includes a polymer sleeve having a central opening; and a core disposed in the central opening of the polymer sleeve, the core having a central protrusion and a peripheral ledge, wherein an outer surface of the core includes a helical channel extending from a lower surface of the core towards the peripheral ledge to at least partially define a gas flow path through the plug, and wherein the peripheral ledge is disposed between an upper surface of the polymer sleeve and the lower surface of the core.
ION GENERATION DEVICE AND ION GENERATION METHOD
There is provided an ion generation device including a plasma generation chamber that generates a plasma for extracting an ion, and a heating device configured to heat the plasma generation chamber by irradiating a member that defines the plasma generation chamber or a member that is to be exposed to the plasma generated inside the plasma generation chamber with a laser beam.
Ion plasma disintegrator
An electronic device incorporating a high voltage power supply connected to a pair of metal plates spaced to maintain a continuous high current arc of electricity creating an Ion Plasma discharge for the purpose of vaporizing documents placed between the plates. Magnetic containment coils around the outside of the metal plates are phase synchronized to the magnetic field created by the Ion Plasma arc to maintain the position of the arc between the plates and to direct the position of the arc in a predetermined pattern to search for any material between the plates that has not been disintegrated.
Apparatus of reactive cathodic arc evaporator for plating lithium-compound thin film and method thereof
An apparatus is provided for plating a lithium (Li)-compound thin film. In the thin film, Li is obtained through thermal evaporation, and titanium (Ti) or other metal by using arc plasma. The elements converted into gas phase are co-deposited in a plasma environment with a reaction gas (oxygen) to be activated as excited atoms or molecules for reaction. In the end, all of the constituent elements are deposited on a substrate to form the Li-compound thin film. Thus, reaction efficiency is high with a fast deposition rate. The composition ratio of each element is independently determined to control its yield according to the requirement. Hence, the present invention greatly enhances the fabrication rate with lowered production cost for applications in the thin-film battery industries.
BASE CONDUCTING LAYER BENEATH GRAPHITE LAYER OF CERAMIC CATHODE FOR USE WITH CATHODIC ARC DEPOSITION
Cathode structures are disclosed for use with pulsed cathodic arc deposition systems for forming diamond-like carbon (DLC) films on devices, such as on the sliders of hard disk drives. In illustrative examples, a base layer composed of an electrically- and thermally-conducting material is provided between the ceramic substrate of the cathode and a graphitic paint outer coating, where the base layer is a silver-filled coating that adheres to the ceramic rod and the graphitic paint. The base layer is provided, in some examples, to achieve and maintain a relatively low resistance (and hence a relatively high conductivity) within the cathode structure during pulsed arc deposition to avoid issues that can result from a loss of conductivity within the graphitic paint over time as deposition proceeds. Examples of suitable base material compounds are described herein where, e.g., the base layer can withstand temperatures of 1700 F. (927 C.).