Embodiments disclosed herein include a processing tool for measuring neutral radical concentrations. In an embodiment, the processing tool comprises a processing chamber, and a neutral radical mass spectrometry (NRMS) analyzer fluidically coupled to the processing chamber. In an embodiment, the NRMS analyzer comprises a first chamber fluidically coupled to the processing chamber, where the first chamber comprises a modulator, and a second chamber fluidically coupled to the first chamber, where the second chamber is a residual gas analyzer or a mass spectrometer. In an embodiment, an unobstructed line of sight passes from the processing chamber to the second chamber.

A measuring device is provided. The measuring device includes a base substrate, sensor electrodes, a temperature sensor, a high frequency oscillator, C/V conversion circuits for generating voltage signals corresponding to electrostatic capacitances of the sensor electrodes, an A/D converter for converting the voltage signals to digital values, a calculation unit for calculating measurement values indicating the electrostatic capacitances based on the digital values, and phase control circuits connected between the sensor electrodes and the high-frequency oscillator. Each of the conversion circuits includes an operational amplifier, and the high-frequency oscillator is connected to a non-inverting input terminal of the amplifier and is connected to an inverting input terminal thereof through a corresponding phase control circuit. The calculation unit stores parameters for setting admittances of the phase control circuits in association with temperatures and adjusts the admittances of the phase control circuits using a parameter associated with a detected temperature.

A method of forming a silicon nitride film on a substrate having a recess pattern formed in a surface thereof, includes: forming the silicon nitride film in conformity to the surface of the substrate by supplying each of a raw material gas containing silicon and a nitriding gas for nitriding the raw material gas into a processing container in which the substrate is accommodated; shrinking the silicon nitride film such that a thickness thereof is reduced from a bottom side toward an upper side of the recess pattern by supplying a plasmarized shaping gas for shaping the silicon nitride film to the substrate in a state where the supply of the raw material gas containing silicon into the processing container is stopped; and burying the silicon nitride film in the recess pattern by alternately and repeatedly performing the forming the silicon nitride film and the shrinking the silicon nitride film.

Radio frequency power conveyed to individual process stations of a multi-station integrated circuit fabrication chamber may be adjusted so as to bring the rates at which fabrication processes occur, and/or fabrication process results, into alignment with one another. Such adjustment in radio frequency power, which may be accomplished via adjusting one or more reactive elements of a RF distribution network, may give rise to an imbalance in power delivered to each individual process station.

Exemplary semiconductor processing systems may include a chamber body having sidewalls and a base. The semiconductor processing systems may include a substrate support extending through the base of the chamber body. The substrate support may include a support plate. The substrates support may include a shaft coupled with the support plate. The semiconductor processing systems may include a liner positioned within the chamber body and positioned radially outward of a peripheral edge of the support plate. An inner surface of the liner may include an emissivity texture.

Exemplary substrate support assemblies may include an electrostatic chuck body that defines a substrate support surface. The substrate support surface may define a plurality of protrusions that extend upward from the substrate support surface. A density of the plurality of protrusions within an outer region of the substrate support surface may be greater than in an inner region of the substrate support surface. The substrate support assemblies may include a support stem coupled with the electrostatic chuck body. The substrate support assemblies may include an electrode embedded within the electrostatic chuck body.

An apparatus for contactless transportation of a device in a vacuum processing system is described. The apparatus includes: a magnetic transportation arrangement for providing a magnetic levitation force (F.sub.L) for levitating the device, the magnetic transportation arrangement comprising one or more active magnetic units; a sensor for monitoring a motion of the device, and a controller configured for controlling the one or more active magnetic units based on a signal provided by the sensor.

A plasma processing device includes: a plurality of processing chambers; a junction exhaust pipe into which a plurality of exhaust flow paths for evacuating interiors of the plurality of processing chambers joins; and a plurality of branch exhaust pipes disposed between the plurality of exhaust flow paths and the junction exhaust pipe and connecting the junction exhaust pipe to the plurality of exhaust flow paths, respectively, wherein each of the plurality of branch exhaust pipes includes a mechanism, which is disposed in a flow path of the branch exhaust pipe, to deactivate energy of hot electrons flowing through the flow path.

Disclosed is a ring carrier used for transferring a ring member. The ring carrier includes a body having a plate shape, and a guide part protruding from an upper surface of the body to face an inner periphery of the ring member, and an alignment hole used when the ring carrier is aligned is formed in the body to pass through the body.

Exemplary semiconductor processing chambers may include a substrate support positioned within a processing region of the semiconductor processing chamber. The chamber may include a lid plate. The chamber may include a gasbox positioned between the lid plate and the substrate support. The gasbox may be characterized by a first surface and a second surface opposite the first surface. The gasbox may define a central aperture. The gasbox may define an annular channel in the first surface of the gasbox extending about the central aperture through the gasbox. The gasbox may include an annular cover extending across the annular channel defined in the first surface of the gasbox. The chamber may include a blocker plate positioned between the gasbox and the substrate support. The chamber may include a ferrite block positioned between the lid plate and the blocker plate.