H01J2237/31776

Charged-particle beam writing apparatus and charged-particle beam writing method

A charged-particle beam writing apparatus includes a writing chamber to house a stage having a writing object placed thereon, a beam irradiator to irradiate a charged particle beam to the writing object placed on the stage, a stage driver to move the stage, a temperature distribution calculator to calculate temperature distribution of the writing object caused by a heat source in the writing chamber, based on movement history information of the stage, a deformed amount calculator to calculate a deformed amount of the writing object based on a constraint condition of the writing object placed on the stage and the calculated temperature distribution, and a position corrector to correct an irradiation position of the charged particle beam to the writing object based on the calculated deformed amount. The beam irradiator irradiates the charged particle beam based on the irradiation position corrected by the position corrector.

METHOD AND SYSTEM OF REDUCING CHARGED PARTICLE BEAM WRITE TIME

A method for exposing a pattern in an area on a surface using a charged particle beam lithography is disclosed and includes inputting an original set of exposure information for the area. A backscatter is calculated for the area of the pattern based on the exposure information. An artificial background dose is determined for the area. The artificial background dose comprises additional exposure information and is combined with the original set of exposure information creating a modified set of exposure information. A system for exposing a pattern in an area on a surface using a charged particle beam lithography is also disclosed.

Measurement and inspection device

A low noise blanking unit corresponds to a wide range of acceleration voltages (from several times higher than related voltages to low acceleration voltages) of an electron beam. A blanking unit of the measurement and inspection device includes a blanking control circuit, in which (i) an upper and a lower blanking electrodes are arranged in the irradiation direction of an electron beam; electrodes on the reverse sides of two opposing electrodes in each of the blanking electrodes arranged in the same direction are connected with the ground, (ii) when blanking is ON, positive voltages are output to remaining electrodes of the upper blanking electrode and negative voltages are output to remaining electrodes of the lower blanking electrode, and (iii) when the blanking is OFF, the same ground reference signal is output to the remaining electrodes of the upper blanking electrode and to the remaining electrodes of the lower blanking electrode.

Drawing data generating method

A drawing data generating method according to an embodiment is a method for generating drawing data input to a drawing apparatus that draws a plurality of figure patterns on an object using a charged particle beam. The method includes generating the drawing data in accordance with a data format that not only defines a plurality of pieces of figure information, but also sequentially defines dose information of each figure before or after the plurality of pieces of figure information. The dose information of each of the second and succeeding figures is converted to a representation based on the dose information of any preceding figure, and a data length of the dose information is made variable for each figure. For example, the dose information of each of the second and succeeding figures is converted to a difference representation between a dose of the figure and a dose of the preceding figure, and a data length of the difference representation is changed in accordance with the magnitude of a difference value.

Micro-electro-mechanical-systems processing method, and micro-electro-mechanical-systems processing apparatus

The invention is to reduce non-uniformity of a processing shape over a wide range of a single field-of-view. The invention is directed to a method of processing micro electro mechanical systems with a first step and a second step in a processing apparatus including an irradiation unit that irradiates a sample with a charged particle beam, a shape measuring unit that measures a shape of the sample, and a control unit. In the first step, the irradiation unit irradiates a plurality of single field-of-view points with the charged particle beam in a first region of the sample, the shape measuring unit measures the shape of a spot hole formed in the first region of the sample, and the control unit sets, based on measurement results of the shape of the spot hole, a scan condition of the charged particle beam or a forming mask of the charged particle beam at each of the single field-of-view points. In the second step, the irradiation unit irradiates, based on the scan condition or the forming mask set in the first step, a second region of the sample with the charged particle beam.

Charged particle beam writing apparatus and charged particle beam writing method
RE047922 · 2020-03-31 · ·

A charged particle beam writing apparatus includes a division/distribution processing unit to divide and distribute processed data into data groups each having an approximately equal data amount respectively, transmitting units to transmit the processed data of the groups such that processed data is transmitted in descending order with respect to order of writing processing for each data group and the groups are transmitted in parallel, memories to store the processed data of the groups such that each of the memories stores processed data of each different one of the groups, a writing order data output unit to output them, regardless of data group and in order of writing processing, and a writing unit to write a pattern on a target workpiece with a charged particle beam, based on the processed data output in the order of writing processing.

METHOD OF PATTERN DATA PREPARATION AND METHOD OF FORMING PATTERN IN LAYER
20200083020 · 2020-03-12 ·

A method of pattern data preparation includes the following steps. A desired pattern to be formed on a surface of a layer is inputted. A first set of beam shots are determined, and a first calculated pattern on the surface is calculated from the first set of beam shots. The first calculated pattern is rotated, so that a boundary of the desired pattern corresponding to a non-smooth boundary of the first calculated pattern is parallel to a boundary constituted by beam shots. A second set of beam shots are determined to revise the non-smooth boundary of the first calculated pattern, thereby calculating a second calculated pattern being close to the desired pattern on the surface. The present invention also provides a method of forming a pattern in a layer.

Method of obtaining beam deflection shape and method of obtaining arrangement angle of blanking aperture array plate

In one embodiment, a method of obtaining a beam deflection shape includes using a plurality of beams to write a line pattern on a substrate by deflecting the plurality of beams, the plurality of beams being beams in the i-th row (i is an integer satisfying 1im) among multiple charged-particle beams including beams of m rows and n columns (m and n are integers equal to or greater than two), the deflection being performed in such a manner that a writing area for a beam in the j-th column (j is an integer satisfying 1jn1) is continuously adjacent to a writing area for a beam in the (j+1)th column, measuring a degree of unevenness of an edge of the line pattern, and obtaining a deflection shape of the beam based on the degree of unevenness.

Calibration of elementary small patterns in variable-shaped-beam electron-beam lithography

A method for calibrating elementary patterns in variable-shaped-beam electron-beam lithography, includes the following steps: producing, by variable-shaped-beam electron-beam lithography, a calibration pattern comprising geometric figures each having a nominal critical dimension, the figures being divided into elementary patterns of smaller dimensions than each the nominal critical dimension; measuring the actual critical dimension of each the geometric figure; and applying a regression method on the basis of the actual critical dimensions thus determined to construct a mathematical model expressing either a variation in dimensions of the elementary patterns, or an error in the exposure dose of the elementary patterns producing an equivalent effect to the variation in dimensions, as a function of the dimensions of the elementary patterns. Application to the preparation of data with a view to transferring a pattern to a substrate by variable-shaped-beam electron-beam lithography.

METHOD OF OBTAINING DOSE CORRECTION AMOUNT, CHARGED PARTICLE BEAM WRITING METHOD, AND CHARGED PARTICLE BEAM WRITING APPARATUS
20200013584 · 2020-01-09 · ·

In one embodiment, a method of obtaining a dose correction amount, the method includes writing evaluation patterns by irradiating a substrate with a charged particle beam by multiple writing with different numbers of paths using a charged particle beam writing apparatus, measuring a size of each of the evaluation patterns, calculating a size variation rate per path from a size measurement result of the evaluation pattern corresponding to each of the numbers of paths, and calculating a dose variation rate per path based on the size variation rate per path and a dose latitude indicating a ratio of a pattern size variation amount to a dose variation of the charged particle beam.