Discussed is a method of manufacturing a display device including forming a plurality of thin film transistors, a plurality of light emitting diodes (LEDs), a plurality of gate lines, and a plurality of data lines on a top surface of a first substrate, forming a plurality of gate link lines and a plurality of data link lines on a bottom surface of a second substrate, bonding the first substrate and the second substrate, and forming a plurality of side lines to connect the plurality of gate lines and the plurality of gate link lines, and to connect the plurality of data lines and the plurality of data link lines. The forming of the plurality of side lines includes loading the first substrate and the second substrate on a stage and disposing a side guide on side portions of the first substrate and the second substrate.

A wire bonding system according to the present invention comprises: an acquisition unit that acquires information pertaining to the diameter of a pressure-bonded ball where a wire is pressure-bonded to an electronic component by wire bonding; a first storage unit that stores the information pertaining to the pressure-bonded ball diameter which has been acquired by the acquisition unit; and an inspection unit that inspects the quality of wire bonding on the basis of the information pertaining to the pressure-bonded ball diameter which has been read from the first storage unit. With the wire bonding system, it is possible to enhance convenience in a method for checking the quality of wire bonding.

A method for manufacturing a display device according to the present invention is characterized by comprising the steps of: supplying semiconductor light-emitting elements in a first chamber containing a fluid; disposing a distribution device, in which a plurality of magnets are arranged, on one side of the first chamber; rotating the distribution device such that the semiconductor light-emitting elements form a continuous pattern along the arrangement direction of the plurality of magnets; and stopping the distribution device such that the semiconductor light-emitting elements are distributed to a plurality of dummies, wherein in the step of stopping the distribution device, the plurality of dummies are formed at positions corresponding to the plurality of magnets.