An apparatus for manufacturing a display device includes a first jig including a first side, the first side having a concave groove for receiving a cover window, wherein the cover window includes a first planar portion, a first curved portion and a second curved portion, wherein the first and second curved portions are disposed at opposite ends of the first planar portion in a first direction, a second jig including a planar side for receiving a display panel, wherein when the second jig is moved in a second direction crossing the first direction with the display panel on the planar side, the display panel is disposed between the first and second curved portions of the cover window, and a pair of third jigs for supporting the first and second curved portions of the cover window.

A method for adjusting inclination between wafers may include providing a first infrared light onto a first grid pattern in a first region in a first wafer and a second grid pattern in a second wafer, the first and second grid patterns overlapping, calculating a first distance in the first region between the first and second wafers based on a first Moir pattern from the overlapping first and second grid patterns, providing a second infrared light onto a third grid pattern in a second region in the first wafer and a fourth grid pattern in the second wafer, the third and fourth grid patterns overlapping, calculating a second distance in the second region between the first and second wafers based on a second Moir pattern from the overlapping third and fourth grid patterns, and adjusting relative inclination between the first and second wafers based on the first and second distances.

An LED wafer processing method includes a dividing step of rotatably mounting a first cutting blade having a first width in a first cutting unit, holding an LED wafer on a holding table, and then relatively moving the first cutting unit and the holding table to cut the wafer along each division line formed on the wafer, thereby forming a full-cut groove along each division line to thereby divide the wafer into individual chips. The method further includes rotatably mounting a second cutting blade having a second width larger than the first width in a second cutting unit after performing the dividing step, and then relatively moving the second cutting unit and the holding table to thereby polish the opposed side surfaces of the full-cut groove formed along each division line, whereby a polished groove larger in width than the full-cut groove is formed along each full-cut groove.

A substrate processing apparatus includes a holder having thereon an attraction surface configured to attract a substrate and including, as multiple regions in which attracting pressures for attracting the substrate are controlled independently, a first region having a circular shape and a second region having an annular shape and disposed at an outside of the first region in a diametrical direction; multiple attracting pressure generators configured to independently generate the attracting pressures respectively in the multiple regions forming the attraction surface; multiple attracting pressure adjusters configured to independently adjust the attracting pressures respectively generated by the attracting pressure generators; and a controller configured to control the multiple attracting pressure generators and the multiple attracting pressure adjusters. The controller generates different attracting pressures in at least a part of the first region and in at least a part of the second region.

A cutting method includes: forming a reformed region in a workpiece; and after forming the reformed region in the workpiece, cutting the workpiece along an intended cut line. In the cutting the workpiece, a dry etching process is performed from a front surface toward a rear surface of the workpiece while the workpiece is fixed on a support member at least under its own weight or by suction, to form a groove from the front surface to reach the rear surface of the workpiece.

A method includes forming a film over a substrate; increasing a surface roughness of the film; and planarizing the film using a first chemical mechanical planarization (CMP) process after increasing the surface roughness.

A wafer dividing method includes a first step of cutting a back side of the wafer by using a cutting blade thereby forming a cut groove on the back side of the wafer along each division line, such that each cut groove has a depth not reaching the front side of the wafer from the back side thereof. A second step includes supplying a water-soluble liquid resin to the back side of the wafer thereby forming a water-soluble protective film on the back side of the wafer. A third step includes positioning a focal point of a laser beam on the bottom surface of each cut groove and next applying the laser beam to the bottom surface of each cut groove thereby fully cutting the wafer along each cut groove.

A wafer producing apparatus includes an ingot grinding unit that grinds the upper surface of an ingot to planarize the upper surface, a laser irradiation unit that positions the focal point of a laser beam with such a wavelength as to be transmitted through the ingot to a depth corresponding to the thickness of a wafer to be produced from the upper surface of the ingot and irradiates the ingot with the laser beam to form a separation layer, a wafer separating unit that separates the wafer from the ingot, and a tray having a support part that supports the separated wafer.

A space-grade solar array includes relatively small cells with integrated wiring embedded into or incorporated directly onto a printed circuit board. The integrated wiring provides an interface for solar cells having back side electrical contacts. The single side contacts enable the use of pick and place (PnP) technology in manufacturing the space-grade solar array. The solar cell is easily and efficiently packaged and electrically interconnected with other solar cells on a solar panel such as by using PnP process. The back side contacts are matched from a size and positioning standpoint to corresponding contacts on the printed circuit board.

A display panel cutting apparatus including: a stage, wherein a display panel is disposed on the stage, and the display panel includes a display area, a non-display area, and a test pad portion; an air knife disposed on the stage; an upper supporting member overlapping the test pad portion; and a laser that cuts the test pad portion from the display panel, wherein the upper supporting member is separated from an upper surface of the test pad portion.