A batch processing oven includes a processing chamber, a magnet, and a rack. The processing chamber includes a gas inlet on a first side and a gas outlet on a second side opposite the first side, the gas inlet is configured to direct a hot gas into the processing chamber and the gas outlet is configured to exhaust the convective energy in parallel with the radiative energy from the walls. The magnet is arranged such that its north pole will be formed on the first side of the processing chamber and its south pole will be formed on the second side of the processing chamber. The rack is configured to be positioned between the first and second ends of the processing chamber and is configured to support a plurality of vertically spaced-apart substrates.

A substrate processing apparatus includes: a chamber that accommodates a boat; a transfer mechanism that is provided inside the chamber, and transfers a substrate; a first camera that captures an image of a support column of the boat and the substrate; a support member that is inserted through an opening formed in a wall surface of the chamber, and supports the first camera; and a driver that drives the support member in order to move the first camera between a standby position and a measurement position.

In an embodiment, a system includes: a base; and a rod set comprising multiple rods connected to the base, wherein each rod of the rod set comprises multiple fingers disposed in a vertically-stacked relationship to each other and separated respectively from each other by respective slots, wherein each slot is configured to receive a bevel of a wafer, and wherein each of the multiple fingers comprises a rounded end at a furthest extension.

A method for producing a crystal substrate includes preparing, measuring, holding, and machining. The preparing prepares a crystal substrate body including a curved crystal lattice plane. The measuring measures a shape feature of the crystal lattice plane. The holding holds the crystal substrate body in a warped state in accordance with the shape feature measured by the measuring, to more flatten the crystal lattice plane than the crystal lattice plane at the preparing. The machining machines a surface of the crystal substrate body held in the warped state, to flatten the surface.

Described herein is a technique capable of reducing the time necessary for stabilizing the inner temperature of the processing furnace. A substrate processing apparatus may include: a wafer retainer configured to support a plurality of wafers; an upright cylindrical process vessel; a seal cap configured to cover an opening at a lower end of the process vessel; a first heater configured to heat an inside of the process vessel from a lateral side thereof; an insulating unit disposed between the seal cap and the wafer retainer; and a second heater facing at least one of the plurality of wafers and configured to heat the at least one of the plurality of wafers, the second heater including: a pillar penetrating centers of the seal cap and the insulating unit; an annular member connected to and concentric with the pillar; a pair of connecting parts connecting end portions of the annular member to the pillar; and a heating element disposed inside the annular member.

A substrate stack holder and a container comprising a multiplicity of such substrate stack holders as well as a method for parting a substrate stack.

The present invention provides a quartz clip device and a manufacturing method thereof and an OLED high-temperature oven having the quartz clip device. The quartz clip device includes: a base (20), a plurality of quartz posts (30) mounted on the base (20), a quartz bottom board (40) arranged above the base (20), and a plurality of quartz plates (50) arranged above the quartz bottom board (40) and secured to the quartz posts (30). The quartz bottom board (40) includes a plurality of circular holes (42) formed therein to respectively correspond to the quartz posts (30). The circular holes (42) have a diameter that is slightly greater than a diameter of the quartz posts (30). The quartz posts (30) are received through he circular holes (42) and fastening members (60) are provided under the circular holes (42) to have the quartz bottom board (40) supported on the quartz posts (30). Slightly enlarging the diameter of the circular holes of the quartz bottom board ensures slight tipping of the quartz posts does not result in contact with the quartz bottom board so as to prevent cracking of the quartz bottom board from being caused by the contacts and affecting the production.

An embodiment relates to a loading cassette and a target substrate loading method to which same is applied. The loading cassette according to the embodiment comprises: an upper plate; a lower plate facing the upper plate while having a space therebetween; an edge support part for connecting the upper plate to the lower plate and supporting the left and right edges of a target substrate; and a rear surface support part for connecting the upper plate to the lower plate and supporting the center and the rear surface-edge of the target substrate.

A method of testing includes attaching a first and second die to first and second die sites of a lead frame and forming a plurality of wire bonds coupling a plurality of pins of the first die site to the first die and a plurality of pins of the second die site to the second die. The first and second die are encapsulated. An isolation cut is performed to isolate the plurality of pins of the first die site from the plurality of pins of the second die site, while maintaining electrical connection between the first tie bar of the first die site and the first tie bar of the second die site. The first and second die are tested while providing a first power supply source to the first and second die via the first tie bars. After testing, the dies sites are fully singulated to result in packaged IC device.

A substrate container including a casing, a rack, a casing holder, a casing lifting mechanism, a lid, and a lid holder. When holding of substrates with the rack shifts to holding of the substrates with the casing holder and the lid holder, the casing lifting mechanism moves the casing holder upward, whereby the casing holder moves the substrates upward. When the holding of the substrates with the casing holder and the lid holder shifts to the holding of the substrates with the rack, the casing lifting mechanism moves the casing holder downward, whereby the casing holder moves the substrates downward.