To implement a charged particle beam device including an iron thin film spin detector. The charged particle beam device includes: a charged particle column 201 configured to perform scanning on a sample 203 with a charged particle beam 202; a spin detector including an iron thin film 207, a plurality of coils 208 configured to magnetize the iron thin film, a conveying lens 206 configured to focus, on the iron thin film, secondary electrons 204 emitted from the sample due to irradiation of the charged particle beam, and an electron detector 210 configured to detect backscattered electrons 209 emitted due to the iron thin film being irradiated with the secondary electrons; and a control unit 217 configured to control switching of a magnetization direction of the iron thin film in synchronization with scanning of one line with the charged particle beam from the charged particle column.

An electron beam system for wafer inspection and review of 3D devices provides a depth of focus up to 20 microns. To inspect and review wafer surfaces or sub-micron-below surface defects with low landing energies in hundreds to thousands of electron Volts, a Wien-filter-free beam splitting optics with three magnetic deflectors can be used with an energy-boosting upper Wehnelt electrode to reduce spherical and chromatic aberration coefficients of the objective lens.

To measure a depth of a three-dimensional structure, for example, a hole or a groove, formed in a sample without preparing information in advance, an electron microscope detects, among emitted electrons generated by irradiating a sample with a primary electron beam, an emission angle in a predetermined range, the emission angle being formed between an axial direction of the primary electron beam and an emission direction of the emitted electrons, and outputs a detection signal corresponding to the number of the emitted electrons detected. An emission angle distribution of a detection signal is obtained based on a plurality of detection signals, and an opening angle is obtained based on a change point of the emission angle distribution, the opening angle being based on an optical axis direction of the primary electron beam with respect to the bottom portion of the three-dimensional structure.

A charged particle beam apparatus covering a wide range of detection angles of charged particles emitted from a sample includes an objective lens for converging charged particle beams emitted from a charged particle source and a detector for detecting charged particles emitted from a sample. The objective lens includes inner and outer magnetic paths which are formed so as to enclose a coil. A first inner magnetic path is disposed at a position opposite to an optical axis of the charged particle beams. A second inner magnetic path, formed at a slant with respect to the optical axis of the charged particle beams, includes a leading end. A detection surface of the detector is disposed at the outer side from a virtual straight line that passes through the leading end and that is parallel to the optical axis of the charged particle beams.

Disclosed herein is a system for profiling holes in non-opaque samples. The system includes: (i) an e-beam source configured to project an e-beam into an inspection hole in a sample, such that a wall of the inspection hole is struck and a localized electron cloud is produced; (ii) a light sensing infrastructure configured to sense cathodoluminescent light, generated by the electron cloud; and (iii) a computational module configured to analyze the measured signal to obtain the probed depth at which the wall was struck. A lateral offset, and/or orientation, of the e-beam is controllable, so as to allow generating localized electron clouds at each of a plurality of depths inside the inspection hole, and thereby obtain information at least about a two-dimensional geometry of the inspection hole.

To implement a calibration sample by which an incident angle can be measured with high accuracy, an electron beam adjustment method, and an electron beam apparatus using the calibration sample. To adjust an electron beam using a calibration sample, the calibration sample includes a silicon single crystal substrate 201 whose upper surface is a {110} plane, a first recess structure 202 opening in the upper surface and extending in a first direction, and a second recess structure 203 opening in the upper surface and extending in a second direction intersecting the first direction, in which the first recess structure and the second recess structure each include a first side surface and a first bottom surface that intersects the first side surface, and a second side surface and a second bottom surface that intersects the second side surface, the first side surface and the second side surface are {111} planes, and the first bottom surface and the second bottom surface are crystal planes different from the {110} planes.

A system is disclosed. In one embodiment, the system includes a scanning electron microscopy sub-system including an electron source configured to generate an electron beam and an electron-optical assembly including one or more electron-optical elements configured to direct the electron beam to the specimen. In another embodiment, the system includes one or more grounding paths coupled to the specimen, the one or more grounding paths configured to generate one or more transmission signals based on one or more received electron beam-induced transmission currents. In another embodiment, the system includes a controller configured to: generate control signals configured to cause the scanning electron microscopy sub-system to scan the portion of the electron beam across a portion of the specimen; receive the transmission signals via the one or more grounding paths; and generate transmission current images based on the transmission signals.

The purpose of the present invention is to provide a charged-particle beam apparatus capable of performing various types of signal discriminations according to the shape and the size of a sample. The present invention proposes a charged-particle beam apparatus for irradiating a sample disposed in a vacuum vessel with a charged particle beam. The charged-particle beam apparatus is provided with: a first light-generating surface for generating light on the basis of the collision of charged particles released from the sample; a light-guiding member for guiding the generated light to the outside of the vacuum vessel while maintaining the generation distribution of the light generated at the first light-generating surface; a photodetector for detecting the light guided by the light-guiding member to the outside of the vacuum vessel; and a light-transmission restricting member for restricting transmission of the light guided by the light-guiding member between the photodetector and the light-guiding member.

Deflection of a secondary beam, and astigmatism correction of a primary beam or of the secondary beam are carried out using a multi-pole electromagnetic deflector which deflects the path of the secondary beam toward a detector.

There are provided: a method for image adjustment using a charged particle beam device, and a charged particle beam system, capable of appropriately adjusting a contrast and brightness as well as a focus for a measurement region present in a deep portion of a sample even when a depth of the measurement region is unknown. A method for image adjustment performed by a computer system controlling a charged particle beam device includes: by the computer system, specifying a measurement region from a captured image of a sample; performing centering processing based on the specified measurement region; extracting the measurement region in a field of view that has undergone the centering processing or the image that has undergone the centering processing; adjusting a contrast and brightness for the extracted measurement region; and adjusting a focus for the measurement region in which the contrast and brightness have been adjusted.