A conveyance system for conveying a workpiece to each of a plurality of processing apparatuses includes a track extending over the plurality of processing apparatuses and fixed to the upper portions of the processing apparatuses; an automated conveying vehicle for traveling on the track, the automated conveying vehicle including a storage member having a housing space for housing the workpiece therein, a traveling member coupled from above to the storage member, a traveling mechanism mounted on the traveling member, a lifting and lowering mechanism mounted on the traveling member, for lifting and lowering the storage member while suspending the storage member from above, and a receiver for receiving control signals.

A waste liquid treating apparatus for purifying a waste liquid discharged from a processing apparatus includes a waste liquid accommodating tank for the waste liquid discharged by the processing apparatus, a spray water seal type pump that sucks a spray together with air in a processing region where a processing unit is disposed, a sealing water reservoir tank that recovers the spray and reserves the spray as a waste liquid, and a waste liquid filter unit that filters that waste liquid and the waste liquid in the waste liquid accommodating tank, to purify the waste liquid into fresh water. A fresh water reservoir tank reserves the fresh water obtained by filtering the waste liquid, and a pure water producing unit purifies the fresh water reserved in the fresh water reservoir tank into pure water. A temperature control unit controls the temperature of the pure water.

An expanding method includes a frame securing step of securing an annular frame of a workpiece unit with frame securing means, an expanding step of, after the frame securing step, pressing a portion of an expandable sheet that lies between an outer circumferential edge of the workpiece and an inner circumferential edge of the annular frame, with an expanding drum to expand the expandable sheet, and a heating step of, after the expanding step, heating and shrinking a slackening portion of the expandable sheet which has been formed by expansion of the expandable sheet. The heating step includes a fully circumferential heating step of heating a full outer circumferential portion of the workpiece and an additional heating step of additionally heating a local area of the full outer circumferential portion of the workpiece.

A polishing head includes at least: an annular ceramic ring; a template attached to the ceramic ring and having a backing pad integrated with a guide ring; and a back plate joined to the ceramic ring to form a space together with the backing pad and the ceramic ring. The polishing head holds a back surface of a wafer on a lower surface portion of the backing pad and brings a front surface of the wafer into sliding contact with a polishing pad attached on a turntable for polishing the wafer. An incompressible fluid is enclosed in the space, and has a viscosity of 10 mPa.Math.s or more and 1200 mPa.Math.s or less. A polishing head and polishing method is capable of reducing backing pad deformation at a small gap between the template and wafer, and improving polishing uniformity at the wafer outermost peripheral portion.

A method of forming a package structure includes the following steps. A first package structure is formed. The first package structure is connected to a second package structure. The method of forming the first package structure includes the following steps. A redistribution layer (RDL) structure is formed. A die is bonded to the RDL structure. The RDL structure is electrically connected to the die. A through via is formed on the RDL structure and laterally aside the die. An encapsulant is formed to laterally encapsulate the through via and the die. A protection layer is formed over the encapsulant and the die. A cap is formed on the through via and laterally aside the protection layer, wherein the cap has a top surface higher than a top surface of the encapsulant and lower than a top surface of the protection layer. The cap is removed from the first package structure.

A device, a system and a method for bonding two substrates. A first substrate holder has a recess and an elevation.

A stacking apparatus that stacks substrate and a second substrate includes: a plurality of holding members that hold the first substrate, wherein the plurality of bolding members correct positional misalignment of the first substrate relative to the second substrate by preset amounts of correction, and the plurality of holding members include holding members having the amounts of correction that are different from each other. The stacking apparatus may further include a carrying unit that carries a holding member that is selected from among the plurality of holding members and holds the first substrate from a position here the holding member is housed to a position where the first substrate is held.

A bonding tool includes a gas supply line that may extend directly between valves associated with one or more gas supply tanks and a processing chamber such that gas supply line is uninterrupted without any intervening valves or other types of structures that might otherwise cause a pressure buildup in the gas supply line between the processing chamber and the valves associated with the one or more gas supply tanks. The pressure in the gas supply line may be maintained at or near the pressure in the processing chamber so that gas provided to the processing chamber through the gas supply line does not cause a pressure imbalance in the processing chamber, which might otherwise cause early or premature contact between semiconductor substrates that are to be bonded in the processing chamber.

There is provided a processing method including the steps of measuring a thickness of the wafer, holding the wafer on a holder, supplying a liquid resin to a table that faces the holder, relatively moving the holder and the table closely to each other to coat the wafer with the liquid resin, and hardening the liquid resin that has coated the wafer. In the resin applying step, a distance by which the holder and the table are to be relatively moved closely to each other to coat the wafer with the liquid resin is determined depending on the measured thickness of the wafer.

The present disclosure provides a method and system for manufacturing solar cells and shingled solar cell modules. The method as provided by the present disclosure includes performing scribing and dividing of the solar cells, sorting the obtained solar cell strips, and packaging the cell strips in the solar cell manufacturing process. The solar cell strips can be assembled directly after dismantling the package in the solar module manufacturing process. Therefore, the method can accomplish a smooth flow of manufacturing solar cells and shingled solar cell modules, reduce repeated processing steps, lower the risk of cracking and costs thereof, and optimize the current matching and the color consistency of the cell strips in the shingled solar cell modules.