An affixing method includes a pressing step of pressing a tape against a wafer with a tape affixing roller and pressing the wafer against a suction table with the tape affixing roller, an evacuating step of evacuating a vacuum chamber that houses the suction table and the tape affixing roller therein to create a vacuum in the vacuum chamber, and an affixing step of affixing the tape to the wafer with the tape affixing roller by causing the tape affixing roller to roll on the tape while the tape affixing roller is pressing the wafer.

There is provided a method of processing a wafer having devices formed in respective areas on a face side thereof that are demarcated by a plurality of crossing projected dicing lines on the face side. The method of processing a wafer includes a wafer unit forming step of forming a wafer unit having a wafer, a tape, and an annular frame, a dividing step of dividing the wafer along the projected dicing lines into a plurality of device chips, a pick-up step of picking up one at a time of the device chips from the wafer unit, and a measuring step of measuring the device chip picked up in the pick-up step. The method also includes a distinguishing step, before the pick-up step, of inspecting properties of the devices to distinguish acceptable devices and defective devices among the devices and storing distinguished results.

The present disclosure relates to a technology of manufacturing electronic components, especially semiconductor components with an irregular shape. The present disclosure provides an improved alignment method and system which may be used in cases, where features on a top surface of the semiconductor component or device are not sufficient due to process limitations and where a bottom surface might also not show any alignment correlation with the top surface.

A tape roll includes a cylindrical core, a strip-shaped tape wound on the core, and a marking portion that represents type information of the strip-shaped tape and that is applied to an inner peripheral surface of the core. Preferably, the type information of the strip-shaped tape includes at least one piece of type information selected from a group consisting of a width, a length, a material, an adhesive force, and a shelf life of the tape, and the marking portion has slots or an identification code representing the at least one piece of type information. A tape mounter for bonding, to a workpiece, the tape which is wound on the core of the tape roll is also disclosed.

Disclosed is a plasma processing device that provides an object to be treated with plasma treatment. A wafer as an object to be treated, which is attached on the upper surface of adhesive sheet held by a holder frame, is mounted on a stage. In a vacuum chamber that covers the stage therein, plasma is generated, by which the wafer mounted on the stage undergoes plasma treatment. The plasma processing device contains a cover member made of dielectric material. During the plasma treatment on the wafer, the holder frame is covered with a cover member placed at a predetermined position above the stage, at the same time, the wafer is exposed from an opening formed in the center of the cover member.

The application provides a die-bonding machine, including: a transferring unit used to support and transfer a substrate to a bonding position; a feeding unit used to position and supply the substrate to the transferring unit; a die supply unit used to support a die ring and supply dies to a die supply position; a die ring supply unit used to supply full die rings to the die supply unit and recover empty die rings in the die supply unit; a turret mechanism for transferring the dies in the die supply position to a die extraction position; a piercing mechanism for downwardly piercing a blue film of a die on the die supply position to push the die to the turret mechanism; and, and a die-bonding mechanism.

Methods, systems, and apparatus for cleaning and drying a tape-frame substrate are provided. In embodiments, an apparatus for supporting a tape-frame substrate includes a chuck having a first side and a second side opposite the first side, the first side having a convex surface configured to support the tape-frame substrate; and a plurality of channels extending through the chuck and having outlets along the first side, wherein the plurality of channels are configured to dispense fluid from the outlets along the convex surface of the first side. In embodiments, a support system includes the chuck and a holder configured to mount a tape-frame substrate to the chuck. The plurality of channels are configured to dispense fluid from the outlets and between the tape-frame substrate and the convex surface of the chuck when the tape-frame substrate is mounted to the chuck.

A semiconductor manufacturing apparatus includes an imaging device that images a die; a lighting device having a light source that is a point light source or a line light source; and a controller configured to apply a light beam to a part of the die by the light source to form a bright field area on the die, and repeat moving the bright field area at a predetermined pitch and imaging of the die to inspect an inside of the bright field area.

A semiconductor device includes: a first insulating circuit substrate; a first semiconductor chip mounted on a top surface of the first insulating circuit substrate; a printed circuit board arranged over the first insulating circuit substrate; a first external terminal inserted to the printed circuit board and having one end bonded to the top surface of the first insulating circuit substrate; and a first pin inserted to the printed circuit board and having one end bonded to a top surface of the first semiconductor chip, wherein the first insulating circuit substrate and the printed circuit board having warps complimentary to each other.

After molding a substrate located between first and second molds of a molding system, a used release film that is in contact with the substrate during molding is removed from the molding system with a gripper assembly, which is reciprocally movable between a retracted position outside the molding system and an extended position in a space between the first and second molds when the first and second molds are opened. A carriage mechanism on which the gripper assembly is mounted moves the gripper assembly towards the first or second mold until the gripper assembly contacts the used release film, before an actuator actuates the gripper assembly to clamp onto a part of the used release film. The carriage mechanism also conveys the gripper assembly away from the first mold or second mold to remove the used release film from the molding system.