In accordance with some embodiments, a wafer taping device is provided. The wafer taping device includes a tape delivering along a first direction. The wafer taping device also includes a wafer mount unit disposed below the tape. The wafer mount unit has an upper surface for supporting a wafer and having a notch for allowing a cut mark of the wafer to align with it. The notch is staggered with a second direction in the upper surface, and the second direction is substantially perpendicular to the first direction. In addition, the wafer taping device includes a laminating roller disposed above the wafer mount unit and having a long axis elongated in the second direction. The laminating roller is configured to reciprocate along the first direction for pressing the tape to the wafer.

To reduce the manufacturing cost of a display device using a micro LED as a display element. To manufacture a display device using a micro LED as a display element in a high yield. Employed is a method for manufacturing a display device, including: forming a plurality of transistors in a matrix over a substrate (800), forming conductors (21, 23) electrically connected to the transistors over the substrate (800), and forming a plurality of light-emitting elements (51) in a matrix over a film (927). Each of the light-emitting elements (51) includes electrodes (85, 87) on one surface and the other surface is in contact with the film (927). The conductors (21, 23) and the electrodes (85, 87) are opposed to each other. An extrusion mechanism (929) is pushed out from the film (927) side to the substrate (800) side so that the conductors (21, 23) and the electrodes (85, 87) are in contact with each other, whereby the conductors (21, 23) and the electrodes (85, 87) are electrically connected to each other.

An assembly includes a substrate; a coating including a Bingham fluid disposed on a surface of the substrate; and a discrete component partially embedded in or disposed on the coating including the Bingham fluid. A method includes irradiating a dynamic release structure disposed on a carrier, in which a discrete component is adhered to the dynamic release structure, the irradiating causing the discrete component to be released from the carrier; and receiving the released discrete component into or onto a coating disposed on a surface of a substrate, the coating comprising a Bingham fluid.

A die bonding apparatus includes a push-up unit, a head having a collet that sucks a die, and a control device. The control device is configured to suck a dicing tape using a dome plate; land the collet onto the die using the head; suck the die using the collet; lift plural blocks from the dome plate; stop the outermost block disposed on the outermost side among the plural blocks from lifting at a height where the die is peeled off from the dicing tape; and lift blocks other than the outermost block among the plural blocks higher than the outermost block to a predefined height.

A semiconductor cassette universal load port. The universal load port comprises a frame, three pins coupled to the frame forming a first portion of a kinematic coupling system configured to locate a 12-inch semiconductor wafer cassette for access by a robot arm of an ultraviolet (UV) radiation (RAD) machine, a first bracket coupled to the frame, a second bracket coupled to the frame, and a chuck coupled to the frame, wherein the first and second bracket and the chuck are configured to locate an 8-inch semiconductor wafer cassette for access by the robot arm of the RAD UV machine.

A system for connecting photovoltaic cells is disclosed. The system comprises a flexible component feeder source for feeding the photovoltaic cells to a process that couples them together; a vacuum conveyor for receiving at a first location the coupled photovoltaic cells and including openings through which a vacuum is applied to hold the coupled photovoltaic cells in place; a moving belt above the vacuum conveyor at a second location, where the vacuum conveyor and the moving belt are driven in a predetermined relation to one another for conveying the coupled photovoltaic cells from the first location to the second location; a vacuum source for applying a vacuum through the openings to cause the moving belt to apply a pressure to an upper surface of the coupled photovoltaic cells to compress the coupled photovoltaic cells; and a curing source at the second location for curing the compressed coupled photovoltaic cells.

A die attach system is provided. The die attach system includes: a support structure for supporting a substrate; a die supply source including a plurality of die for attaching to the substrate; and a bond head for bonding a die from the die supply source to the substrate, the bond head including a bond tool having a contact portion for contacting the die during a transfer from the die supply source to the substrate, the bond head including a spring portion engaged with the bond tool such that the spring portion is configured to compress during pressing of the die against the substrate using the contact portion of the bond tool.

There is provided a processing method of a wafer for processing the wafer that includes, on a front surface side, a device region in which a device is formed in each of plural regions marked out by plural planned dividing lines and includes a recess part on the back surface side and includes an annular reinforcing part at a peripheral part. The processing method of a wafer includes a holding step of holding the bottom surface of the recess part, a cutting step of cutting the wafer along the planned dividing lines by a cutting blade to divide the device region into plural device chips and form grooves on the front surface side of the reinforcing part, and a dividing step of dividing the reinforcing part along the planned dividing lines with the grooves being the points of origin by giving an external force to the reinforcing part.

A die-ejector (2) comprising a chamber (4) with a cover plate (40) having a passageway, a plurality of plates (56) arranged inside the chamber (4) and reciprocally movable between an initial position (58) and an operating position (60), respectively, intended to interact with the carrier to support the removal of the dies from the carrier, and a drive member (100) for moving the plates (56) to be moved from the operating position towards the initial position. The die-ejector (2) further comprises a magnet (20) and a spring system, respectively, which interacts with anchor sections (74) of the plates (56) and exerts on the plates (54) an attraction force (F′) or an impact force, respectively, directed towards the operating position, and a stop member (78) for stopping the movement of the plates (56) in the operating position, the plates abutting the stop member (78) in the operating position.

In an embodiment, an adhesive stamp includes a plurality of variable-length stamp bodies arranged in an array, wherein each stamp body has an adhesive surface on a head portion of the stamp body, the adhesive surface configured to hold a semiconductor chip, wherein a first electrode is arranged in the head portion, wherein the first electrode is chargeable and whose polarity is changeable, wherein a second electrode is arranged in a foot portion of the stamp body, wherein the second electrode is chargeable and whose polarity is changeable, wherein a length of the stamp body is variable depending on charges applied to the first electrode and the second electrode, and wherein the adhesive stamp is configured to transfer semiconductor chips.