A charged particle beam device, comprising a charged particle source configured to emit a charged particle beam; a movable stage comprising an assembly of aperture arrays having at least a first aperture array and a second aperture array, the movable stage is configured to align the assembly of aperture arrays with the charged particle beam, and at least one aperture array comprises a shielding tube coupled to the movable stage.

Embodiments herein provide systems and methods for multi-area selecting etching. In some embodiments, a system may include a plasma source delivering a plurality of angled ion beams to a substrate, the substrate including a plurality of devices. Each of the plurality of devices may include a first angled grating and a second angled grating. The system may further include a plurality of blocking masks positionable between the plasma source and the substrate. A first blocking mask of the plurality of blocking masks may include a first set of openings permitting the angled ion beams to pass therethrough to form the first angled gratings of each of the plurality of devices. A second blocking mask of the plurality of blocking masks may include a second set of openings permitting the angled ion beams to pass therethrough to form the second angled gratings of each of the plurality of devices.

Variations in charged-particle-beam (CPB) source location are determined by scanning an alignment aperture that is fixed with respect to a beam defining aperture in a CPB, particularly at edges of a defocused CPB illumination disk. The alignment aperture is operable to transmit a CPB portion to a secondary emission surface that produces secondary emission directed to a scintillator element. Scintillation light produced in response is directed out of a vacuum enclosure associated with the CPB via a light guide to an external photodetection system.

When a charged particle beam aperture having an annular shape is used, since a charged particle beam directly above the optical axis having the highest current density in the charged particle beam is blocked, it is difficult to dispose the charged particle beam aperture at an optimal mounting position. An charged particle beam apparatus includes a charged particle beam source that generates a charged particle beam, a charged particle beam aperture, a charged particle beam aperture power supply that applies a voltage to the charged particle beam aperture, an objective lens for focusing the charged particle beam on a sample, a detector that detects secondary charged particles emitted by irradiating the sample with the charged particle beam, a computer that forms a charged particle beam image based on the secondary charged particles detected by the detector, in which the position of the charged particle beam aperture is set so that the charged particle beam image does not move and changes concentrically in synchronization with the AC voltage, in a state where an AC voltage is applied to the charged particle beam aperture by the charged particle beam aperture power supply.

When using a charged particle beam aperture having a ring shape in a charged particle beam device, the charged particle beam with the highest current density immediately above the optical axis, among the charged particle beams is blocked, so that it is difficult to dispose the charged particle beam aperture at the optimal mounting position. Therefore, in addition to the ring-shaped charged particle beam aperture, a hole-shaped charged particle beam aperture is provided, and it is possible to switch between the case where the ring-shaped charged particle beam aperture is disposed on the optical axis of the charged particle beam and the case where the hole-shaped charged particle beam aperture is disposed on the optical axis of the charged particle beam.

Variable multi-beam charged particle devices for inspection of a sample include a multi-beam source that produces a plurality of charged particle beamlets, an objective lens, a sample holder for holding the sample between the objective lens and the multi-beam source, and a focusing column that directs the plurality of charged particle beamlets so that they are incident upon the sample. The focusing column directs the plurality of charged beams such that there are one or more crossovers of the plurality of charged particle beamlets, where each crossover corresponds to a point where the plurality of charged particle beamlets pass through a common location. The variable multi-beam charged particle devices also include a variable aperture that is configured to vary the current of the plurality of charged particle beamlets, and which is located at a final crossover of the one or more crossovers that is most proximate to the sample.

A multi-beam charged particle system includes: a vacuum enclosure having an opening covered by a door; a particle source configured to generate charged particles, wherein the particle source is arranged within the vacuum enclosure; at least one multi-aperture plate module including at least one multi-aperture plate and a base; and a transfer box having an opening covered by a door. The at least one multi-aperture plate includes a plurality of apertures. The base is configured to hold the at least one multi-aperture plate. The base is configured to be fixed relative to the vacuum enclosure such that the multi-aperture plate module is arranged in an interior of the vacuum enclosure such that, during operation of the particle beam system, particles traverse the plural multi-aperture plates through the apertures of the plates.

A multi-beam inspection apparatus supporting a plurality of operation modes is disclosed. The charged particle beam apparatus for inspecting a sample supporting a plurality of operation modes comprises a charged particle beam source configured to emit a charged particle beam along a primary optical axis, a movable aperture plate, movable between a first position and a second position, and a controller having circuitry and configured to change the configuration of the apparatus to switch between a first mode and a second mode. In the first mode, the movable aperture plate is positioned in the first position and is configured to allow a first charged particle beamlet derived from the charged particle beam to pass through. In the second mode, the movable aperture plate is positioned in the second position and is configured to allow the first charged particle beamlet and a second charged particle beamlet to pass through.

A charged particle imaging apparatus comprising: A specimen holder, for holding a specimen; A particle-optical column, for: Producing a plurality of charged particle beams, by directing a progenitor charged particle beam onto an aperture plate having a corresponding plurality of apertures within a footprint of the progenitor beam; Directing said beams toward said specimen,
wherein: Said aperture plate comprises a plurality of different zones, which comprise mutually different aperture patterns, arranged within said progenitor beam footprint; The particle-optical column comprises a selector device, located downstream of said aperture plate, for selecting a beam array from a chosen one of said zones to be directed onto the specimen.

Systems and methods for implementing charged particle flooding in a charged particle beam apparatus are disclosed. According to certain embodiments, a charged particle beam system includes a charged particle source and a controller which controls the charged particle beam system to emit a charged particle beam in a first mode where the beam is defocused and a second mode where the beam is focused on a surface of a sample.