Methods of selectively transferring integrated circuit (IC) components between substrates, and devices and systems formed using the same, are disclosed herein. In one embodiment, a first substrate with a release layer and a layer of IC components over the release layer is received, and a second substrate with one or more adhesive areas is received. The layer of IC components may include one or more waveguides, ring resonators, drivers, photodetectors, transimpedance amplifiers, and/or electronic integrated circuits. The first substrate is partially bonded to the second substrate, such that a subset of IC components on the first substrate are bonded to the adhesive areas on the second substrate. The first substrate is then separated from the second substrate, and the subset of IC components bonded to the second substrate are separated from the first substrate and remain on the second substrate.

The assembly apparatus comprises: a main frame; a magnet head arranged on the main frame so that a semiconductor light-emitting element is self-assembled on a panel; and a vibration isolator arranged on the main frame to offset vibration of the magnet head, wherein the magnet head comprises a magnet plate assembly, which includes a magnet applying an attractive force to the semiconductor light-emitting element, and the vibration isolator comprises a weight positioned on the magnet plate assembly and may minimize the transmission, to the main frame, of vibration generated by the magnet head.

A method of fabrication a package and a stencil structure are provided. The stencil structure includes a first carrier having a groove and stencil units placed in the groove of the first carrier. At least one of the stencil units is slidably disposed along sidewalls of another stencil unit. Each of the stencil units has openings.

A device transfer apparatus is provided. The device transfer apparatus includes a container of a polygonal shape which contains a substrate including device holes, vibration sources which generates vibration and transfers the vibration to a fluid in the container, and a processor which controls outputs of the vibration sources. The vibration sources include first group vibration sources arranged on a circumference of a first circle having a radius of a first distance from a central point, and second group vibration sources arranged on a circumference of a second circle which is concentric with the first circle and has a radius of a second distance that is longer than the first distance. The container is arranged on the central point and contains a fluid and micro devices distributed in the fluid. The processor controls the first group vibration sources and the second group vibration sources to output vibration.

A structural body is partially surrounded by a positioning plate, and a semiconductor element, a joining member, and a base plate around the joining member are exposed from the positioning plate, so that a positional relationship between the semiconductor element and the base plate is maintained. The joining member is heated by a heater while the semiconductor element, joining member, and base plate exposed from the positioning plate are isotropically pressurized by a piston via a medium and a bag member.

The inventive concept relates to an apparatus for manufacturing a semiconductor package and a method of manufacturing a semiconductor package. According to embodiments, the method of manufacturing a semiconductor package may include preparing a substrate including upper conductive pads on an upper surface of the substrate, preparing a first semiconductor chip including first solder balls, wherein a first dielectric layer covering sidewalls of the first solder balls is on a lower surface of the first semiconductor chip, disposing the first semiconductor chip on the substrate such that the first solder balls are on the upper conductive pads, and bonding the first solder balls to the upper conductive pads by applying an alternating current electric field to the first dielectric layer.

An apparatus for cleaning a package device is provided. The apparatus includes a package device loader; a package device unloader; a first cleaning area disposed between the package device loader and the package device unloader; and a conveyor. The conveyor includes a frame extending from the package device loader to the package device unloader and through the first cleaning area; and a belt wrapping the frame, wherein the belt includes a movable upper surface between the package device loader and the package device unloader, wherein the movable upper surface is configured to move relative to and over the frame, and a first distance between the movable upper surface and the frame in the first cleaning area increases in a direction from the package device loader to the package device unloader.

A method of bonding semiconductor chips is described. The method includes the following steps. A semiconductor wafer is provided on a chuck table of a bonding apparatus. A bond head of the bonding apparatus is driven for picking up a first semiconductor chip from a support, wherein the first semiconductor chip has a first warpage amount. The bond head is driven for moving the first semiconductor chip to a position located over a first bonding region of the semiconductor wafer. A deforming process is performed using a deforming mechanism to deform the chuck table and the first bonding region of the semiconductor wafer by a first deform amount, wherein the first deform amount corresponds to the first warpage amount. The first semiconductor chip is bonded to the first bonding region of the semiconductor wafer while maintaining the first deform amount. The deforming mechanism is released from deforming the chuck table.

An assembly includes a substrate; a coating including a Bingham fluid disposed on a surface of the substrate; and a discrete component partially embedded in or disposed on the coating including the Bingham fluid. A method includes irradiating a dynamic release structure disposed on a carrier, in which a discrete component is adhered to the dynamic release structure, the irradiating causing the discrete component to be released from the carrier; and receiving the released discrete component into or onto a coating disposed on a surface of a substrate, the coating comprising a Bingham fluid.

A bonding apparatus configured to bond a first substrate and a second substrate includes a first holder configured to hold the first substrate; a second holder configured to hold the second substrate; a first imaging device provided at the first holder and configured to image the second substrate held by the second holder; a first light irradiating device provided at the first holder and configured to irradiate light to the second substrate when the second substrate is imaged; a second imaging device provided at the second holder and configured to image the first substrate held by the first holder; and a second light irradiating device provided at the second holder and configured to irradiate light to the first substrate when the first substrate is imaged. Each of the first light irradiating device and the second light irradiating device is connected to a first light source configured to irradiate white light.