Embodiments are related to systems and methods for fluidic assembly, and more particularly to systems and methods for assuring deposition of elements in relation to a substrate.

A method for aligning and contacting a first substrate with a second substrate using a plurality of detection units, and a corresponding device for alignment and contact.

Provided are an apparatus for manufacturing a semiconductor device and a method of manufacturing a semiconductor package using the same. The manufacturing apparatus may include a base with a plurality of through holes and weight blocks respectively bound by the through holes.

A stiffener apparatus for reducing warpage of an integrated circuit package during heating and cooling are provided. The stiffener apparatus includes an IC substrate configured to receive an IC die on a top side of the IC substrate. The stiffener apparatus includes a primary stiffener ring adhered to the top side of the IC substrate and defining an opening in a region of the IC die such that the primary stiffener ring surrounds the region of the IC die. The primary stiffener ring defines a plurality of grooves. The stiffener apparatus includes a secondary stiffener ring having a plurality of catches configured to engage with the plurality of grooves to removably attach the secondary stiffener ring to the primary stiffener ring on a side of the primary stiffener ring opposite the IC substrate. A method of using a stiffener apparatus during a manufacturing operation is also provided.

Systems and methods of securing an integrated circuit assembly includes: arranging a plurality of securing elements within a plurality of orifices fabricated within one or more layer components of a plurality of layer components of an integrated circuit assembly; applying a mechanical compression load against the integrated circuit assembly that uniformly compresses together the plurality of layer components of the integrated circuit assembly; after applying the mechanical compression load to the integrated circuit assembly, fastening the plurality of securing elements while the integrated circuit assembly is in a compressed state based on the mechanical compression load; and terminating the application of the mechanical compression load against the integrated circuit assembly based on the fastening of the plurality of securing elements.

Methods and apparatus for bonding chiplets to substrates are provided herein. In some embodiments, a multi-chamber processing tool for processing substrates includes: an equipment front end module (EFEM) having one or more loadports for receiving one or more types of substrates; and a plurality of automation modules coupled to each other and having a first automation module coupled to the EFEM, wherein each of the plurality of automation modules include a transfer chamber and one or more process chambers coupled to the transfer chamber, wherein the transfer chamber includes a buffer, and wherein the transfer chamber includes a transfer robot configured to transfer the one or more types of substrates, wherein at least one of the plurality of automation modules include a bonder chamber and at least one of the plurality of automation modules include a wet clean chamber.

A pick-and-place system is provided. The pick-and-place system includes: a wafer holder configured to hold a bottom die; a gantry having a stabilizer extending downwardly; a primary drive mechanism connected to the gantry and configured to drive the gantry horizontally and vertically; a suction head configured to hold a top die; and a secondary drive mechanism located at the gantry and connected to the suction head and configured to drive the suction head horizontally and vertically to place the top die on the bottom die at a target position. The primary drive mechanism drives the gantry vertically until the stabilizer is in contact with the bottom die before the secondary drive mechanism drives the suction head.

Apparatus for extending substrate queue time for hybrid bonding by preserving plasma activation. In some embodiments, the apparatus may include an environmentally controllable space with a support for holding a die or a substrate, a gas velocity accelerator that recirculates one or more gases laterally across the support, a filter, a humidifier apparatus that is fluidly connected to the environmentally controllable space, wherein the humidifier apparatus enables controllable humidity levels within the environmentally controllable space, a pressurizing apparatus fluidly connected to the humidifier apparatus on an output and fluidly connected to at least one gas supply on an input, a relative humidity (RH) sensor positioned within the environmentally controllable space, and an environment controller in communication with at least the humidifier apparatus and the RH sensor, wherein the environment controller is configured to maintain an RH level of approximately 80% to approximately 95%.

The present invention provides a chip mounting system and a method for mounting chips. The chip mounting system includes a first carrier device, a second carrier device, and a chip capturing device. The first carrier device includes a plurality of first carrier platforms for respectively carrying a plurality of semiconductor structures. Each semiconductor structure includes a base layer and a plurality of light emitting chips disposed on the base layer. The second carrier device includes a second carrier platform for carrying a circuit substrate. The chip capturing device is used for moving the light emitting chip from the base layer to the circuit substrate. The red, the green, and the blue light-emitting groups of the same sequence are disposed adjacent to each other, so that the red, the green, and the blue light-emitting chips of the same sequence are arranged adjacent to each other to form a pixel.

A polyimide composition for a package structure is provided. The polyimide composition includes a polyimide precursor, a cross-linker, a photosensitizer, a first additive, a second additive and a solvent. The first additive comprises a polyether based compound, and the second additive comprises a siloxane based compound. The polyimide composition has more than 98% cyclization of the polyimide precursor when the polyimide composition is cured at a temperature range of 160 C. to 200 C.