A method of manufacturing a semiconductor device that includes an insulated circuit board having a conductive pattern, a first semiconductor chip with a rectangular shape connected through a first joining material to the conductive pattern, a second semiconductor chip with a rectangular shape disposed on the conductive pattern separated from the first semiconductor chip and connected through a second joining material to the conductive pattern, a terminal disposed above the semiconductor chips, respectively connected to the first and second semiconductor chips through third and fourth joining materials, the terminal having a through-hole above a place between the first and second semiconductor chips, the method including a positioning step in which the first and second semiconductor chips are respectively positioned at at least three positioning places, and at least one of the positioning places is positioned with a positioning member inserted into the through-hole.

Described examples include a substrate made of a first material and having a surface. First and second nozzles respectively dispense a first solvent paste including electrically conductive nanoparticles and a second solvent paste including non-conductive nanoparticles, while moving over the surface of the substrate. The first and second nozzles additively deposit a uniform layer including sequential and contiguous zones, alternating between the first solvent paste and the second solvent paste. Energy is applied to sinter together the nanoparticles and diffuse the nanoparticles into the substrate. The sintered nanoparticles form a layer composed of an alternating sequence of electrically conductive zones contiguous with electrically non-conductive zones.

An apparatus including a bumped electrode array and a method of fabricating a bumped electrode array is disclosed. The method includes providing a substrate for the electrode array. The method also includes disposing a plurality of non-planar structures including electrodes above the substrate of the electrode array. The method further includes disposing a dielectric layer above the plurality of non-planar structures having a defined radius of curvature.

The embodiment of the present application discloses a mounting apparatus and a mounting method. The mounting apparatus comprises: a bracket; a tray movably disposed on the bracket, wherein the tray comprises the first bearing portion and the second bearing portion, the second bearing portion is disposed around the circumference of the first bearing portion and coincides with the center of gravity of the first bearing portion, a first sensor, which is disposed at the center of gravity of the first bearing portion and collects the offset of the center of gravity of the supported first upper electrode portion and the second upper electrode portion; and a driving assembly, which is connected to the tray, drives the tray to ascend and descend and drives the tray to adjust the supporting positions of the first upper electrode portion and the second upper electrode portion.

A bonding apparatus according to an embodiment includes a first chuck, a second chuck, and a pushpin arranged in a center portion of the second chuck. The first chuck includes a first area and a second area in a plane view. The first chuck includes a first rib arranged to divide the first area and the second area from each other in the plane view. The first area includes an area that overlaps the pushpin in the plane view. The second area encircles an outer perimeter of the first area in the plane view. The first chuck has a plurality of pins arranged at intervals in the second area, and has no pin in the area of the first area that overlaps the pushpin in the plane view.

The present invention discloses a packaging apparatus and a packaging device. The packaging apparatus comprises a mask plate and a control circuit that is electrically connected to the mask plate and is used to control the mask plate such that the mask plate electrostatically adsorbs a first substrate or release the first substrate. In the technical solutions of the present invention, the mask plate is controlled by the control circuit such that the mask plate electrostatically adsorbs or releases the first substrate without the need to use the alignment mechanism of mechanical fixing type to fix the first substrate. By completely adsorbing the first substrate by the mask plate in a way of electrostatic adsorption, the deformation of the first substrate and the generation of bubbles between the first substrate and the second substrate are avoided, the alignment precision is improved, and the slip-off of the first substrate from the mask plate during the process of pressing is avoided.

A device for aligning and bringing a large-area substrate into contact with a carrier substrate comprising: a substrate holding means for attaching the substrate; a carrier substrate holding means for attaching the carrier substrate; detection means for detection of a peripheral contour of the substrate attached to the substrate holding means and detection of a peripheral contour of the carrier substrate attached to the carrier substrate holding means relative to a contact plane of the substrate with the carrier substrate; aligning means for aligning the substrate relative to the carrier substrate; and contacting means for bringing the substrate into contact with the carrier substrate.

An apparatus including a bumped electrode array and a method of fabricating a bumped electrode array is disclosed. The method includes providing a substrate for the electrode array. The method also includes disposing a plurality of non-planar structures including electrodes above the substrate of the electrode array. The method further includes disposing a dielectric layer above the plurality of non-planar structures having a defined radius of curvature.

A method to produce a ruggedized package (1) of an image sensor comprises a step of producing a plurality of image sensors (100a, . . . , 100n), a step (S3, S4) of providing a supporting substrate (10) and placing the plurality of the image sensors (100a, . . . , 100n) on the supporting substrate (10) such that the image sensors (100a, . . . , 100n) are located spaced apart from each other on the supporting substrate (10), a step (S5) of filling a spacing (20) between the image sensors (100a, . . . , 100n) on the supporting substrate (10) with a molding material (200), a step (S6) of delaminating the arrangement of the plurality of the image sensors (100a, . . . , 100n) from the supporting substrate (10), and a step (S7) of singularizing the arrangement of the plurality of the image sensors (100a, . . . , 100n) such that each image sensor (100a, . . . , 100n) is surrounded by the molding material (200).

A semiconductor device has a plurality of small-sized semiconductor chips disposed between an insulated circuit board having a conductive pattern and a terminal. The semiconductor device exhibits a high accuracy in positioning the semiconductor chips. The semiconductor device includes an insulated circuit board having a conductive pattern, a first semiconductor chip with a rectangular shape connected to the conductive pattern through a first joining material, a second semiconductor chip with a rectangular shape, disposed on the conductive pattern separated from the first semiconductor chip and connected to the conductive pattern through a second joining material, and a terminal disposed above the first semiconductor chip and the second semiconductor chip, connected to the first semiconductor chip through a third joining material, and connected to the second semiconductor chip through a fourth joining material. The terminal has a through-hole above a place between the first semiconductor chip and the second semiconductor chip.