A method of manufacturing a display device according to the present invention involves assembling a semiconductor light emitting element to an assembly substrate and then transferring the same to a wiring substrate, wherein, during self-assembly using magnetic and electric fields, the semiconductor light emitting element is fixed to the assembly substrate by forming a covalent bond between the semiconductor light emitting element and the assembly substrate so that the semiconductor light emitting element does not become separated from the assembly substrate, and when transferring the assembled object to the wiring substrate, the formed covalent bond is broken down so that the semiconductor light emitting element can be easily detached from the assembly substrate.

This application relates to a method of processing microelectronic components comprising measuring parameter values of at least one of a nature and a degree of warpage of singulated microelectronic components in an unconstrained state and sorting the singulated microelectronic components responsive to the measured parameter values of at least one of the nature and degree of warpage. The sorted dice may be used in assemblies to minimize bond line height variances and resulting open circuits between components. Systems for implementing the methods are also disclosed.

An adsorption device includes a substrate and a magnetic film on a surface of the substrate. The substrate has magnetic properties and is capable of generating magnetic field. The magnetic film partially covers the surface. The magnetic film generates a magnetic field having a direction that is opposite to a direction of the magnetic field generated by the substrate. Portions of the surface of the substrate not covered by the magnetic film form positions to attract and adsorb target objects, and other portion of the surface of the substrate covered by the magnetic film is not able to attract any target object.

A method of transferring a plurality of micro LEDs formed on a substrate including transferring the micro LEDs onto a first carrier substrate having a first adhesive material layer, reducing an adhesiveness of the first adhesive material layer by curing the first adhesive material layer, transferring the micro LEDs from the first carrier substrate onto a second carrier substrate having a second adhesive material layer, bonding at least a portion of the micro LEDs on the second carrier substrate to pads of a circuit board using a metal bonding layer, and separating the second carrier substrate from the micro LEDs bonded onto the circuit board.

A method for transferring electronic elements includes providing a transfer substrate including a transfer surface, and disposing electronic elements on the transfer surface; providing a target substrate including a target surface, and disposing the target substrate opposite to the transfer substrate, so that the transfer surface faces toward the target surface; providing a guiding mask including at least one guiding structure, and disposing the guiding mask between the transfer substrate and the target substrate; and releasing at least one of the electronic elements disposed on the transfer surface, and guiding the at least one of the electronic elements by the at least one guiding structure, so as to transfer the at least one of the electronic elements to the target surface of the target substrate. The present invention can achieve a high transferring yield rate even under a condition of low equipment accuracy and low equipment stability.

A guide apparatus configured to transfer light-emitting devices in a liquid onto a substrate is provided. The guide apparatus includes a base configured to support the substrate; and a guide member configured to couple with the base to be seated on a mounting surface of the substrate in a state in which the substrate is supported on a surface of the base, wherein the guide member includes guide holes configured to respectively guide the light-emitting devices in the liquid to be disposed on the mounting surface of the substrate.

An alignment-control apparatus encompasses an alignment-assisting tray for aligning a plurality of elements in a batch with highly minute-and-precise configuration, a first transferring unit for collectively transporting the plurality of elements to the alignment-assisting tray, a driving unit for reallocating a convex-ridge of each of the elements toward an concave-ridge assigned to each of the concave cells defined in the alignment-assisting tray, and a second transferring unit for picking up the plurality of elements from the alignment-assisting tray and collectively transporting the plurality of elements.

A display device includes a first substrate, a light-emitting element, a light conversion layer, and a color filter layer. The light-emitting element is disposed on the first substrate. The light conversion layer is disposed on the light-emitting element. In addition, the color filter layer is overlapped the light-emitting element and the light conversion layer.

A semiconductor structure disposed on a temporary carrier board is provided. Multiple adhesive layers are disposed on the temporary carrier. The semiconductor structure includes an adhesive-layer structure and a micro light-emitting element. The adhesive-layer structure includes a mending adhesive layer and a buffer layer. The mending adhesive layer is disposed on the temporary carrier board. The micro light-emitting element is disposed on the mending adhesive layer. The buffer layer is disposed between the mending adhesive layer and the micro light-emitting element. A height of the mending adhesive layer is less than a height of each of the adhesive layers in a thickness direction of the temporary carrier board. A sum of the height of the mending adhesive layer and the height of the buffer layer is greater than or equal to a height of each of the adhesive layers.

A transfer head for an electronic component transfer apparatus and a method therefor. The transfer head includes a first vacuum pipet laterally spaced from a second vacuum pipet with a first pitch therebetween. The first pitch is variable between a first pitch position and a second pitch position.