A processing trajectory at the time of processing a peripheral part of a workpiece is set such that a processing width of the peripheral part of the workpiece is narrowed as spaced more from the position of a notch in a predetermined range centered at the position of the notch and that the processing width of the peripheral part of the workpiece is equal to a reference width (lower limit of the processing width) outside the predetermined range. As a result, the processing width at a position far from the position of the notch is narrow, and therefore, the proportion of devices damaged by edge trimming can be reduced or set to zero. In addition, since the processing width at the position of the notch is widened most, the probability that cracks are generated in the workpiece after the back surface side of the workpiece is ground can be lowered.

A bonding system includes a surface modifying apparatus configured to modify a bonding surface of a first substrate and a bonding surface of a second substrate; a surface hydrophilizing apparatus configured to hydrophilize the modified bonding surface of the first substrate and the modified bonding surface of the second substrate; a bonding apparatus configured to perform bonding of the hydrophilized bonding surface of the first substrate and the hydrophilized bonding surface of the second substrate in a state that the bonding surfaces face each other; and a cleaning apparatus configured to clean, before the bonding is performed, a non-bonding surface of, between the first substrate and the second substrate, at least one which is maintained flat when the bonding is performed, the not-bonding surface being opposite to the bonding surface.

A wafer processing method includes a pattern region detecting step, an evaluation region setting step, and an evaluation region deploying step. The pattern region detecting step is a step of detecting a period and positional information in which a substantially identical image appears in an imaged image and detecting a pattern region corresponding to one period. The evaluation region setting step is a step of detecting a position in which no metallic pattern is formed on planned dividing lines and setting the position as an evaluation region for evaluating quality of a processed groove. The evaluation region deploying step is a step of recording the position of the evaluation region in the pattern region and deploying the evaluation region at similar positions in different pattern regions.

A stage structure for a semiconductor fabrication process is disclosed. The stage structure may include a stage and a pickup head tilting control device. The pickup head tilting control device may include a correction plate, a tilting driving device which is coupled to the correction plate and is configured to adjust an inclination angle of the correction plate, and a control circuitry configured to control the tilting driving device. The correction plate may include a correction surface which is selectively in contact with a suction surface of a pickup head.

A method and system for controlling a position of a moveable stage having a substrate supported thereon is provided. First position information representing a position of the substrate relative to a mark on an object is obtained from a sensor. Alignment prediction information is generated based on the obtained first position wherein the generated alignment prediction information including at least one parameter value. First trajectory information is generated and includes the at least one parameter value based on the obtained first position information and the generated alignment prediction information. Second trajectory information is generated based on the generated alignment prediction information first trajectory information and second position information, wherein the second position information represents a position of the moveable stage. An output control signal is generated based on the second trajectory information and used to control the moveable stage to approach a target position based on the generated output signal.

A semiconductor manufacturing apparatus according to an embodiment includes a first chamber, a second chamber, and a fluid pressure applier. The first chamber includes a first film and a first container. The first film is deformable. The first container contains an incompressible fluid that causes the first film to be deformed. The second chamber includes a second film and a second container. The second film faces the first film. The second film is deformable. The second container contains the incompressible fluid that causes the second film to be deformed. The fluid pressure applier is configured to apply a pressure to the incompressible fluid of each of the first chamber and the second chamber to cause the first film and the second film to be deformed in bonding a plurality of substrates to each other between the first film and the second film.

A method for bonding a first substrate to a second substrate on mutually facing contact surfaces of the substrates includes a device in which the first substrate is mounted on a first chuck and the second substrate is mounted on a second chuck. A plate is arranged between the second substrate and the second chuck. The second substrate with the plate is deformed with respect to the second chuck before and/or during the bonding.

A protective film agent for laser dicing that includes a solution in which at least a water-soluble resin, an organic solvent, and an ultraviolet absorber are mixed and in which the content of sodium (Na) of the solution is equal to or lower than 100 ppb in weight ratio. Preferably, the solution further includes an antioxidant.

Provided are a method for affixing a protective film, a method for manufacturing a semiconductor component, and a protective film for use in the affixing method, which are capable of suppressing occurrence of a failure caused by a step on a main surface of a semiconductor wafer. The affixing method includes: an arrangement step of arranging a protective film so as to cover a main surface A of a semiconductor wafer; and an affixing step of pressing the protective film against the main surface to affix the protective film to the main surface. The affixing step includes a compression step of compressing the protective film in a thickness direction thereof.

A method and a corresponding device for bonding a first substrate with a second substrate at mutually facing contact faces of the substrates. The method includes holding of the first substrate to a first holding surface of a first holding device and holding of the second substrate to a second holding surface of a second holding device. A change in curvature of the contact face of the first substrate and/or a change in curvature of the contact face of the second substrate are controlled during the bonding.