Provided is a pump for supplying a liquid. The pump includes: a tube including a pump chamber communicating with a chemical liquid inlet and a chemical liquid outlet, and configured to discharge a chemical liquid through a change in volume due to contraction and expansion; and a driving unit contracting or expanding the tube in a longitudinal direction, in which the tube includes: a flexible tube body including a pump chamber which has an increased internal volume when is contracted in a longitudinal direction and has a decreased internal volume when is expanded in the longitudinal direction, and which has a jar shape of which a radius is increased from the chemical liquid inlet to a center of the pump chamber, and the radius is decreased from the pump chamber to the chemical liquid outlet; a first flange provided at one end of the tube body and including the chemical liquid inlet; and a second flange provided at the other end of the tube body and including the chemical liquid outlet.

A coating method for coating parts in a dip-spin process is provided. The parts to be coated are dipped into a coating liquid and then centrifuged in at least one planetary basket arrangement in a planetary centrifuge. The planetary centrifuge includes a main rotor rotating about a main rotor axis of rotation and at least one planetary basket arrangement rotates about its planetary axis of rotation. Also, the planetary axis of rotation is arranged eccentrically on the main rotor. The at least one planetary basket arrangement can include a plurality of planetary baskets rotatably arranged about the planetary rotation axis of the at least one planetary basket arrangement and the planetary basket arrangement is rotated during a centrifuging operation.

A control unit obtains a captured image of a reference workpiece by a second image capturing unit after a droplet ejected from a droplet ejecting head lands toward a reference mark formed on an upper surface of the reference workpiece, detects a positional deviation amount of a position of the reference mark and a landing position of the droplet based on the captured image, and calculates the correction amounts of the relative positions of a workpiece table and a droplet ejecting head based on the positional deviation amount.

A substrate cleaning method according to an aspect of the present disclosure includes: supplying a film-forming treatment liquid containing a volatile component to a substrate to form a film on the substrate; supplying a peeling treatment liquid, which peels off a treatment film from the substrate, to the treatment film formed by solidifying or curing the film-forming treatment liquid on the substrate due to volatilization of the volatile component; and supplying a hydrophobic liquid, which hydrophobizes the substrate, to the substrate to which the peeling treatment liquid has been supplied.

A method of dispensing a fluid in a semiconductor manufacturing process includes providing a substrate, positioning a nozzle above the substrate, and determining a cross-sectional shape of the nozzle. The method also includes configuring the nozzle to have the determined cross-sectional shape and applying the fluid to the substrate through the nozzle with the determined cross-sectional shape.

Disclosed are a die bonding apparatus, a substrate bonding apparatus, a die bonding method, and a substrate bonding method that are capable of bonding a die to a substrate or bonding substrates together without using a bonding medium such as an adhesion film and a solder bump. The die bonding method includes hydrophilizing a bonding surface of the die, by plasma processing, forming a liquid film on a bonding area of the substrate, by supplying a liquid including water to the bonding area of the substrate, pre-bonding the die to the substrate by bringing the die into contact with the liquid film, and post-bonding one or more dies to the substrate at the same time, by performing heat treatment in a state in which the one or more dies are pre-bonded to the substrate.

Camera images may be utilized to detect substrate edges and provide information regarding the centering of the substrate within the fluid dispense system. Camera images may also be utilized to monitoring the location of a cup within the fluid dispense system. The signal processing techniques utilized may include data smoothing, analyzing only certain wavelengths of reflected energy, transforming the data (in one embodiment utilizing a Fourier transform), and/or analyzing a sub-set of the collected pixels of data. The camera image data collected herein may be combined with a wide variety of other data so as to better monitor, characterize and/or control a substrate processing process flow.

A substrate inspection system is provided to monitor characteristics of a substrate, while the substrate is disposed within (or being transferred into/out of) a processing unit of a liquid dispense substrate processing system. The inspection system is integrated within a liquid dispense substrate processing system and includes one or more optical sensors of a reflectometer (such as a spectrometer or laser-based transceiver) configured to obtain spectral data from a substrate. A controller is coupled to receive the spectral data from the optical sensors(s). The one or more optical sensors (or one or more optical fibers coupled to the rest of the optical sensor hardware) are coupled at locations within the substrate processing system. The controller analyzes the spectral data received from the optical sensors(s) to detect characteristic(s) of the substrate including, but not limited to, film thickness (FT), refractive index changes, and associated critical dimension (CD) changes.

A wafer processing apparatus including a supporting unit having a frame fixing section fixing the frame, and a wafer table having a front side and a rear side, the front side including a supporting face supporting the wafer and a transparent plate, a liquid layer forming unit including a nozzle section and forming a layer of a liquid on the supporting face of the wafer table, an imaging unit including an imaging camera positioned adjacent to the rear side of the wafer table and opposite to the supporting face on the front side of the wafer table and an air blowing nozzle blowing air to a region between the wafer table and the adhesive sheet.

A modified technology of spin coating which is named Two-Axis spin coating is disclosed. The innovative Two-Axis spin coating apparatus is a rotary device that spins the substrate horizontally the same as conventional spin coaters while the whole horizontal spinning system can be rotated vertically. The vertical rotation of the substrate generates a vertical centrifugal force perpendicular to the surface of the substrate which allows the coating face with an elevated artificial gravity acceleration. The elevation of gravity acceleration adjusts and normalizes the local high and low surface tension stresses on the surface of the coated film. This elevation of gravity also increases the weight of coating elements artificially and obliges the wavy surface convex regions to flow toward the concave areas. The elevation of gravity also obliges the lighter probable air bubbles inside the layer, immediately before the coating surface skinning process, move toward the surface and drain out from the layer. The invention provides a method to level the layer's edge beads, level the coated surface, drain out probable micro sized air bubbles inside the layer and form denser film simultaneously.