A method for calibrating elementary patterns in variable-shaped-beam electron-beam lithography, includes the following steps: producing, by variable-shaped-beam electron-beam lithography, a calibration pattern comprising geometric figures each having a nominal critical dimension, the figures being divided into elementary patterns of smaller dimensions than each the nominal critical dimension; measuring the actual critical dimension of each the geometric figure; and applying a regression method on the basis of the actual critical dimensions thus determined to construct a mathematical model expressing either a variation in dimensions of the elementary patterns, or an error in the exposure dose of the elementary patterns producing an equivalent effect to the variation in dimensions, as a function of the dimensions of the elementary patterns. Application to the preparation of data with a view to transferring a pattern to a substrate by variable-shaped-beam electron-beam lithography.

A method of generating data relative to the writing of a pattern by electronic radiation initially includes the provision of a pattern to be formed which form the work pattern with a single external envelope. The work pattern is broken down into a set of elementary outlines, each including a single external envelope. A set of insolation conditions is defined to model each elementary outline. An irradiated simulation pattern is calculated from the sets of insolation conditions associated with the sets of elementary outlines. The simulation pattern is compared with the pattern to be formed. If the simulation pattern is not representative of the pattern to be formed, shift vectors are calculated. The shift vectors are representative of different intervals existing between the two patterns. The external envelope of the pattern to be formed is modified from displacement vectors determined from the shift vectors. A new iteration is carried out.

A parameter acquiring method for dose correction of a charged particle beam includes writing evaluation patterns on a substrate coated with resist; writing, while varying writing condition, a peripheral pattern on a periphery of any different one of the evaluation patterns, after an ignorable time as to influence of resist temperature increase due to writing of an evaluation pattern concerned has passed; and calculating a parameter for defining correlation among a width dimension change amount of the evaluation pattern concerned, a temperature increase amount of the evaluation pattern concerned, and a backscatter dose reaching the evaluation pattern concerned, by using, under each writing condition, a width dimension of the evaluation pattern concerned, the temperature increase amount of the evaluation pattern concerned at each shot time, and the backscatter dose reaching the evaluation pattern concerned from each shot.

An electron-beam lithography method includes, computing and outputting a development time of a positive-tone electron-sensitive layer and a parameter recipe of an electron-beam device by using a pattern dimension simulation system, performing a low-temperature treatment to chill a developer solution, utilizing an electron-beam to irradiate an exposure region of the positive-tone electron-sensitive layer based on the parameter recipe, and utilizing the chilled developer solution to develop a development region of the positive-tone electron-sensitive layer based on the development time. The development region is present within the exposure region, and an area of the exposure region is smaller than that of the first portion. As a result, the electron-beam lithography method may control a dimension of a development pattern of the positive-tone electron-sensitive layer more accurately, and may also shrink a minimum dimension of the development pattern of the positive-tone electron-sensitive layer.

A method and system for fracturing or mask data preparation is disclosed in which a desired substrate pattern for a substrate is input. A plurality of charged particle beam shots is then determined which will form a reticle pattern on a reticle, where the reticle pattern will produce a substrate pattern on the substrate using an optical lithography process, wherein the substrate pattern is within a predetermined tolerance of the desired substrate pattern. A similar method and a similar system for forming a pattern on a reticle are also disclosed.

In one embodiment, a method is for creating writing data used in a multi charged particle beam writing apparatus. The method includes partitioning a polygonal figure included in design data into a plurality of trapezoids that each include at least one pair of opposite sides parallel along a first direction and that join so as to be continuous in a second direction orthogonal to the first direction while a side parallel to the first direction serves as a common side, and creating the writing data by, when a first trapezoid, a second trapezoid, and a third trapezoid join along the second direction, representing a position of a common vertex shared by the second trapezoid and the third trapezoid using displacements in the first direction and the second direction from a position of a common vertex shared by the first trapezoid and the second trapezoid. In at least one of the plurality of trapezoids, different dose amounts are defined in the first direction.

A multi-charged particle beam writing apparatus according to one aspect of the present invention includes a region setting unit configured to set, as an irradiation region for a beam array to be used, the region of the central portion of an irradiation region for all of multiple beams of charged particle beams implemented to be emittable by a multiple beam irradiation mechanism, and a writing mechanism, including the multiple beam irradiation mechanism, configured to write a pattern on a target object with the beam array in the region of the central portion having been set in the multiple beams implemented.

In a charged-particle multi-beam writing method a desired pattern is written on a target using a beam of energetic electrically charged particles, by imaging apertures of a pattern definition device onto the target, as a pattern image which is moved over the target. Thus, exposure stripes are formed which cover the region to be exposed in sequential exposures, and the exposure stripes are mutually overlapping, such that each area of said region is exposed by at least two different areas of the pattern image at different transversal offsets (Y1). For each pixel, a corrected dose amount is calculated by dividing the value of the nominal dose amount by a correction factor (q), wherein the same correction factor (q) is used with pixels located at positions which differ only by said transversal offsets (Y1) of overlapping stripes.

A method for transferring a pattern onto a substrate by direct writing by means of a particle or photon beam comprises: a step of producing a dose map, associating a dose to elementary shapes of the pattern; and a step of exposing the substrate according to the pattern with a spatially-dependent emitted dose depending on the dose map; wherein the step of producing a dose map includes: computing at least first and second metrics of the pattern for each of the elementary shapes, the first metric representative of features of the pattern within a first range from the elementary shape and the second metric representative of features of the pattern within a second range, larger than the first range, from the elementary shape; and determining the emitted dose associated to each of the elementary shapes of the pattern as a function of the metrics. A computer program product is provided for carrying out such a method or at least the step of producing a dose map.

A multi charged particle beam writing method includes calculating an offset dose to irradiate all the small regions by multiplying one beam dose equivalent to a maximum irradiation time of multi-beams of each pass in multiple writing by a maximum number of defective beams being always ON to irradiate one of the small regions; calculating an incident dose, in addition to the offset dose, for each of the small regions; and performing multiple writing, using multi-beams including a defective beam being always ON, such that a beam of a total dose, between the incident dose and the offset dose, irradiates a corresponding small region for each small region, while switching a beam for each pass of the multiple writing, and controlling an irradiation time equivalent to the offset dose by a common blanking mechanism collectively blanking-controlling the multi-beams.