A method for the transfer of components from a sender substrate to a receiver substrate includes provision and/or production of the components on the sender substrate, transfer of the components of the sender substrate to the transfer substrate, and transfer of the components from the transfer substrate to the receiver substrate.The components can be transferred selectively by means of bonding means and/or debonding means.

A sheet pasting device EA includes: a sheet feed unit 10 that feeds an adhesive sheet AS; and a press unit 20 that has a press roller 22 for pressing the adhesive sheet AS against a work WK and that pastes the adhesive sheet AS on the work WK by pressing the adhesive sheet AS against the work WK moving relative to the press roller 22, the press unit 20 bringing the press roller 22 into contact with an attachment surface WK1 of the work WK and rotating the press roller 22 on the attachment surface WK1, at a stage before pressing the adhesive sheet AS against the work WK using the press roller 22.

A wafer processing apparatus including a supporting unit having a frame fixing section fixing the frame, and a wafer table having a front side and a rear side, the front side including a supporting face supporting the wafer and a transparent plate, a liquid layer forming unit including a nozzle section and forming a layer of a liquid on the supporting face of the wafer table, an imaging unit including an imaging camera positioned adjacent to the rear side of the wafer table and opposite to the supporting face on the front side of the wafer table and an air blowing nozzle blowing air to a region between the wafer table and the adhesive sheet.

A technique for handling an integrated circuit/tape assembly having a plurality of integrated circuits supported by underlying dicing tape involves placing the integrated circuit/tape assembly on a bottom file frame carrier (FFC) frame having structure (e.g., an inner rim or flexible pegs), placing a top FFC frame having a central opening over the integrated circuit/tape assembly, and mating the top and bottom FFC frames such that the dicing tape is pulled over the structure thereby laterally stretching the dicing tape, which breaks wafer saw bows holding the integrated circuits together. The lateral stretching of the dicing tape increases distance between adjacent integrated circuits in at least two mutually orthogonal lateral directions, thereby inhibiting the adjacent integrated circuits from colliding during shipment or storage for subsequent processing. The resulting assembly can be thinner than conventional FFC configurations, which results in more efficient shipment and storage.

A processing apparatus includes a wafer table that supports a wafer, a frame table that supports an annular frame, a first tape pressure bonding unit that includes a first pressure bonding roller for executing pressure bonding of a tape to the annular frame, and a second tape pressure bonding unit that includes a second pressure bonding roller for executing pressure bonding of the tape of the tape-attached annular frame to a front surface or a back surface of the wafer. A first heating unit is disposed in one of or both the frame table and the first pressure bonding roller, while a second heating unit is disposed in one of or both the wafer table and the second pressure bonding roller.

A dividing method of a substrate includes a close contact step of bringing an expanding tape into close contact with a substrate after execution of a modified layer forming step and before execution of a chip interval expansion step. Therefore, when the expanding tape is expanded in the chip interval expansion step, it is possible to favorably form plural chips with use of modified layers as the origin and to favorably widen the interval between the plural chips.

An outer circumferential region of a metal film and a portion of an outer circumferential region of a substrate on a reverse side thereof are removed, thereby exposing the outer circumferential region of the substrate and creating on a reverse side of an outer circumferential region of the wafer an exposed surface where a portion closer to a face side of a wafer is located outwardly of a portion remoter from the face side of the wafer. When a tape is affixed to a reverse side of the wafer, no gap or a reduced gap is formed between the tape and the outer circumferential region of the wafer. As a result, problems are restrained from occurring when the wafer is divided to manufacture chips therefrom.

A method of separating an electronic chip from a wafer is disclosed. In one aspect, the method comprises forming at least one trench in a back side of the wafer around at least part of the electronic chip to be separated, forming a back side metallization covering at least part of the back side and at least part of the at least one trench and attaching an adhesive layer of a tape to at least part of the back side metallization. The electronic chip is separated by removing material from a front side of the wafer along a separation path which includes part of the at least one trench in such a way that, during separating, the adhesive layer fills at least part of the at least one trench above a level of the back side metallization on the back side.

A sheet holding unit of a resin sheet fixing apparatus includes: a Peltier element that has an upper surface parallel to a sheet holding surface of a sheet holding table and near the sheet holding surface and a lower surface far from the sheet holding surface; a direct current (DC) power source that supplies the Peltier element with a DC; and a switch that switches a direction of the DC supplied to the Peltier element. By causing a current to flow in the Peltier element in a first direction, a resin sheet is softened and welded to a wafer, and by switching the switch to cause a current to flow in the Peltier element in a second direction, the resin sheet held on the sheet holding surface is cured and fixed to a surface on one side of the wafer.

The present invention provides a semiconductor chip delamination device for peeling off a protective film attached to one surface of a semiconductor chip, including: a stage unit (400) configured to allow a ring frame, in which the semiconductor chip having the protective film attached thereto is disposed, to be seated thereon; a delamination feeding unit (300) configured to feed a delamination seal contactable with the protective film so as to peel off the protective film from the semiconductor chip; a covering unit (500, 600) configured to allow the delamination seal to cover the semiconductor chip such that the delamination seal comes into close contact with the protective film; and a delaminating unit (700) configured to peel off, from the semiconductor chip, the delamination seal disposed to cover the semiconductor chip having the protective film disposed on one surface thereof, and provides a method of controlling the semiconductor chip delamination device.