An emitter with a protective cap layer on an exterior surface of the emitter is disclosed. The emitter can have a diameter of 100 nm or less. The protective cap layer includes ruthenium. Ruthenium is resistant to oxidation and carbon growth. The protective cap layer also can have relatively low sputter yields to withstand erosion by ions. The emitter may be part of a system with an electron beam source. An electric field can be applied to the emitter and an electron beam can be generated from the emitter. The protective cap layer may be applied to the emitter by sputter deposition, atomic layer deposition (ALD), or ion sputtering.

A multi-column electron beam device includes an electron source comprising multiple field emitters fabricated on a surface of a silicon substrate. To prevent oxidation of the silicon, a thin, contiguous boron layer is disposed directly on the output surface of the field emitters. The field emitters can take various shapes including a pyramid, a cone, or a rounded whisker. Optional gate layers may be placed on the output surface near the field emitters. The field emitter may be p-type or n-type doped. Circuits may be incorporated into the wafer to control the emission current. A light source may be configured to illuminate the electron source and control the emission current. The multi-column electron beam device may be a multi-column electron beam lithography system configured to write a pattern on a sample.

A multi-column electron beam device includes an electron source comprising multiple field emitters fabricated on a surface of a silicon substrate. To prevent oxidation of the silicon, a thin, contiguous boron layer is disposed directly on the output surface of the field emitters. The field emitters can take various shapes including a pyramid, a cone, or a rounded whisker. Optional gate layers may be placed on the output surface near the field emitters. The field emitter may be p-type or n-type doped. Circuits may be incorporated into the wafer to control the emission current. A light source may be configured to illuminate the electron source and control the emission current. The multi-column electron beam device may be a multi-column electron beam lithography system configured to write a pattern on a sample.

The emitter of the present invention includes a nanowire. The nanowire is formed from a hafnium carbide (HfC) single crystal, and at least an end portion of the hafnium carbide single crystal, from which electrons are to be emitted, is covered with hafnium oxide (HfO.sub.2). In the emitter, the thickness of the hafnium oxide may be 1 nm to 20 nm.

A carbon nanomaterial functionalized needle tip is modified with a low work function material. The needle tip is formed by combining a carbon nanomaterial with a material of a needle tip through a covalent bond. The interior or outer surface of the carbon nanomaterial is modified with a low work function material. The material of the needle tip is a metal which can be any of tungsten, iron, cobalt, nickel, and titanium. The carbon nanomaterial can be carbon nanocone or carbon nanotube. The tip of the carbon nanomaterial has the same orientation as the metal needle tip. The low work function material can be selected from metals, metal carbides, metal oxides, borides, nitrides, and endohedral metallofullerene. The carbon nanomaterial functionalized needle tip has a lower electron emission barrier, and can effectively reduce the electric field intensity required for electron emission, and improve the emission current and emission efficiency.