Patent classifications
H01J2237/31774
Method and system for determining a charged particle beam exposure for a local pattern density
A method for exposing a pattern in an area on a surface using a charged particle beam system is disclosed and includes determining a local pattern density for the area of the pattern based on an original set of exposure information. A pre-PEC maximum dose is determined for the area. The original set of exposure information is modified with the pre-PLC maximum dose.
CHARGED PARTICLE ASSESSMENT TOOL, INSPECTION METHOD
A charged particle assessment tool includes: an objective lens configured to project a plurality of charged particle beams onto a sample, the objective lens having a sample-facing surface defining a plurality of beam apertures through which respective ones of the charged particle beams are emitted toward the sample; and a plurality of capture electrodes adjacent respective ones of the beam apertures and configured to capture charged particles emitted from the sample.
METHOD AND SYSTEM OF REDUCING CHARGED PARTICLE BEAM WRITE TIME
A method for exposing a pattern in an area on a surface using a charged particle beam lithography is disclosed and includes inputting an original set of exposure information for the area. The area comprises a plurality of pixels, and the original set of exposure information comprises dosages for the plurality of pixels in the area. A backscatter is calculated for a sub area of the area based on the original set of exposure information. A dosage for at least one pixel in a plurality of pixels in the sub area is increased, in a location where the backscatter of the sub area is below a pre-determined threshold, thereby increasing the backscatter of the sub area. A modified set of exposure information is output, including the increased dosage of the at least one pixel in the sub area.
Data processing method, data processing apparatus, and multiple charged-particle beam writing apparatus
In one embodiment, a data processing method is for processing data in a writing apparatus performing multiple writing by using multiple beams. The data is for controlling an irradiation amount for each beam. The method includes generating irradiation amount data for each of a plurality of layers, the irradiation amount data defining an irradiation amount for each of a plurality of irradiation position, and the plurality of layers corresponding to writing paths in multiple writing, performing a correction process on the irradiation amounts defined in the irradiation amount data provided for each layer, calculating a sum of the irradiation amounts for the respective irradiation positions defined in the corrected irradiation amount data, comparing the sums between the plurality of layers, and determining whether or not an error has occurred in the correction process based on the comparison result.
Method and system of reducing charged particle beam write time
A method for exposing a pattern in an area on a surface using a charged particle beam lithography is disclosed and includes inputting an original set of exposure information for the area. A backscatter is calculated for the area of the pattern based on the exposure information. An artificial background dose is determined for the area. The artificial background dose comprises additional exposure information and is combined with the original set of exposure information creating a modified set of exposure information. A system for exposing a pattern in an area on a surface using a charged particle beam lithography is also disclosed.
MULTIPLE ELECTRON-BEAM IMAGE ACQUISITION APPARATUS AND MULTIPLE ELECTRON-BEAM IMAGE ACQUISITION METHOD
A beam arrangement portion is provided to arrange multiple primary electron beams on a substrate. The beam arrangement portion arranges the multiple primary electron beams in a square lattice along a first moving direction of a stage allowing the substrate to be placed thereon and a second moving direction perpendicular to the first moving direction in a state where, when the multiple primary electron beams are viewed as a whole, beams around four corners of the square lattice are omitted.
ABERRATION CORRECTOR AND MULTIPLE ELECTRON BEAM IRRADIATION APPARATUS
Aberration corrector includes a lower electrode substrate to be formed therein with plural first passage holes having a first hole diameter and making multiple electron beams pass therethrough, and to be arranged thereon plural electrode sets each being plural electrodes of four or more poles, surrounding a first passage hole, for each of the plural first passage holes, and an upper electrode substrate above the lower one, to be formed therein with plural second passage holes making multiple electron beams pass therethrough, whose size from the top of the upper electrode substrate to the middle of way to the back side of the upper electrode substrate is a second hole diameter, and whose size from the middle to the back side is a third hole diameter larger than each of the first and second hole diameters, wherein a shield electrode is on inner walls of plural second passage holes.
METHOD AND SYSTEM FOR DETERMINING A CHARGED PARTICLE BEAM EXPOSURE FOR A LOCAL PATTERN DENSITY
A method for exposing a pattern in an area on a surface using a charged particle beam system is disclosed and includes determining a local pattern density for the area of the pattern based on an original set of exposure information. A pre-PEC maximum dose is determined for the area. The original set of exposure information is modified with the pre-PLC maximum dose.
Multi charged particle beam writing method, and multi charged particle beam writing apparatus
A multi charged particle beam writing method includes assigning, for each unit irradiation region per beam of multi-beams, each divided shot obtained by dividing a shot of a maximum irradiation time and continuously irradiate the same unit irradiation region, to at least one of a plurality of beams that can be switched by collective deflection; calculating, for each unit irradiation region, an irradiation time; determining, for each unit irradiation region, whether to make each divided shot be beam on or off so that the total irradiation time for a plurality of corresponding divided shots to be beam on may become a combination equivalent to the irradiation time calculated; and applying, to the corresponding unit irradiation region, the plurality of corresponding divided shots to be beam on, using the plurality of beams while switching a beam between beams by collective deflection.
BEAM SPLITTER FOR A CHARGED PARTICLE DEVICE
A beam splitter for generating a plurality of charged particle beamlets from a charged particle source is disclosed. The beam splitter includes a plurality of beamlet deflectors, which each pass a beamlet along an optical axis. Each beamlet deflector includes a low order element and a corresponding high order element. Each low order element has fewer electrodes than each corresponding high order element; and each low order element is one of a plurality of low order elements; and each corresponding high order element is one of a plurality of high order elements.