In one embodiment, a multi charged particle beam writing apparatus includes a stage position detector detecting a position of the stage which holds a substrate to be written, a mark disposed on the stage, a beam position detector detecting a beam position of each beam by allowing the multiple beams to pass over the mark, a beam shape detector detecting a beam shape of the multiple beams at predetermined time intervals based on the detected beam position and the detected position of the stage, the multiple beams being used to irradiate the substrate, and a writing data processor calculating an amount of irradiation correction of each beam for correcting the beam shape based on the detected beam shape.

According to one aspect of the present invention, a charged particle beam irradiation apparatus includes: a plurality of electrodes arranged in a magnetic field space of an electromagnetic lens and also arranged so as to surround a space on an outer side of a passing region of a charged particle beam; and a potential control circuit configured to control potentials of the plurality of electrodes so as to generate plasma in the space surrounded by the plurality of electrodes and so as to control movement of positive ions or electrons and negative ions generated by the plasma, wherein positive ions, electrons and negative ions, or active species are emitted from the space of the plasma.

A charged particle beam drawing apparatus has a drawing unit including a charged particle source, a deflector and a stage on which a target object is placed, to perform drawing with a charged particle beam on a plurality of drawing regions on the target object, and a calculator to calculate a drawing progress ratio on the target object using a ratio of a drawn area of the drawing regions to a total area of the drawing regions.

In one embodiment, a charged particle beam writing apparatus includes a storage unit storing a polynomial and a correction map for correcting deviations of writing positions, a correction processing unit correcting pattern positions in a writing area of a writing target substrate by using the polynomial and correcting the pattern positions in a specific region included in the writing area by using the correction map, and a writing unit writing patterns on a substrate by using a charged particle beam in accordance with the pattern positions corrected by the correction processing unit.

A multi charged particle beam writing apparatus according to one aspect of the present invention includes a plurality of first blankers to respectively perform blanking deflection of a corresponding beam in multiple beams having passed through the plurality of openings of the aperture member, a plurality of second blankers to deflect a defective beam in the multiple beams having passed through the plurality of openings of the aperture member to be in a direction orthogonal to a deflection direction of the plurality of first blankers, a blanking aperture member to block each of beams which were deflected to be in a beam off state by at least one of the plurality of first blankers and the plurality of second blankers, and a detection processing unit to detect a defective beam in the multiple beams having passed through the plurality of openings of the aperture member.

A lens element of a charged particle system comprises an electrode having a central opening. The lens element is configured for functionally cooperating with an aperture array that is located directly adjacent said electrode, wherein the aperture array is configured for blocking part of a charged particle beam passing through the central opening of said electrode. The electrode is configured to operate at a first electric potential and the aperture array is configured to operate at a second electric potential different from the first electric potential. The electrode and the aperture array together form an aberration correcting lens.

Various embodiments include measurement structures and methods for measuring integrated circuit (IC) images. In some cases, a measurement structure for use in measuring an image of an IC, includes: a first section having a positive shift spacing pattern; a second section, on an opposite side of the measurement structure, having a negative shift spacing pattern; and a third section having a reference spacing pattern for calibrating a measurement from at least one of the first section or the second section.

Various embodiments include measurement structures and methods for measuring integrated circuit (IC) images. In some cases, a measurement structure for use in measuring an image of an IC, includes: a first section having a positive shift spacing pattern; a second section, on an opposite side of the measurement structure, having a negative shift spacing pattern; and a third section having a reference spacing pattern for calibrating a measurement from at least one of the first section or the second section.

A temperature measuring mask includes: a substrate 10; a temperature sensor 11 being provided to the substrate 10, and being capable of sensing a temperature inside a charged particle beam lithography device 4; a circuit board 12 being provided to the substrate 10, and including a measuring circuit 121A that measures the temperature using the temperature sensor 11 and a storage device 121B that stores measurement data of the measured temperature; a secondary cell 13 being provided to the substrate 10, and supplying electric power to the circuit 121A; and a photoelectric cell 14 being provided to the substrate 10, and generating electric power by being irradiated with an energy beam to charge the secondary cell 13.

A manufacturing method of a phase shift mask in an embodiment includes: forming a metal layer on a substrate, the metal layer having a first region and a second region, the first region being configured to emit secondary electrons by irradiation with electrons, the second region being configured to emit secondary electrons higher in density than the first region, by the irradiation with electrons; patterning the metal layer to form a main pattern in the first region and an alignment mark in the second region; forming a resist layer on the patterned metal layer; and aligning the substrate using a secondary electron image of the alignment mark.