A method for processing electronic die includes providing a substrate having a plurality of electronic die formed as part of the substrate and separated from each other by spaces. The method includes placing the substrate onto a first carrier substrate. The method includes plasma etching the substrate through the spaces to form singulation lines adjacent the plurality of electronic die. The method includes exposing the plurality of electronic die to solvent vapors, such as heated solvent vapors, under reduced pressure to reduce the presence of residual contaminants resulting from the plasma etching step.

The present disclosure provides a method and system for manufacturing solar cells and shingled solar cell modules. The method as provided by the present disclosure includes performing scribing and dividing of the solar cells, sorting the obtained solar cell strips, and packaging the cell strips in the solar cell manufacturing process. The solar cell strips can be assembled directly after dismantling the package in the solar module manufacturing process. Therefore, the method can accomplish a smooth flow of manufacturing solar cells and shingled solar cell modules, reduce repeated processing steps, lower the risk of cracking and costs thereof, and optimize the current matching and the color consistency of the cell strips in the shingled solar cell modules.

The present disclosure provides a method and system for manufacturing solar cells and shingled solar cell modules. The method as provided by the present disclosure includes performing scribing and dividing of the solar cells, sorting the obtained solar cell strips, and packaging the cell strips in the solar cell manufacturing process. The solar cell strips can be assembled directly after dismantling the package in the solar module manufacturing process. Therefore, the method can accomplish a smooth flow of manufacturing solar cells and shingled solar cell modules, reduce repeated processing steps, lower the risk of cracking and costs thereof, and optimize the current matching and the color consistency of the cell strips in the shingled solar cell modules.

A cutting blade mounting mechanism for mounting a cutting blade to a tip portion of a spindle includes: a blade mount mounted to the tip portion of the spindle; and an air supply unit supplying air to the blade mount. The blade mount includes: a columnar boss section inserted into a through-hole provided in an annular base of the cutting blade; a flange section projecting in a radial direction from a side of a base end of the boss section and having a support surface supporting the cutting blade; and an ejector type blade suction section having a first air passage connecting a supply port supplied with air from the air supply unit and a discharge port discharging air, and a second air passage connecting a suction port opening to a side of the support surface of the flange section and the first air passage.

A wafer processing method includes a liquid layer forming step of forming a layer of a liquid on a supporting face of a wafer table included in a supporting unit, a fixing step of placing a side of an adhesive sheet of the wafer on the wafer table on which the layer of the liquid has been formed, and fixing the wafer to the wafer table through the adhesive sheet, a detecting step of imaging the wafer with an imaging unit which is positioned opposite to the supporting face of the wafer table to thereby detect the division lines formed on the front side of the wafer, and a processing step of processing a portion on a back side of the wafer corresponding to each of the division lines.

A wafer processing method includes a pattern region detecting step, an evaluation region setting step, and an evaluation region deploying step. The pattern region detecting step is a step of detecting a period and positional information in which a substantially identical image appears in an imaged image and detecting a pattern region corresponding to one period. The evaluation region setting step is a step of detecting a position in which no metallic pattern is formed on planned dividing lines and setting the position as an evaluation region for evaluating quality of a processed groove. The evaluation region deploying step is a step of recording the position of the evaluation region in the pattern region and deploying the evaluation region at similar positions in different pattern regions.

A wafer processing method includes a polyester sheet providing step of positioning a wafer in an inside opening of a ring frame and providing a polyester sheet on a back side or a front side of the wafer and on a back side of the ring frame, a uniting step of heating the polyester sheet as applying a pressure to the polyester sheet to thereby unite the wafer and the ring frame through the polyester sheet by thermocompression bonding, a dividing step of applying a laser beam to the wafer to form shield tunnels in the wafer, thereby dividing the wafer into individual device chips, and a pickup step of heating the polyester sheet, pushing up each device chip through the polyester sheet, and picking up each device chip from the polyester sheet.

A laser beam applying unit of a laser processing apparatus includes a laser oscillator adapted to emit a laser beam, a condenser adapted to focus the laser beam emitted from the laser oscillator and to thereby apply the laser beam to the workpiece held by a holding unit, and a liquid layer former disposed at a lower end portion of the condenser and adapted to form a layer of a liquid on an upper surface of the workpiece. The liquid layer former includes a casing having a bottom wall that forms a gap between itself and the upper surface of the workpiece, a liquid supply section adapted to supply the liquid to the casing, and a transparent section that is formed at the bottom wall adjacently to the jet port and that permits transmission of the laser beam therethrough.

According to an exemplary embodiment of the present invention, by providing an apparatus for fabricating a stretchable electronic element including a chamber, a plurality of sample portions loaded into the chamber and spaced apart from each other, while the chamber is maintained at atmospheric pressure, and a movable member moving the plurality of sample portions and compressing each of the plurality of sample portions together while the chamber is kept under vacuum, it is possible to fabricate variable stretchable electronic elements.

Methods and apparatus for cleaving a substrate in a semiconductor chamber. The semiconductor chamber pressure is adjusted to a process pressure, a substrate is then heated to a nucleation temperature of ions implanted in the substrate, the temperature of the substrate is then adjusted below the nucleation temperature of the ions, and the temperature is maintained until cleaving of the substrate occurs. Microwaves may be used to provide heating of the substrate for the processes. A cleaving sensor may be used for detection of successful cleaving by detecting pressure changes, acoustic emissions, changes within the substrate, and/or residual gases given off by the implanted ions when the cleaving occurs.