A processing apparatus includes a holding table including a holding surface that holds a back surface side of a substrate and a processing unit that processes the substrate held on the holding surface. The holding surface includes a holding section that holds a central region of the substrate, a discharge groove that surrounds the holding section, and an outer circumferential groove that surrounds the discharge groove and communicates with a suction source to hold under suction the substrate. The processing apparatus uses the discharge groove to collect processing swarf produced by the processing unit.

This disclosure teaches methods for making high-temperature superconducting striated tape combinations and the product high-temperature superconducting striated tape combinations. This disclosure describes an efficient and scalable method for aligning and bonding two superimposed high-temperature superconducting (HTS) filamentary tapes to form a single integrated tape structure. This invention aligns a bottom and top HTS tape with a thin intervening insulator layer with microscopic precision, and electrically connects the two sets of tape filaments with each other. The insulating layer also reinforces adhesion of the top and bottom tapes, mitigating mechanical stress at the electrical connections. The ability of this method to precisely align separate tapes to form a single tape structure makes it compatible with a reel-to-reel production process.

The invention relates to a substrate holder device at least including at least one control valve and at least one substrate holder with a substrate holder surface and a substrate holder rear side. Furthermore, the invention relates to bonding device and a method for bonding.

A power conversion device includes a plurality of semiconductor modules, a plurality of coolers, and a frame. The frame pressurizes and holds a stacked body in which the semiconductor modules and the coolers are alternately stacked. The frame includes a first frame and a second frame that sandwich the stacked body therebetween. The first frame is a plate material bent to surround the stacked body from three directions, and includes a pair of side walls extending in the stacking direction of the stacked body, and an abutting wall extending between the side walls and abutting the stacked body. The abutting wall is bent outward from the frame. Each of the side walls is bent inward from the frame.

A superstrate for planarizing a substrate. The superstrate includes a body having a first side having a contact surface and a second side having a central portion and a peripheral portion surrounding the central portion. The peripheral portion includes a recessed region.

A device and a method for aligning substrates. The method includes the steps of detecting alignment marks and aligning substrates with respect to one another in dependence on the detection of the alignment marks. At least two alignment marks are arranged parallel to a direction of a linear movement of the substrates, wherein the alignment of the substrates takes place along a single alignment axis, the alignment axis running parallel to the loading and unloading direction of the substrates.

The present invention is an IC chip mounting apparatus including: a plurality of nozzles, each movable between a first position and a second position, each configured to suck an IC chip, when located at the first position, and to place the IC chip on the adhesive at the reference position of the corresponding antenna of an antenna continuous body, when located at the second position; a nozzle attachment to which the plurality of nozzles is attached; and a controller configured to control an angular velocity in rotating the nozzle attachment, so that a first nozzle of the plurality of nozzles that reaches the second position later than a non-sucking nozzle, places an IC chip on an antenna corresponding to the non-sucking nozzle, the non-sucking nozzle being a nozzle of the plurality of nozzles that has been determined as not sucking an IC chip.

The present invention is an IC chip mounting apparatus including: a conveyor configured to convey an antenna continuous body on a conveying surface, the antenna continuous body having a base material and plural inlay antennas continuously formed on the base material; an IC chip placement unit configured to place an IC chip on a photo-curable adhesive that is located on a reference position of each antenna in the antenna continuous body; and a light irradiator configured to irradiate, with light, the adhesive of each antenna of the antenna continuous body that is conveyed by the conveyor, wherein the light irradiator is configured to irradiate the adhesive of each antenna with the light, while the IC chip on the adhesive is pressed to the antenna.

A treatment apparatus including a chuck table, a table base, a servo motor that rotates the table base, and a determination unit that determines the kind of the chuck table mounted to the table base is provided. The determination unit includes a torque recording section in which a torque outputted by the servo motor when rotating the table base is recorded on the basis of the kind of the chuck table, and a determination section that collates the torque outputted by the servo motor with the torque recording section, to thereby determine the kind of the chuck table.

The present invention provides a method for plasma dicing a substrate. The method comprising providing a process chamber having a wall; providing a plasma source adjacent to the wall of the process chamber; providing a work piece support within the process chamber; placing the substrate onto a support film on a frame to form a work piece work piece; loading the work piece onto the work piece support; providing a clamping electrode for electrostatically clamping the work piece to the work piece support; providing a mechanical partition between the plasma source and the work piece; generating a plasma through the plasma source; and etching the work piece through the generated plasma.