Embodiments of this disclosure describe an electrode biasing scheme that enables maintaining a nearly constant sheath voltage and thus creating a mono-energetic IEDF at the surface of the substrate that consequently enables a precise control over the shape of IEDF and the profile of the features formed in the surface of the substrate.

A method is provided for depositing a layer on a substrate inside a vacuum chamber by a magnetron sputtering device comprising at least two magnetron cathodes, each equipped with one target, at least one additional electrode, wherein a separate power supply unit is allocated to each magnetron cathode and wherein, in addition to at least one working gas, at least one reactive gas is introduced into the vacuum chamber. In a first phase, a pulsed negative direct current voltage is conducted from each power supply unit to the corresponding magnetron cathode, wherein the power supply units are operated in the push-pull mode. In a second phase, the pulsed direct current voltages provided by the power supply units are switched between the corresponding magnetron cathode and the additional electrode. An electric voltage is applied to the substrate or an electrode at the back of the substrate.

In a plasma enhanced physical vapor deposition of a material onto workpiece, a metal target faces the workpiece across a target-to-workpiece gap less than a diameter of the workpiece. A carrier gas is introduced into the chamber and gas pressure in the chamber is maintained above a threshold pressure at which mean free path is less than 5% of the gap. RF plasma source power from a VHF generator is applied to the target to generate a capacitively coupled plasma at the target, the VHF generator having a frequency exceeding 30 MHz. The plasma is extended across the gap to the workpiece by providing through the workpiece a first VHF ground return path at the frequency of the VHF generator.

A method of processing a substrate includes: sputtering target material for a first amount of time using a first plasma formed from an inert gas and a first amount of power; determining a first counter, based on a product of a flow rate of the inert gas, the first amount of power, and the first amount of time; sputtering a metal compound material for a second amount of time using a second plasma formed from a process gas comprising a reactive gas and an inert gas and a second amount of power; determining a second counter based on a product of a flow rate of the process gas, the second amount of power, and the second amount of time; determining a third counter; and depositing a metal compound layer onto a predetermined number of substrates, wherein a deposition time for each substrate is adjusted based on the third counter.

A power transfer system is described for transfer of electrical power to a sputter target in a sputter device. It comprises a first part comprising a contact surface positionable against a first part of an endblock of the sputter device, a second part inseparably connected to the first part and a third part, and a third part comprising a contact surface positionable against a second part of the endblock or directly against a sputter target when mounted on the endblock. At least two of the three parts are formed as one monolithic piece. One of the parts of the power transfer system is resilient such that, when mounted, the power transfer system is clamped between the first part of the endblock and the second part of the endblock or the sputter target. This part is also responsible for the transfer of electrical power.

A sputtering system and method are disclosed. The system has at least one dual magnetron pair having a first magnetron and a second magnetron, each magnetron configured to support target material. The system also has a DMS component having a DC power source in connection with switching components and voltage sensors. The DMS component is configured to independently control an application of power to each of the magnetrons, and to provide measurements of voltages at each of the magnetrons. The system also has one or more actuators configured to control the voltages at each of the magnetrons using the measurements provided by the DMS component. The DMS component and the one or more actuators are configured to balance the consumption of the target material by controlling the power and the voltage applied to each of the magnetrons, in response to the measurements of voltages at each of the magnetrons.

Provided a plasma process apparatus including a chamber including a plasma processing space, a substrate stage included in the chamber, the substrate stage including a seating surface, a target including deposition particles to be deposited on the substrate, a gas supplier configured to supply gas into the chamber, a plasma generator configured to generate plasma from the gas, the plasma generator configured to deposit the deposition particles on the substrate through the plasma, at least one permanent magnet on the target being rotatable and configured to distribute the plasma on the target through a magnetic field, and a coil assembly on an outer wall of the chamber and assembly including first through third side coils inclined and being configured to generate first through third vectors, respectively, and the coil assembly being configured to generate a magnetic field vector guiding the plasma through a combination of the first through third vectors.

An arc treatment device includes an arc detector operable to detect whether an arc is present in a plasma chamber, an arc energy determiner operable to determine an arc energy value based on an energy supplied to the plasma chamber while the arc is present in the plasma chamber, and a break time determiner operable to determine a break time based on the determined arc energy value.

There is provided a radio frequency power source device configured to change a voltage ratio between two output end voltages, by switching a connection state of a voltage divider that divides the radio frequency voltage, in such a manner that the radio frequency voltage is divided into voltage outputs in antiphase with each other with respect to ground potential, and high voltage and low voltage are delivered in switching manner. Switching of the connection state in the voltage divider enables selective delivery of voltage having different values, high voltage or low voltage, and by selecting and delivering high voltage for the time high voltage is required, reduction of the voltage output from the radio frequency output circuit is prevented.

Connection includes transistor, transistor exciter controlled by the frequency generator and/or programmable unit, the power source of voltage, the unit with capacitors. The voltage power source is connected to the transistor through the unit with capacitors. The stabilizing non-inductive resistor is connected to the power supply branch for the magnetron with transistor. The power stabilizing non-inductive resistor is a resistor with the wire wound by Ayrton-Perry-type winding and/or the resistor with low value of the parasitic inductance on the basis of thin layers. The electronic control circuits of the gate of the transistor include a frequency generator with the cut-off switch and with support elements and also include an exciter with support elements. The connection with the stabilizing non-inductive resistor is used in case of the bipolar and/or multi-circuit pulse plasma generator. The depolarization voltage is led from the outside source through the capacitor to the depolarization block.