An assembly for monitoring a semiconductor device under test comprising a mill configured to mill the device, a sensor configured to measure an electrical characteristic of the device, and a computer configured to determine the amount of strain in the device from the electrical characteristic when the mill is milling the device and detect an endpoint of milling at a circuit within the device. In use the endpoints of the milling process of the semiconductor device are detected measuring an electrical characteristic of the device with a sensor during milling determining the amount of strain in the device from the electrical characteristic and detecting an endpoint of the milling process within the device based on the amount of strain.

A micro-transfer printing system comprises a source substrate having a substrate surface and components disposed in an array on, over, or in the substrate surface Each component has a component extent in a plane parallel to the substrate surface. A stamp comprises a stamp body and stamp posts extending away from the stamp body disposed in an array over the stamp body. Each of the stamp posts has (i) a post location corresponding to a component location of one of the components when the stamp is disposed in alignment with the source substrate, and (ii) a post surface extent on a distal end of the stamp post. The post surface extent is greater than the component extent.

A laser processing device comprising: an irradiation unit configured to irradiate an object with laser light; an image capturing part configured to capture an image of the object; and a control unit configured to control at least the irradiation unit and the image capturing part, wherein the control unit performs a first process of irradiating the object with the laser light by control of the irradiation unit to form a modified spot and a fracture extending from the modified spot in the object so as not to reach an outer surface of the object, a second process of, after the first process, capturing an image of the object with light having transparency to the object and acquiring information indicating a formation state of the modified spot and/or the fracture, by control of the image capturing part.

A chuck table includes a holding plate having a holding surface for holding the wafer under suction, and a frame body that supports the holding plate thereon and transmits a negative pressure or a positive pressure to the holding surface. The holding plate is formed such that a plurality of cleaved portions are included through cleavage of the holding plate into a plurality of blocks along a plurality of modified layers formed by applying a laser beam of a wavelength, which has transmissivity through the holding plate, with a focal point thereof positioned inside the holding plate, and the negative pressure or the positive pressure is transmitted from the cleaved portions to the holding surface. A grinding machine and a manufacturing method of the chuck table for holding the wafer are also disclosed.

The present disclosure is an alignment mechanism of a bonding machine, in particular an alignment mechanism of a wafer bonding machine, which mainly has a support pedestal, at least three first alignment pins, and at least three second alignment pins, a first cam and a second cam. When the first cam rotates relative to the support pedestal, it will drive the first alignment pin to move relative to the support pedestal to position the first substrate on the support pedestal. When the second cam rotates relative to the support pedestal, it drives the second alignment pin to move relative to the support pedestal to position the second substrate above the first substrate, so that the second substrate is aligned with the first substrate to facilitate bonding the first substrate and the second substrate.

A laser processing apparatus includes a laser beam applying unit for applying a laser beam to a workpiece, an image capturing unit for producing a captured image of the workpiece that includes a captured image of light emitted from the workpiece when the laser beam is applied to the workpiece by the laser beam applying unit, and a control unit. The laser beam applying unit includes a laser oscillator for emitting a laser beam and a condensing lens for converging the laser beam onto the workpiece. The control unit includes a determining section for determining a state of the laser beam applied to the workpiece, on the basis of the shape of the captured image of the light that is included in the captured image of the workpiece.

Ultrapure water supply apparatuses, substrate processing systems, and substrate processing methods are provided. An ultrapure water supply apparatus includes: a first supply device that produces first ultrapure water; a second supply device that produces second ultrapure water; a first reserved supply device that provides the second supply device with a portion of fluid in the first supply device; and a second reserved supply device that provides the first supply device with a portion of fluid in the second supply device. The first supply device includes a first front-side filtering part, a first rear-side filtering part, and a first connection part. The second supply device includes a second front-side filtering part, a second rear-side filtering part, and a second connection part. Each of the first and second reserved supply devices connects the first connection part and the second connection part to each other.

A processing method for a workpiece includes forming a first processing groove by a first processing unit, imaging the first processing groove by a first imaging unit and imaging, by a second imaging unit provided on an opposite side of the first imaging unit with respect to the holding table, a predetermined line that is formed in a position corresponding to that of the first processing groove in a thickness direction of the workpiece, detecting whether or not a position of a first center line of the first processing groove and a position of a second center line of the predetermined line are aligned in a predetermined plane, and correcting the processing position in such a manner as to make the positions of the two center lines aligned when the detected positions of the first center line and the second center line are not being aligned.

An apparatus is for plasma dicing a semiconductor substrate of the type forming part of a workpiece, the workpiece further including a carrier sheet on a frame member, where the carrier sheet carries the semiconductor substrate. The apparatus includes a chamber, a plasma production device configured to produce a plasma within the chamber suitable for dicing the semiconductor substrate, a workpiece support located in the chamber for supporting the workpiece through contact with the carrier sheet, and a frame cover element configured to, in use, contact the frame member thereby clamping the carrier sheet against an auxiliary element disposed in the chamber.

A protective sheet sticking apparatus includes a cutting unit that cuts a protective sheet stuck to a wafer along an outer circumference of the wafer while bringing a cutting part of a cutting blade into contact with the outer circumference of the wafer. The cutting unit has a cutting blade support part that supports the cutting blade rotatably in such a manner that the direction of a cutting edge of the cutting part is adjustable from the outside in the radial direction of the wafer to the inside. The cutting blade support part includes a first biasing spring that makes biasing to cause the cutting part to be oriented toward the inside and a second biasing spring that makes biasing to cause the cutting part to be oriented toward the outside in order to prevent the cutting part from being oriented toward the inside by a predetermined angle or larger.