In one embodiment, a charged particle beam writing apparatus includes a storage storing coefficients of a calculation formula for calculating a correction amount of a beam emission position according to an atmospheric pressure, a correction amount calculator calculating a correction amount of the beam emission position from a measured value of an atmospheric pressure sensor and the calculation formula using the coefficients, a writer writing a pattern on a substrate using a charged particle beam with the beam emission position adjusted based on shot data and the correction amount, a correction residual calculator calculating a correction residual for the emission position of the charged particle beam using a result of detection by a detector, and an updater updating the coefficients, when there is correlation between change in the correction residual and change in the atmospheric pressure.

A multiple charged particle beam writing apparatus includes a circuitry to calculate, for each of the plurality of combinations, a first distribution coefficient for each of the three beams configuring the combination concerned, for distributing a dose to irradiate the design grid concerned to the three beams such that the gravity center position of each distributed dose coincides with the position of the design grid concerned and the sum of the each distributed dose coincides with the dose to irradiate the design grid concerned; and a circuitry to calculate, for each of the four or more beams, a second distribution coefficient of each of the four or more beams relating to the design grid concerned by dividing the total value of at least one first distribution coefficient corresponding to the beam concerned in the four or more beams by the number of the plurality of combinations.

A multiple charged particle beam writing apparatus includes a distribution coefficient calculation circuitry to calculate, using defective beam information based on which a defective beam can be identified, for each design grid in a plurality of design grids being irradiation positions in design of multiple charged particle beams, a distribution coefficient for each of three or more beams, for distributing a dose to irradiate a design grid concerned in the plurality of design grids to the three or more beams, excluding the defective beam, whose actual irradiation positions are close to or approximately coincident with the design grid concerned, such that the position of the gravity center of each distributed dose coincides with the position of the design grid concerned and the sum of each distributed dose after distribution coincides with the dose to irradiate the design grid concerned.

Methods include inputting an array of pixels, where each pixel in the array of pixels has a pixel dose. The array of pixels represents dosage on a surface to be exposed with a plurality of patterns, each pattern of the plurality of patterns having an edge. A target bias is input. An edge of a pattern in the plurality of patterns is identified. For each pixel which is in a neighborhood of the identified edge, a calculated pixel dose is calculated such that the identified edge is relocated by the target bias. The array of pixels with the calculated pixel doses is output. Systems for performing the methods are also disclosed.

A multiple charged particle beam writing apparatus includes a defective pattern data generation circuitry configured to generate defective pattern data of a defective pattern having a shape of the defective region in the writing region; a reverse pattern data generation circuitry configured to generate reverse pattern data by reversing the defective pattern data; a combined-value pixel data generation circuitry configured to generate, for the each pixel, combined-value pixel data by adding a value defined in a reverse pattern pixel data and a value defined in a writing pattern pixel data; and a writing mechanism configured to perform multiple writing, using multiple charged particle beams, on the target object such that the each pixel is irradiated with a beam of a dose corresponding to a value defined in the combined-value pixel data.

According to one aspect of the present invention, a charged particle beam apparatus includes fogging charged particle amount distribution operation processing circuitry that operates a fogging charged particle amount distribution by performing convolution integration of a distribution function in which a design distribution center of fogging charged particles is shifted and a exposure intensity distribution in which a design irradiation center of a charged particle beam is not shifted; positional displacement operation processing circuitry that operates a positional displacement based on the fogging charged particle amount distribution; correction processing circuitry that corrects an irradiation position using the positional displacement; and a charged particle beam column including an emission source that emits the charged particle beam and a deflector that deflects the charged particle beam to irradiate a corrected irradiation position with the charged particle beam.

In one embodiment, an ion implantation apparatus includes an ion source configured to generate an ion beam. The apparatus further includes a scanner configured to change an irradiation position with the ion beam on an irradiation target. The apparatus further includes a first electrode configured to accelerate an ion in the ion beam. The apparatus further includes a controller configured to change at least any of energy and an irradiation angle of the ion beam according to the irradiation position by controlling the ion beam having been generated from the ion source.

According to one aspect of the present invention, a method of correcting a position of a stage mechanism, includes generating a two-dimensional map of a distortion amount at a position of a stage by applying a distortion amount of a position in a first direction of the stage at each of measured positions in a second direction as a distortion amount of a position in the first direction of the stage at each position in the second direction at each position in the first direction and by applying a distortion amount of a position in the second direction of the stage at each of measured positions in the first direction as a distortion amount of a position in the second direction of the stage at each position in the first direction at each position in the second direction; and correcting position data by using the two-dimensional map.

To provide an ion gun of a penning discharge type capable of narrowing a beam with a low ion beam current at a low acceleration voltage, an ion milling device including the same, and an ion milling method. An ion milling device that controls half width of a beam profile of an ion beam with which a sample is irradiated from an ion gun to be in a range of 200 m to 350 m. The device includes: the ion gun that ionizes a gas supplied from the outside, and emits an ion beam; a gas-flow-rate varying unit that varies a flow rate of the gas supplied to the ion gun; and a current measurement unit that measures a current value of the ion beam emitted from the ion gun. The gas-flow-rate varying unit sets a gas flow rate to be higher than a gas flow rate at which the ion beam current has a maximum value based on the current value measured by the current measurement unit and the flow rate of the gas determined by the gas-flow-rate varying unit.

A method for compensating pattern placement errors during writing a pattern on a target in a charged-particle multi-beam exposure apparatus including a layout generated by exposing a plurality of beam field frames using a beam of electrically charged particles, wherein each beam field frame has a respective local pattern density, corresponding to exposure doses imparted to the target when exposing the respective beam field frames. During writing the beam field frames, the positions deviate from respective nominal positions because of build-up effects within said exposure apparatus, depending on the local pattern density evolution during writing the beam field frames. To compensate, a displacement behavior model is employed to predict displacements; a local pattern density evolution is determined, displacements of the beam field frames are predicted based on the local pattern density evolution and the displacement behavior model, and the beam field frames are repositioned accordingly based on the predicted values.